Year 2022 in review – Top 10 posts and statistics

CNX Software Happy New Year 2023

It’s the last day of the year and the time to look at some of the highlights of 2022, some traffic statistics from CNX Software website, and speculate on what 2023 may bring us. The semiconductors shortage continued in 2022, but things are looking brighter in 2023 with the full reopening of the world mixed with forecasts of difficult economic times that should keep the demand/supply equation in check. On the Arm processor front the biggest news of the year, at least in this corner of the Internet, was the launch of the Rockchip RK3588 octa-core Cortex-A76/A55 processor together with interesting single board computers that we’ll discuss below. Announced last year, the Amlogic A311D2 octa-core Cortex-A73/A53 was finally made available in a few SBC’s, and we finally got some news about the Amlogic S928X Cortex-A76/A55 SoC showcased in 8K TV boxes, but we have yet to see it in action. […]

Lattice Avant mid-range FPGA platform features up to 500K logic cells, 25 Gbps SERDES, Hard PCIe Gen4

Lattice Avant

Lattice Avant is a new low-power and small form factor mid-range FPGA platform, manufactured with a 16nm FinFET process, and equipped with 25 Gb/s SERDES, hardened PCI Express, external memory PHY interfaces, a high DSP count, and a security engine. Lattice Semi is better known for its entry-level FPGAs such as the iCE40 which is popular in the community thanks to low-cost hardware and support for open-source tools, but the Avant platform marks the company’s entry into the mid-range FPGA market, defined by chips with 100k to 500k logic cells (LCs). Lattice Avant highlights: FPGA fabric – 200K to 500K logic cells up to 350 MHz DSP – 700 to 1,8000 18×18 multipliers @ up to 650 MHz to support the latest AI algorithms Memory 14-36 Mbit embedded memory up to 650 MHz DDR3L/DDR4/LPDDR4 and DDR5 support I/Os 4x to 28x 25 Gbps multi-protocol SERDES Hard PCIe Gen4 200 to […]

UP Xtreme i12 Alder Lake SBC supports up to four 4K displays @ 60 Hz, Raspberry Pi HATs

UP Xtreme i12 Alder Lake SBC

AAEON has just introduced the UP Xtreme i12 single board computer (SBC) with Intel 12th generation Alder Lake-P hybrid SoC with up to 12 cores/16 threads, up to 32GB LPDDR5 memory, support for four 4Kp60 displays, and equipped with high-speed interfaces such as USB 4.0 and 2.5 GbE. The board also features four M.2 sockets for NVMe storage, Wi-Fi 6 and 5G cellular connectivity, a SATA III port, several USB 3.2/2.0 Type-A ports, and a 40-pin GPIO header and mounting thread for Raspberry Pi HATs, which should make it especially suitable for IoT, robotics, and smart retail applications, as well as smart manufacturing with a 12 to 36V wide supply voltage range. UP Xtreme i12 specifications: Alder Lake-P SoC (One or the other) Intel Core i7-1270PE 12-core/16-thread processor @ 3.30GHz / 4.50GHz (Turbo) with 96EU Intel Xe graphics – PBP: 28W, up to 64W MTP Intel Core i5-1250PE 12-core/16-thread processor […]

DFI EC70A-TGU embedded computer promises long-term support until 2035 (at least)

DFI EC70A-TGU embedded computer

Some industries require long-term support of hardware, and DFI’s EC70A-TGU rugged embedded computer could fit the bill as the Tiger Lake IOTG processor used in this model has a 15-Year CPU life cycle guaranteeing availability until Q3 2035. The fanless computer is equipped with 8GB RAM, supports M.2 NVMe SSD storage, also well M.2 expansion slots for 5G modules, features HDMI and VGA video output, four serial DB3 ports, and offers up to four Ethernet ports and up to six USB ports through three SKUs with a different number of USB and Ethernet ports. DFI EC70A-TGU specifications: Tiger Lake UP3 “IoTG” SoC (one or the other) @ 1.5GHz to 4.4GHz depending on SKU Embedded Intel Core i7-1185G7E quad-core processor with Iris Xe graphics; TDP: 28W Intel Core i5-1145G7E quad-core processor with Iris Xe graphics; TDP: 28W Intel Core i3-1115G4E dual-core processor with Intel UHD graphics; TDP: 28W Industrial-grade Intel Core […]

Sony ALT1350 5G cellular IoT chip supports NTN connectivity, integrates sub-GHz and 2.4GHz radios

Sony ALT1350 5G IoT 802.15.4 chip

Sony ALT1350 is a new ultra-low-power 5G LPWA LTE-M/NB-IoT chip that supports Non-Terrestrial Networks (NTN) for satellite connectivity and also integrates sub-GHz and 2.4 GHz radios for short-range communication and improved efficiency. The chip is comprised of an Arm Cortex-M4 microcontroller core as well as an Arm Cortex-M0+ always-on core for sensors and will be upgradable to 3GPP Release 17 to support higher bitrates for Cat-M1 (eMTC) and Cat-NB2 (NB-IoT). It also implements GNSS, cellular and wifi-based location, supports AI acceleration, and embeds a secure element for secure communication. Sony ALT1350 specifications: MCU cores Arm cortex-M4 with 1MB NVRAM and 752KB RAM Arm Cortex-M0+ low power always-on sensing hub Memory & Storage I/F – Quad SPI flash and PSRAM Wireless Cellular 3GPP Release 15, future proof to support 3GPP up to 17 through SW upgrade CAT-M1: Up to 588 Kbps in DL, and 1119 Kbps in uplink (up to 1.2mbps […]

Radxa E25 modular 2.5GbE router supports WiFi 6 and 4G/5G cellular connectivity

Radxa E25 router

Radxa E25 is a modular router with two 2.5GbE ports based on the Radxa CM3 Industrial (CM3I) system-on-module equipped with a Rockchip RK3568 quad-core Cortex-A55 processor, and optional support for WiFi 6 and 4G or 5G cellular connectivity. I got an early sample of the Radxa E25 carrier board in January, but the company has now refined the design with version 1.4 of the board and will launch the Radxa E25 as a complete router with an enclosure similar to NanoPi R5S and LinkStar H68K we’ve covered previously. Radxa E25 specifications: SoM – Radxa CM3I with Rockchip RK3568 quad-core Cortex-A55 processor @ 2.0 GHz with Arm Mali-G52, up to 8GB RAM, up to 128GB eMMC flash (250MB/s max), optional WiFi and Bluetooth Storage – MicroSD card socket, M.2 SATA 2242 SSD (multiplexed with 4G) Networking 2x 2.5GbE ports via Realtek RTL8125B 2.5 Gbps Ethernet transceiver (Tested by Radxa at 2.2 […]

MediaTek unveils Dimensity 9200 Octa-core Cortex-X3/A710/A510 5G mobile processor

MediaTek Dimensity 9200

MediaTek has just launched the Dimensity 9200 octa-core flagship 5G mobile processor with one Cortex-X3 core, two Cortex-A710 cores, and four Cortex-A510 cores, as well as the latest Arm Immortalis-G715 GPU. Manufactured for a TSMC 4nm processor for efficiency, the new flagship processor supports mmWave 5G and sub-6GHz cellular connectivity, LPDDR5x 8,533 Mbps memory, UFS 4.0 storage, and embeds a faster MediaTek APU 690 AI processor   MediaTek Dimensity 9200 specifications: Octa-core CPU subsystem 1x Arm Cortex-X3 core at up to 3.05 GHz 3x Arm Cortex-A710 cores at up to 2.85 GHz 4x Arm Cortex-A510 cores up to 1.80GHz 8MB L3 cache 6MB system cache GPU – Arm Immortalis-G715 with support for Vulkan 1.3, hardware-based ray tracing engine AI Accelerator – MediaTek APU 690 AI processor with MDLA (MediaTek Deep Learning Accelerator), MVPU (MediaTek Vision Processing Unit), SME (I don’t know what that is), and DMA Memory I/F – LPDRR5x 8,533 […]

Andes unveils AndesCore AX65 Out-of-Order RISC-V core for compute intensive applications

AndesCore AX60

Andes Technology has unveiled the high-end AndesCore AX60 series out-of-order 64-bit RISC-V processors at the Linley Fall Processor Conference 2022 with the new cores designed for compute-intensive applications such as advanced driver-assistance systems (ADAS), artificial intelligence, augmented/virtual reality, datacenter accelerators, 5G infrastructure, high-speed networking, and enterprise storage. AndesCore AX65 is the first member of the family and supports RISC-V scalar cryptography extension and bit manipulation extension. It is a 4-way superscalar core with Out-of-Order (OoO) execution in a 13-stage pipeline and can fetch 4 to 8 instructions per cycle. The company further explains the AX65 core then decodes, renames, and dispatches up to 4 instructions into 8 execution units, including 4 integer units, 2 full load/store units, and 2 floating-point units. The AX65’s memory subsystem also includes split 2-level TLBs (translation lookaside buffers) with up to 64 outstanding load/store instructions. Up to eight AX65 cores (or should that then be […]

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