UFS 3.0 Embedded Flash to Support Full-Duplex 2.4GB/s Transfer Speeds

All my devices still rely on eMMC flash for storage, but premium smartphones, for example, make use of UFS 2.0/UFS 2.1 flash storage with performance similar to SSD, with Samsung UFS 2.0 storage achieving up to 850MB/s read speed, 260 MB/s write speed, and 50K/30K R/W IOPS. UFS 3.0 promises to roughly double the performance of UFS 2.0/2.1 with transfer rates of up to 2.4 GB/s, and separately, the UFS Card v2.0 standard should deliver UFS 2.1 performance on removable storage. Several Chinese and Taiwanese websites, including CTimes and Benchlife, have reported that companies have started getting UFS 3.0 & UFS Card v2.0 licenses from JEDEC, and Phison is working on a controller to support both new standards, and scheduled to launch in 2018. Premium smartphone SoC are only expect to support UFS 3.0 in 2019 and beyond, and hopefully by that time eMMC will have been replaced by UFS 2.0/2.1 […]

Embedded Linux Conference & Open Source Summit Europe 2017 Schedule

The Embedded Linux Conference & IoT summit 2017 took place in the US earlier this year in February, but there will soon be a similar event with the Embedded Linux Conference *& Open Source Summit Europe 2017 to take up in Europe on October 23 – 25 in Prague, Czech Republic, and the Linux Foundation has just published the schedule. It’s always useful to find out what is being discussed during such events, even if you are not going to attend, so I went through the different sessions, and compose my own virtual schedule with some of the ones I find the most interesting. Monday, October 23 11:15 – 11:55 – An Introduction to SPI-NOR Subsystem – Vignesh Raghavendra, Texas Instruments India Modern day embedded systems have dedicated SPI controllers to support NOR flashes. They have many hardware level features to increase the ease and efficiency of accessing SPI NOR […]

Intrinsyc Open-Q 835 Development Kit Features Qualcomm Snapdragon 835 Processor, Support Android 7 and Windows 10

Intrinsyc has just launched one of the first development boards powered by Qualcomm Snapdragon 835 processor with their Open-Q 835 devkit equipped with 4GB LPDDR4x, 128GB UFS 2.1 flash, 802.11ad WiFi, dual camera support and more. Open-Q 835 development kit is comprised of a “processor board” and a baseboard with the following specifications: Processor Board SoC – Qualcomm Snapdragon 835 (APQ8098) octa-core processor with four high performance Kryo 280 cores @ 2.20 GHz/ 2.30 GHz (single core operation), four low power Kryo cores @ 1.9 GHz, Adreno 540 GPUwith  OpenGL ES 3.2, OpenCL 2.0 Full support, and Hexagon 682 DSP with Hexagon Vector eXtensions (dual-HVX512) System Memory – 4GB LPDDR4x RAM Storage – 128GB UFS2.1 Gear3 2 lane Flash Connectivity Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 Bluetooth 5.0 + BLE WiGig60 802.11ad with on-board antenna Dimensions – 70 x 60 mm Carrier Board Display – 1x HDMI 2.0 out up to 4K Ultra […]

96Boards Compliant HiKey 960 ARM Cortex A73 Development Board is Now Available for $239

The most powerful 96boards development board – HiKey 960 – has finally been launched, and can be purchased for $239 on Aliexpress, Amazon US, Switch Sense (Japan), Seeed Studio, or All Net (Germany). HiKey 960 specifications have not changed much since we found out about the board: SoC – Kirin 960 octa-core big.LITTLE processor with 4x ARM Cortex A73 cores @ up to 2.4 GHz, 4x Cortex A53 cores @ up to 1.8 GHz, and a Mali-G71 MP8 GPU System Memory – 3GB LPDDR4 SDRAM (PoP) Storage – 32GB UFS 2.1 flash storage + micro SD card slot Video Output / Display Interface – 1 x HDMI 1.2a up to 1080p, 1x 4-lane MIPI DSI connector Connectivity – Dual band 802.11 b/g/n/ac WiFi and Bluetooth 4.1 with on-board antennas USB – 2x USB 3.0 type A host ports, 1x USB 2.0 type C OTG port Camera – 1x 4-lane MIPI […]

Samsung Galaxy S8 & S8+ Smartphones Launched with Infinity Screen, Samsung DeX Desktop Mode, Bixby Assistant

Samsung has finally launched their latest Galaxy S8 and S8+ smartphones powered by Qualcomm Snapdragon 835 or Exynos 8895 processor, 5.8″ and 6.2″ screens , and some of the most interesting features include the “infinity screen” with ultra thin bezels, Samsung DeX allowing for a desktop experience on a large monitor when the phone is docked, as well as Bixby assistant. Samsung Galaxy S8/S8+ specifications: SoC (one or the other depending on markets) Qualcomm Snapdragon 835 octa-core processor with four Kryo 280 cores @ 2.3 GHz, four Kryo 280 cores @ 1.7 Ghz;; Adreno 540 GPU; 10nm process Samsung Exynos 8895 octa-core processor with four M2+ cores @ 2.35 GHz, four Cortex A53 cores @ 1.9 GHz, ARM Mali-G71 GPU; 10nm process System Memory – 4GB LPDDR4 Storage – 64GB UFS 2.0 flash; micro SD up to 256 GB Display Galaxy S8 – 5.8” quad HD+ (2960×1440), (570ppi) Galaxy S8+ […]

HiKey 960 Development Board Powered by Hisilicon Kirin 960 Cortex A73/A53 Processor To Sell for $239

LeMaker is about to launch a successor to Hikey board with a new 96Boards compliant development board with HiKey 960 featuring the powerful Hisilicon Kirin 960 processor found in Huawei Mate 9 smartphone, as well as 3GB LPDDR4 memory, 32GB UFS storage, HDMI, USB 3.0 ports and so on. Hikey 960 board specifications: SoC – Kirin 960 octa-core big.LITTLE processor with 4x ARM Cortex A73 cores @ up to 2.4 GHz, 4x Cortex A53 cores @ up to 1.8 GHz, and a Mali-G71 MP8 GPU System Memory – 3GB LPDDR4 SDRAM Storage – 32GB UFS flash storage + micro SD card slot Video Output / Display Interface – 1 x HDMI 1.4 up to 1080p, 1x 4-lane MIPI DSI connector Connectivity – Dual band 802.11 b/g/n/ac? WiFi and Bluetooth 4.1 with two antennas USB – 2 x USB 3.0 type A host ports, 1x USB 2.0 type C OTG port […]

Samsung eMMC and UFS 2.0 embedded Flash Chips and Performance in 2016

Samsung does not always keep up its website up-to-date when it comes to its embedded flash chips, and performance metrics such as sequential read/write and random read/write values are not shown for all devices. The former is mostly important for data storage, while the latter may make a big difference for the operating systems responsiveness, and applications that rely on many short write and/or read operations. A table with the latest Samsung eMMC 5.0/5.1 and UFS 2.0 chips, and performance metrics somehow dropped in my computer. The company offers low end eMMC 5.0/5.1 flash with capacities between 4 and 16 GB with performance up to 285/40 R/W MB/s and 8K/10K R/W IOPS, mainstream chips between 32 and 128 GB delivery up to 310/140 MB/s and 14K IOPS, and all UFS 2.0 device are faster than any of the eMMC flash (limited in theory to 400 MB/s) with capacity between 16GB […]

HiSilicon Kirin 960 Octa Core Application Processor Features ARM Cortex A73 & A53 Cores, Mali G71 MP8 GPU

Following on Kirin 950 processor found in Huawei Mate 8, P9, P9 Max & Honor 8 smartphones, Hisilicon has now unveiled Kirin 960 octa-core processor with four ARM Cortex A73 cores, four Cortex A53 low power cores, a Mali G71 MP8 GPU, and an LTE Cat.12 modem. The table below from Anandtech compares features and specifications of Kirin 950 against the new Kirin 960 processor. SoC Kirin 950 Kirin 960 CPU 4x Cortex A72 (2.3 GHz) 4x Cortex A53 (1.8 GHz) 4x Cortex A73 (2.4 GHz) 4x Cortex A53 (1.8 GHz) Memory Controller LPDDR3-933 or LPDDR4-1333 (hybrid controller) LPDDR4-1800 GPU ARM Mali-T880MP4 @ 900 MHz ARM Mali-G71MP8 @ 900 MHz Interconnect ARM CCI-400 ARM CCI-550 Encode/ Decode 1080p H.264 Decode & Encode2160p30 HEVC Decode 2160p30 HEVC & H.264 Decode & Encode2160p60 HEVC Decode Camera/ISP Dual 14bit ISP 940MP/s Improved Dual 14bit ISP Sensor Hub i5 i6 Storage eMMC 5.0 UFS 2.1 Integrated Modem […]

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