Silicon Labs has recently announced two hardware modules based on the company’s BG22 secure Bluetooth 5.2 SoC, namely BGM220S System-in-Package (SiP) measuring just 6x6mm, and BGM220P, a slightly larger PCB variant optimized for wireless performance along with a better link budget for greater range.
Both modules can be integrated into products with up to 10-year battery life from a single coin cell. All BGM220S/P variants can support Bluetooth Direction Finding and some of the parts can also handle Bluetooth Mesh Low Power protocol.
- Wireless SoC – Silicon Labs EFR32BG22 Arm Cortex-M33 with DSP instructions and floating-point unit, up to 512 kB Flash, 32 kB RAM, 2.4 GHz radio with TX power up to 8 dBm, and Embedded Trace Macrocell (ETM) for advanced debugging
- Supported Protocols
- Bluetooth Low Energy (Bluetooth 5.2)
- Bluetooth mesh Low Power Node
- Various MCU peripherals include ADC, up to 25x GPIOs, DMS, PWM, I2C, UART, PDM (mic), etc… See EFR32BG22 specifications for details.
- Supply Voltage – 1.8 V to 3.8 V
- Current Consumption:
- 4.3 mA RX current at 1 Mbps GFSK
- 4.8 mA TX current at 0 dBm output power
- 26 μA/MHz in Active Mode (EM0)
- 1.40 μA EM2 DeepSleep current (RTCC running from LFXO, Full RAM retention)
- BGM220S SiP – 6 mm × 6 mm × 1.1 mm
- BGM220P PCB Module – 12.9 mm x 15.0 mm x 2.2 mm
- Temperature Range – -40 °C to +105 °C
- Regulatory Certifications – FCC, CE,IC/ISEDC, MIC/TELEC, KCC
Silicon Labs explains the SiP modules are ideal for device makers needing the smallest form factor pre-certified Bluetooth Low Energy with little to no RF design or engineering required, while PCB modules offer many of the same benefits as SiP modules, but at a lower cost.
The new BGM220P/S modules currently available for purchase, including on Mouser with sample price starting at $5.25, while the starter kit can be purchased directly from Silabs. Further information may be found on the product page.