Linus Torvalds has just released Linux 7.1 on LKML: So it’s only Sunday morning back home, but it’s Sunday afternoon where I am right now, so I’m doing the 7.1 release at the regular time – just not in the regular timezone. This obviously means that the merge window opens tomorrow, but I’ll be in yet another timezone by then, so timing will all be a bit irregular. Normally I try to front-load the merge window and do as much as possible the first few days – this time I’m not sure that will work out with my laptop and a couple of long flights without internet, but I’ve made sure that I have fetched the early pull requests (thank you – you know who you are), so I will be able to do some of it off-line. Anyway, possible slight hiccups in the merge window aside, the news today […]
Gateworks Catalina GW9200 NXP i.MX 95 SBC features Flexible Socket Adapter sockets for M.2 or mPCIe modules
Last March, Gateworks introduced the Catalina SBC family, starting with the GW9200 board, based on NXP i.MX 95 SoC for industrial Edge AI applications, and featuring Flexible Socket Adapter (FSA) sockets to accommodate either mini PCIe or M.2 module adapters, depending on requirements. We missed the original announcement, but the new SBC family was brought to our attention when Ezurio announced the acquisition of Gateworks last week. The GW9200 board comprises a system-on-module with the NXP i.MX 95 chip, 4GB LPDDR5 and 8GB eMMC flash by default, as well as a carrier board with 10GbE and GbE RJ45 ports, a MIPI DSI/CSI display/camera interface, two FSA sockets for M.2 or mini PCIe expansion, and a range of I/Os. Ezurio/Gateworks Catalina GW9200 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 […]
Geniatech APC888 NXP i.MX 95-powered Edge AI Box PC takes M.2 AI accelerator from Hailo, MemryX, NXP, or DeepX
Geniatech APC888 Edge AI Box PC is powered by an NXP i.MX 95 Cortex-A55/M7/M33 applications processor, and features an M.2 socket for AI accelerator from Hailo, MemryX, DeepX, or Kinara (now NXP). The system comes with 4GB LPDDR5 and 32GB eMMC flash by default, features two Gigabit Ethernet ports, optional WiFi, Bluetooth, cellular, and GNSS connectivity, and two USB 3.0 ports. It’s available in commercial and industrial temperature grades. Geniatech APC888 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, OpenCL 3.0 VPU 1080p60/4Kp30 H.265 and H.264 encode and decode JPEG Encoder, JPEG Decoder Decoding – […]
Toradex Zinnia Linux IoT Gateway offers dual GbE, WiFi 5, 4G LTE, I/Os, and simplified software deployment
Toradex Zinnia is an industrial IoT gateway based on the company’s Verdin system-on-module, powered by a choice of NXP or Texas Instruments SoC, with dual Gigabit Ethernet, WiFi 5, Bluetooth 5, optional 4G LTE or 5G connectivity, a few USB ports, an I/O connectors, and a wide 9-36V power supply range. The first model is based on an NXP i.M 8M Plus SoM with 4GB LPDDR5 and 32GB eMMC flash preloaded with the company’s Torizon OS Linux distribution. Other SoM available are based on TI AM62/AM62P, NXP i.MX 8M Mini, or NXP iMX 95. The gateway targets edge AI and industrial automation, smart cities, and energy infrastructure. Toradex Zinnia specifications: SoC – NXP i.MX 8M Plus CPU – Quad-core Cortex-A53 processor @ 1.6/1.8 GHz, Arm Cortex-M7 real-time core @ 800 MHz GPU – Vivante GC7000UL OpenGL ES 1.1, 2.0, 3.0, OpenCL 1.2, Vulkan support AI accelerator – 2.3 TOPS NPU […]
Forlinx UP4 – A 40×40 mm LCC + LGA system-on-module family with Rockchip, NXP, and Allwinner CPU options
Forlinx Embedded UP4 is a new family of pin-to-pin compatible system-on-modules currently offered with Rockchip RK3568J/RK3562J, NXP i.MX 9352, or Allwinner T527N/T536 processors. The UP4 modules measure just 40×40 mm and expose 487 pins through a hybrid LCC (Leadless Chip Carrier) and LGA (Land Grid Array) design with 1.0mm contact pitch and 1.27mm ball pitch, respectively. This should allow companies to design a single carrier board for multiple CPU variants. Forlinx UP4 specifications: SoC FET-MX9352-UP4 – NXP i.MX 9352 with 2x Arm Cortex-A55 cores @ up to 1.7 GHz, Cortex-M33 real-time core @ 250 MHz, 2D GPU only, 0.5 TOPS Arm Ethos U65 microNPU FET3568-UP4 – Rockchip RK3568B2/J with 4x Arm Cortex-A55 cores @ up to 2.0/1.8 GHz, Arm Mali-G52 MP2 3D GPU, 1 TOPS AI NPU FET3562J-UP4 – Rockchip RK3562J with 4x Arm Cortex-A53 cores @ 1.8 GHz, Arm Mali-G52-2EE 3D GPU, 1 TOPS NPU FET527N-UP4 – Allwinner T527N […]
Linux 7.0 Release – Main changes, Arm, RISC-V, and MIPS architectures
Linus Torvalds has just released Linux 7.0 on LKML: The last week of the release continued the same “lots of small fixes” trend, but it all really does seem pretty benign, so I’ve tagged the final 7.0 and pushed it out. I suspect it’s a lot of AI tool use that will keep finding corner cases for us for a while, so this may be the “new normal” at least for a while. Only time will tell. Anyway, this last week was a little bit of everything: networking (core and drivers), arch fixes, tooling and selftests, and various random fixes all over the place. Let’s keep testing, and obviously tomorrow the merge window for 7.1 opens. I already have four dozen pull requests pending – thank you to all the early people. Linus This follows the Linux 6.19 release about two months ago, which brought us PCIe link encryption and […]
Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs
Toradex has launched two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, powered by NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications. The OSM iMX91 and OSM iMX93 variants comply with the OSM Size-S standard, featuring a 332-ball contact grid designed to be soldered to the carrier board. The Lino is a proprietary format that keeps the OSM Size-S dimensions but features two board-to-board (B2B) connectors offering more flexibility for potential replacement or future upgrades. Toradex Lino iMX91/iMX93 system-on-module Toradex Lino specifications: SoC (one or the other) NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, and color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Security – EdgeLock Secure Enclave NXP i.MX 91 CPU – Single-core Arm Cortex-A55 […]
NXP i.MX 937 cost-effective Cortex-A55/M7/M33 MPU is a drop-in replacement for NXP i.MX 95 SoC family
The 1 .4 GHz NXP i.MX 937 quad-core Cortex-A55 microprocessor (MPU) for HMI and Edge AI applications aims to fill the gap between entry-level NXP i.MX 93 SoCs and higher-end parts like the NXP i.MX 952 processor family, while offering pin-to-pin compatibility with the latter. The i.MX 937 MPU also features a dedicated 667 MHz Arm Cortex -M7 for real-time workloads and a low-power Arm Cortex-M33 core for system management tasks, supports LPDDR4x or LPDDR5 memory, integrates an Arm Mali G310 3D GPU, a VPU for 1080p H.26x video encoding and decoding, and a 2 eTOPS NXP eIQ Neutron NPU for machine learning (ML) acceleration. Since it targets HMI applications, we’ll also find MIPI DSI and LVDS display interfaces, and a 4-lane MIPI CSI camera interface, plus various other I/Os. NXP i.MX 937 specifications: (highlights in bold compared to other i.MX 93 parts) CPU Up to 4x Arm Cortex-A55 cores […]









