Embedded development board features Microchip PolarFire RISC-V FPGA SoC

PolarFire RISC-V FPGA SoC development board

Microchip/MicroSemi first introduced PolarFire RISC-V FPGA SoC at the end of 2018, with the chip being like the RISC-V equivalent of Xilinx Zynq Ultrascale+ Arm & FPGA MPSoC. The following year, ARIES Embedded unveiled the ARIES M100PF system-on-module and evaluation board, before Microchip launched PolarFire SoC Icicle 64-bit RISC-V and FPGA development board, followed by the more compact PolarBerry SBC in 2020. There’s now at least a fourth platform based on PolarFire SoC with Aldec TySOM-M-MPFS250 embedded development board.   Aldec TySOM-M-MPFS250 specifications: SoC – Microchip PolarFire MPFS250T-FCG1152 SoC  with 4x SiFive U54 RV64GC application cores (similar to Cortex-A35 performance), 1x SiFive E51 RV64IMAC monitor core, FPGA fabric with 254K logic cells, 17.6 Mb RAM System Memory 2GB (16Gbit) 32-bit DDR4 for the FPGA 2GB (16Gbit) 36-bit RAM with ECC for the RISC-V cores (aka MSS = Microprocessor Subsystem) Storage – MicroSD card socket, eMMC flash, SPI flash, 64 Kbit […]

Digi ConnectCore 8M Mini SOM and Mini Development Kit for Industrial IoT Applications

Digi ConnectCore 8M Mini SOM

Digi International has announced the Digi ConnectCore 8M Mini System-on-Module (SOM) which is an addition to its ConnectCore family modules. We saw the Android application development kit featuring earlier Digi Wireless modules based Freescale i.MX51 (ConnectCore Wi-i.MX51) and i.MX53 (ConnectCore Wi-i.MX53) in early 2012. The new Digi ConnectCore 8M Mini comes with a built-in Video Processing Unit specialising in vision use cases. The Digi ConnectCore 8M Mini SOM is an industrial i.MX 8M Mini quad-core system-on-module that comes with Arm Cortex-A53 cores, one Cortex-M4 core, and the Cortex-M0-based Digi Microcontroller Assist. This enables optimal power consumption while simultaneous maintenance of highly efficient performance. Main benefits of Digi Connect Core 8M Mini SOM Digi SMTplus form factor (40 x 45 mm) for flexibility and reliability while designing. Power management with both hardware and software support for low-power designs. Display and camera capabilities with graphics and video hardware acceleration make it suitable […]

HaneSOM is a 4 cm2 Arm Linux module powered by Microchip SAMA5D2 SiP

HaneSOM

DAB Embedded HaneSOM is a tiny (4 cm2) system-on-module based on Microchip SAMA5D2 Arm Cortex-A5 processor running Linux, which could make it the world’s smallest Linux module. The small size is made possible by the use of a SAMA5D2 system-in-package that also integrates 128MB DDR2, and the only two other chips on the modules are a 4MB flash (GD25Q32) and the PMIC (MIC2800). HaneSOM specifications: SiP – Microchip ATSAMA5D27C-D1G system-in-package with SAMA5D27 Arm Cortex-A5 processor @ 500 MHz with NEON, 128MBytes DDR2 System Memory – 128MBytes DDR2 memory Storage – 4 MBytes of QSPI Flash Castellated holes giving access to signal for: Storage – SD card interface Display – 24-bit RGB LCD TFT interface; capacitive touch controller Camera – Up to 5MP CMOS camera sensor support Audio – SSC, I2S Networking – 10/100M Ethernet USB – USB 2.0 (OTG and host) SPI, I2C, UART, CAN-FD, 12-bit ADC, PWM Misc – […]

TQ unveils i.MX 8M Plus LGA module and evaluation single board computer

i.mx 8m plus LGA module eval kit / sbc

We’ve seen plenty of systems-on-module based on NXP i.MX 8M Plus AI processor announced at Embedded World 2021 either with edge or board-to-board connectors. TQ TQMa8MPxL is a bit different as an i.MX 8M Plus LGA (Land Grid Array) system-on-module meant to be soldered on a carrier board. The company also took the occasion to unveil STKa8MPxL evaluation kit based on TQMa8MxML in single board computer format to demonstrate its new LGA module. TQMa8MPxL i.MX 8M Plus LGA module Specifications: SoC – NXP i.MX 8M Plus “Quad 8 ML/AI”, “Quad 6 Video”, or “Quad 4 Lite” processor with four Cortex-A53 cores, one Cortex-M7 core,  Vivante GPU, video encoder/decoder, HiFi4 audio DSP, and 2.3 TOPS AI accelertor System Memory – Up to 4 GB LPDDR4 Storage – Up to 256 MB (MBytes)Quad SPI NOR flash, up to 256 GB eMMC flash, optional EEPROM up to 64 Kbit 362-pin LGA with Storage […]

SGET OSM (Open Standard Module) compliant SoM features NXP i.MX 8M Mini SoC

Open Standard Module (OSM) i.MX 8M Mini

The SGET (Standardization Group for Embedded Technologies) non-profit organization ratified another system-on-module standard last November, with the “Open Standard Module” (OSM) standard that instead of relying on edge or board-to-board connectors is meant to be soldered on the carrier board as a solder-on module LGA package. F&S Elektronik has unveiled one of the first SGET OSM complaint SoM with “FS 8MM OSM-SF” equipped with an NXP i.MX 8M Mini processor, up to 8GB DDR4, 32GB eMMC flash or 512MB NAND flash on a 30x30mm “Size-S OSM” form factor. FS 8MM OSM-SF system-on-module FS 8MM OSM-SF module specifications: SoC – NXP i.MX 8M Mini single, dual, or quad-core Arm Cortex-53 processor @ 1.8 GHz with real-time Cortex-M4 core @ 400 MHz,  Vivante 2D & 3D GPU, 1080p60 H.265, VP9, H.264, VP8 video decoder System Memory –  Up to 8GB LPDDR4 Storage – Up to max. 512MB SLC NAND flash or up […]

MYS-8MMX i.MX 8M Mini SBC runs Yocto 3.0 Linux or Ubuntu 18.04

i.MX 8M Mini SBC

MYiR Tech has just launched MYS-8MMX single board computer powered by NXP i.MX 8M Mini Cortex-A53/Cortex-A4 processor with 2GB RAM, 8GB eMMC flash, and designed for embedded applications in areas of consumer electronics, industrial automation, smart healthcare, security monitoring, etc… thanks to its video and graphics capabilities. MYS-8MMX SBC specifications: SoC  – NXP i.MX 8M Mini Quad quad-core Cortex-A53 processor @ 1.6 GHz (industrial temp.) or 1.8 GHz (commercial temp.), Arm Cortex-M4F realt-time core @ 400 MHz, Vivante 2D and 3D GPU’s, and 1080p VPU System Memory – 2GB DDR4 (supports up to 4GB) Storage – 8GB eMMC flash (supports up to 128GB), 32MB QSPI flash, MicroSD card slot, M.2 NVMe SSD support Video Output 40-pin FPC connector for LVDS & capacitive touchscreen interface 1x HDMI output up to 1080p60 Camera I/F – 24-pin FPC connector with MIPI-CSI Connectivity Gigabit Ethernet RJ45 port 2.4GHz/5GHz dual-band WiFi 5 and Bluetooth 5.0 […]

reTerminal – A Raspberry Pi CM4 based 5-inch HMI Terminal

reTerminal Raspberry Pi CM4 console

Seeed Studio has just unveiled reTerminal HMI terminal that reminds me of the company’s Wio Terminal based on Microchip SAMD51 Arm Cortex-M4F microcontroller with a 2.4-inch display. But as we’ll look into the details, reTerminal is quite a different beast as a Linux-capable device powered by a Raspberry Pi CM4 module with up to 8GB RAM, equipped with a 5-inch capacitive touchscreen display, and supporting plenty of connectivity options from GIgabit Ethernet to WiFi to LoRaWAN. reTerminal specifications: SoM – Raspberry Pi Computer Module 4 with Broadcom BCM2711 quad-core Cortex-A72 processor @ 1.5 GHz, up to 8GB RAM, up to 32GB flash Display – 5-inch capacitive touchscreen display with 1280×720 resolution Video Output – Micro HDMI port up to 4Kp60 Camera I/F – 2-lane MIPI CSI inteface Connectivity Gigabit Ethernet with optional PoE support 802.11 b/g/n/ac WiFi and Bluetooth 5.0 BLE (on Raspberry Pi CM4 module) Optional 5G, 4G LTE, […]

AMD Ryzen Embedded V2000 series on COM Express Compact (Sponsored)

conga-TCV2 AMD Ryzen Embedded V2000 COM Express

8 cores for heterogeneous edge computing Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently-launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt. congatec is offering the new Zen 2 based processor generation, which complements V1000 processor technology with 6- and 8-core versions, on COM Express Compact modules. As the trend towards more IIoT connectivity and digitization continues, embedded systems must handle a growing number of tasks. Additional tasks include the collection of application data that needs to be transcoded, and sometimes analyzed locally using artificial intelligence (AI). In parallel, data must be exchanged with customers’ enterprise clouds and other OEM apps, and this communication must be highly secure, because new pay-per-use models turn the devices, machines, and systems into an OEM revenue source that […]