SolidRun LX2162A SOM packs 16 Cortex-A72 cores, 32GB DDR4 onto a 58x48mm module

LX2162A SOM

SolidRun LX2162A SOM is a compact (58x48mm) system-on-module based on NXP LX2162A 16-core Cortex-A72 networking processor and equipped with up to 32GB DDR4 RAM that’s 25% of the size of the company’s earlier COM Express Type 7 computer-on-module based on NXP LX2160A 16-core Arm Cortex A72 communication processor and found in ClearFog CX LX2K networking board. The much smaller size has been made possible by replacing the SO-DIMM sockets with soldered RAM, and switching from LX2160A to LX2162A SoC with similar features, but offered in a 23x23mm package that is nearly one quarter the size thanks to a reduction of the number of SerDes and PCIe interfaces, and manufacturing with a 16nm FinFET process technology. LX2162A SOM specifications: SoC – NXP Layerscape LX2162A communication processor with 16x Cortex A72 cores clocked at up to 2.0 GHz (option for the 12-core LX2122A, or 8-core LX2182A) Memory – Up to 32GB DDR4 […]

Qualcomm Flight RB5 5G Platform is a high-end drone reference design with 7 cameras

Qualcomm Flight RB5 5G Platform

Leveraging its involvement in the Ingenuity Mars helicopter, Qualcomm has introduced the Qualcomm Flight RB5 5G platform, a high-end drone reference design with 5G and WIFi 6 connectivity, seven cameras up to 8K resolution, and 15 TOPS of AI performance. The platform is based on Qualcomm QRB5165 octa-core processor, a variant of Snapdragon 865 for robotics, also found in Qualcomm Robotics RB5 Platform with support for Intel RealSense D435i (that should reach end-of-life soon), and provides an upgrade to the company’s Flight Pro drone based on Qualcomm Snapdragon 820 platform. Qualcomm Flight RB5 5G Platform key features and specifications: SoC – Qualcomm QRB5165 with eight Kryo 585 cores up to 2.84 GHz, GPU Adreno 650 GPU with support for Open GL ES and OpenCL, Hexagon 698 DSP with HVX, Hexagon Tensor Accelerator, Qualcomm Spectra 480 ISP with dual 14-bit image signal processing Memory – LPDDR5 up to 2750 MHz, LPDDR4x up […]

UP Xtreme i11 Tiger Lake SBC launched for $299 and up

UP Xtreme i11 Tiger Lake-SBC with AI accelerator

Ever since the launch of Intel Atom Cherry Trail powered Up Board SBC in 2015, AAEON has kept launching more UP boards with faster, yet still low power processors, as well as complete turnkey solutions based on their x86 SBC such as the UP Xtreme Smart Surveillance kit. The company has now started taking pre-orders for the UP Xtreme i11 Tiger Lake SBC, and a UP Xtreme i11 Edge Compute Enabling kit mini PC based on the board will become available in Q3 2021. The board features a choice of Intel 11th generation Tiger Lake Embedded “GRE” Core or Celeron processors, an Intel Altera MAX V FPGA, up to 64GB RAM, Gigabit Ethernet, 2.5GbE networking, and more. UP Xtreme i11 SBC Specifications: Tiger Lake “E”/”GRE” SoC (one or the other) Intel Core i7-1185G7GRE quad-core/8-thread processor @ up to 4.4 GHz with 96 EU Intel Iris Xe Graphics; up to 28W […]

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Tiger Lake-H COM-HPC & COM Express CPU modules

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

Embedded development board features Microchip PolarFire RISC-V FPGA SoC

PolarFire RISC-V FPGA SoC development board

Microchip/MicroSemi first introduced PolarFire RISC-V FPGA SoC at the end of 2018, with the chip being like the RISC-V equivalent of Xilinx Zynq Ultrascale+ Arm & FPGA MPSoC. The following year, ARIES Embedded unveiled the ARIES M100PF system-on-module and evaluation board, before Microchip launched PolarFire SoC Icicle 64-bit RISC-V and FPGA development board, followed by the more compact PolarBerry SBC in 2020. There’s now at least a fourth platform based on PolarFire SoC with Aldec TySOM-M-MPFS250 embedded development board.   Aldec TySOM-M-MPFS250 specifications: SoC – Microchip PolarFire MPFS250T-FCG1152 SoC  with 4x SiFive U54 RV64GC application cores (similar to Cortex-A35 performance), 1x SiFive E51 RV64IMAC monitor core, FPGA fabric with 254K logic cells, 17.6 Mb RAM System Memory 2GB (16Gbit) 32-bit DDR4 for the FPGA 2GB (16Gbit) 36-bit RAM with ECC for the RISC-V cores (aka MSS = Microprocessor Subsystem) Storage – MicroSD card socket, eMMC flash, SPI flash, 64 Kbit […]

Digi ConnectCore 8M Mini SOM and Mini Development Kit for Industrial IoT Applications

Digi ConnectCore 8M Mini SOM

Digi International has announced the Digi ConnectCore 8M Mini System-on-Module (SOM) which is an addition to its ConnectCore family modules. We saw the Android application development kit featuring earlier Digi Wireless modules based Freescale i.MX51 (ConnectCore Wi-i.MX51) and i.MX53 (ConnectCore Wi-i.MX53) in early 2012. The new Digi ConnectCore 8M Mini comes with a built-in Video Processing Unit specialising in vision use cases. The Digi ConnectCore 8M Mini SOM is an industrial i.MX 8M Mini quad-core system-on-module that comes with Arm Cortex-A53 cores, one Cortex-M4 core, and the Cortex-M0-based Digi Microcontroller Assist. This enables optimal power consumption while simultaneous maintenance of highly efficient performance. Main benefits of Digi Connect Core 8M Mini SOM Digi SMTplus form factor (40 x 45 mm) for flexibility and reliability while designing. Power management with both hardware and software support for low-power designs. Display and camera capabilities with graphics and video hardware acceleration make it suitable […]

HaneSOM is a 4 cm2 Arm Linux module powered by Microchip SAMA5D2 SiP

HaneSOM

DAB Embedded HaneSOM is a tiny (4 cm2) system-on-module based on Microchip SAMA5D2 Arm Cortex-A5 processor running Linux, which could make it the world’s smallest Linux module. The small size is made possible by the use of a SAMA5D2 system-in-package that also integrates 128MB DDR2, and the only two other chips on the modules are a 4MB flash (GD25Q32) and the PMIC (MIC2800). HaneSOM specifications: SiP – Microchip ATSAMA5D27C-D1G system-in-package with SAMA5D27 Arm Cortex-A5 processor @ 500 MHz with NEON, 128MBytes DDR2 System Memory – 128MBytes DDR2 memory Storage – 4 MBytes of QSPI Flash Castellated holes giving access to signal for: Storage – SD card interface Display – 24-bit RGB LCD TFT interface; capacitive touch controller Camera – Up to 5MP CMOS camera sensor support Audio – SSC, I2S Networking – 10/100M Ethernet USB – USB 2.0 (OTG and host) SPI, I2C, UART, CAN-FD, 12-bit ADC, PWM Misc – […]

TQ unveils i.MX 8M Plus LGA module and evaluation single board computer

i.mx 8m plus LGA module eval kit / sbc

We’ve seen plenty of systems-on-module based on NXP i.MX 8M Plus AI processor announced at Embedded World 2021 either with edge or board-to-board connectors. TQ TQMa8MPxL is a bit different as an i.MX 8M Plus LGA (Land Grid Array) system-on-module meant to be soldered on a carrier board. The company also took the occasion to unveil STKa8MPxL evaluation kit based on TQMa8MxML in single board computer format to demonstrate its new LGA module. TQMa8MPxL i.MX 8M Plus LGA module Specifications: SoC – NXP i.MX 8M Plus “Quad 8 ML/AI”, “Quad 6 Video”, or “Quad 4 Lite” processor with four Cortex-A53 cores, one Cortex-M7 core,  Vivante GPU, video encoder/decoder, HiFi4 audio DSP, and 2.3 TOPS AI accelertor System Memory – Up to 4 GB LPDDR4 Storage – Up to 256 MB (MBytes)Quad SPI NOR flash, up to 256 GB eMMC flash, optional EEPROM up to 64 Kbit 362-pin LGA with Storage […]