artificial intelligence News - Page 42 of 100 - CNX Software

January 18, 2022 by Jean-Luc Aufranc (CNXSoft) - 12 Comments

Samsung Exynos 2200 SoC features Xclipse 920 GPU with AMD RDNA 2 architecture

Samsung has just unveiled the Exynos 2200 Armv9 SoC equipped with Samsung Xplipse 920 GPU based on AMD RDNA architecture and promising console quality graphics on mobile devices. Manufactured with a 4nm process, the octa-core processor also features Arm Cortex-X2, Cortex-A710, and Cortex-A510 cores, a 5G modem for up to 7.35 Gbps downlink, 8K video encoding and decoding, as well as support for LPDDR5 memory and UFS 3.1 storage. Exynos 2200 specifications: CPU 1x Arm Cortex-X2 3x Arm Cortex-A710 4x Arm Cortex-A510 GPU – Samsung Xclipse 920 GPU built with AMD RDNA 2 technology enabling hardware-accelerated ray tracing (RT) and variable rate shading (VRS), a first on mobile according to Samsung VPU Video decode – 8Kp60 10-bit HEVC (H.265), 8Kp30 10-bit VP9, AV1 Video encode – 8Kp30 10-bit HEVC(H.265), VP9 AI – AI Engine with Dual-core NPU and DSP up to 52 TOPS (TBC) Memory – LPDDR5 Storage – UFS […]

January 14, 2022 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

OnLogic unveils Karbon 800 Series Alder Lake-S embedded computers

OnLogic Karbon 800 Alder Lake-S embedded computer

We’ve already seen the newly announced Intel Alder Lake-S desktop IoT processors in some COM Express and COM HPC modules, and quickly mentioned Vecow ECX-3000 rugged computer, and now, OnLogic has just announced the Karbon 800 Series, a family of Alder Lake-S embedded computers. There will be four Karbon 800 models at launch, equipped with up to an Intel Core i9 16-core processor, 64 GB of DDR4 ECC or non-ECC memory, as well as single and dual PCIe Gen 4 slots, and optional “ModBay” hot-swappable bays to add connectivity and storage option up to a six 2.5-inch SSD RAID array or 14 Ethernet ports. All four Karbon 800 embedded computer supports the same processor and memory options, and mostly differ in their storage and expansion options: Karbon 801 Storage – Support for NVME Storage Expansion – 4G Cellular, Wi-Fi, Bluetooth Karbon 802 Storage – 2x 2.5-inch SSD with optional Hot […]

January 9, 2022 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

Reolink Go Plus 4G review – Part 2: A Solar-powered 4G LTE security camera with person & vehicle detection

Last month, I received Reolink Go Plus 4G smart security camera with 4G LTE connectivity, vehicle/human detection support, and powered by a solar panel. In the first part of the review, I did an unboxing, added the camera to the Reolink Android app, and confirmed it worked with my DTAC SIM card. I’ve now installed the camera and had time to test more of its features, so I can report my experience with the security camera. Reolink Go Plus 4G camera and solar panel installation I wanted to use the camera near the gate that’s outside of (reliable) WiFi range. So I found a piece of hardwood to which I attached the mounts of the camera and solar panel… … and attached it to the wall. My current installation works for testing, but it’s not the most secure as the camera is quite visible and only placed a little over […]

January 7, 2022 by Sponsored Post - No Comments

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

January 7, 2022January 25, 2022 by Jean-Luc Aufranc (CNXSoft) - 6 Comments

Horizon X3 AI development board is powered by Sunrise 3 AI Edge Arm processor

Horizon X3 AI development board is powered by Horizon Robotics Sunrise 3 (aka X3) quad-core Cortex-A53 processor with a 5 TOPS NPU, and multiple camera support with the chip apparently designed for the automotive industry. [Update January 25, 2022: A third-party company, Finsbury Glover Hering, claiming to represent Horizon Robotics informed CNX Software the chip is not designed for the automotive market, and that Horizon’s AIoT business is actually limited to the domestic China market and not overseas.] The devkit is comprised of a Sunrise 3 system-on-module with 1GB LPDDR4 & 16GB EMMC memory, as well as a baseboard with Gigabit Ethernet and WiFi, HDMI up to 1080p60 and MIPI DSI interface, a camera interface, and a 40-pin header for expansion. Horizon X3 AI development board specifications: SoC – Horizon Robotics Sunrise 3 quad-core Cortex-A53 processor @ 1.2 GHz, one Cortex-R5 core, a 5 TOPS NPU (2x “Bernoulli” BPU) System […]

January 5, 2022January 7, 2022 by Jean-Luc Aufranc (CNXSoft) - 8 Comments

Intel Mobileye EyeQ Ultra RISC-V processor targets Level 4 autonomous driving

Let’s carry on with Intel’s CES 2022 news, but with a twist as Mobileye EyeQ Ultra does not include any x86 cores, but instead, the automotive processor features 12 RISC-V cores, Arm GPU and DSP, and aims to bring Level 4 autonomous driving to cars thanks notably to a 176 TOPS AI accelerator. The company says EyeQ Ultra packs the performance of 10 EyeQ5s in a single package, with the single chip solution avoiding the power consumption and costs related to integrating multiple SoCs together. Intel Mobileye EyeQ Ultra specifications highlights: CPU – 12 RISC-V CPU cores (24 threads) GPU – Unnamed Arm GPU DSP – Unnamed Arm DSP SIMD cores VLIW cores Coarse grained reconfigurable array (CGRA) cores CNN accelerator clusters Two sensing subsystems One camera-only system Radar and Lidar combined system 5-nanometer process technology Mobileye provides both the chip and software with for instance high-definition map and […]

December 31, 2021 by Jean-Luc Aufranc (CNXSoft) - No Comments

COM Express Type 10 Tiger Lake UP3 module targets embedded mobile applications

AAEON NanoCOM-TGU is a COM Express Type 10 module powered by the 11th generation Intel Tiger Lake UP3 designed for embedded mobile applications, potentially leveraging AI and Deep Learning acceleration engines from the processor with use cases ranging from telematics, Smart Cities, and industrial automation. The NanoCOM-TGU supports up to 16GB LPDDR4x memory with in-band ECC, up to 256GB PCIe NVMe SSD, and offers two SATA 3.0 interfaces, 2.5GbE networking, DDI and eDP video outputs, as well as ten USB ports and four PCI Express x1 interfaces. NanoCOM-TGU specifications: SoC – Intel Tiger Lake UP3 “E” or “GRE” processor with Intel UHD Graphics from Celeron 6305E up to Core i7-1185G7E/1185GRE @ 1.8 GHz /4.4 GHz; 15W TDP System Memory – Up to 16GB onboard LPDDR4x-4266 memory in-band ECC supported by SoC Storage – Up to 256GB onboard NVMe SSD Networking – Intel i225-LM 2.5GbE controller COM Express Type 10 […]

December 22, 2021December 23, 2021 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

MYIR introduces i.MX 8M Plus module and devkit with AI/ML capabilities

There are already plenty of i.MX 8M Plus systems-on-module, but here’s one more courtesy of MYIR Tech with MYC-JX8MPQ i.MX 8M Plus module with as well as MYD-JX8MPQ development board for evaluating the solution. The module is especially well suited to applications leveraging Artificial Intelligence (AI) and Machine Learning (ML) with the NXP Cortex-A53/M7 integrating a 2.3 TOPS Neural Processing Unit (NPU). The module comes with up to 6GB LPDDR4, 128GB eMMC flash, 32MB QSPI flash, a PMIC for power management, as well as a 314-pin MXM 3.0 connector exposing the I/Os from the processor. MYC-JX8MPQ module specifications: SoC – NXP i.MX 8M Plus (MIMX8ML8CVNKZAB) quad-core Cortex-A53 processor @ 1.6 GHz, real-time Arm Cortex-M7 co-processor @ 800 MHz, 2.3 TOPS AI accelerator, 2D/3D GPU, HiFi4 Audio DSP, and 1080p VPU System Memory – 3GB LPDDR4 (option up to 6GB) Storage – 8GB eMMC flash (option up to 128GB), 32MB QSPI […]