Octavo Systems has collaborated with AMD Xilinx for the OSZU3 system-in-package (SiP) that combines Zynq UltraScale+ MPSoC ZU3 with up to 2GB RAM, power management circuitry, and other components into a compact (40×20.5mm) 600-ball BGA package. We’ve already written about other Octavo Systems SiPs in the past with solutions like OSD3358x (TI Sitara AM3358) and OSD32MP15x (STMicro STM32MP1), but the OSZU3 packs a much more powerful and flexible chip with the AMD Xilinx Zynq UltraScale+ MPSoC offering both Cortex-A53 & Cortex-R5F cores, Arm Mali-400 GPU, and FPGA fabric. Octavo Systems OSZU3 SiP specifications: SoC – AMD Xilinx Zynq UltraScale+ MPSoC ZU3 with CPU – 4x Arm Cortex-A53 up to 1.2GHz, 2x Arm Cortex-R5F up to 500MHz GPU – Arm Mali-400 FPGA 154K System Logic Cells 141K Flip-Flops 71K CLB LUTs 360 DSP Slices 7.6 Mb Block RAM System Memory – 2GB LPDDR4 Storage – 128MB SQPI, and 4K EEPROM (by […]
OSZU3 System-in-Package (SiP) combines AMD Xilinx Zynq UltraScale+ MPSoC with 2GB RAM, PMIC, passive components
