automotive News - Page 4 of 40 - CNX Software

February 25, 2026February 25, 2026 by Debashis Das - No Comments

NXP TJA1410 and TJF1410 PMD transceivers enable “CAN-like” Single Pair Ethernet (SPE) connectivity

We’ve reported on 10BASE-T1S and 10BASE-T1L Single Pair Ethernet (SPE) chips from Microchip and Analog Devices in the past, which support Ethernet communication over a single twisted-pair cable. But those chips integrate a full Ethernet PHY or MAC-PHY inside the device. NXP takes a different approach with their TJA1410 (automotive) and TJF1410 (industrial) Physical Medium Dependent (PMD) transceivers. These new PMDs separate the analog physical layer from the digital Ethernet logic. By integrating the digital portion of the PHY into the host microcontroller or switch, the TJA1410 and TJF1410 only need to handle the essential analog functions for transmitting and receiving signals over the physical medium. They communicate with the host via a 3-pin OPEN Alliance (OA) interface. TJA1410 and TJF1410 PMD transceivers specifications: Networking – 10BASE-T1S (Compliant with IEEE 802.3cg and OPEN Alliance TC14,TC10 specifications) Host Interface – 3-pin OA interface (requires host MCU/switch with a 10BASE-T1S digital PHY) […]

February 23, 2026February 23, 2026 by Debashis Das - No Comments

AMD VEK385 Versal AI Edge Gen 2 FPGA evaluation kit plugs directly into a PCIe Gen5/Gen4 slot

VEK385 Evaluation Kit with AMD Versal AI Edge Series Gen 2 XC2VE3858 adaptive SoC

AMD has introduced the VEK385 Evaluation Kit built around the Versal AI Edge Gen 2 XC2VE3858 SoC FPGA, which combines eight Cortex-A78AE cores, ten Cortex-R52 cores, FPGA fabric with 543,104 LUTs, 144 AI Engine-ML v2 tiles (up to 184 INT8 TOPS), 2,064 DSPs, a Mali-G78AE GPU, and an integrated ISP. The kit features 20 GB of LPDDR5X memory, a PCIe x8 edge connector supporting Gen5 x4 and Gen3/4 x8, and two HDMI 2.1 RX/TX ports for video. There is also an SFP28 port for 25–100 Gb/s Ethernet, and CAN-FD alongside PL/PS Ethernet for deterministic control applications. The board is designed to accelerate prototyping for automotive (ADAS, autonomous driving), industrial (AMR, edge AI boxes), healthcare (ultrasound, endoscopy, 3D imaging), and aerospace-grade systems. VEK385 Evaluation Kit specifications Adaptive SoC – AMD Versal AI Edge Series Gen 2 XC2VE3858-2MSESSVA2112 heterogeneous adaptive SoC CPU – 8x Arm Cortex-A78AE application cores Real-time – 10x Arm Cortex-R52 […]

February 20, 2026February 20, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

MediaTek Genio 360/360P hexa/octa-core Cortex-A76/A55 AIoT SoC features 8 TOPS NPU for cost-sensitive embedded applications

MediaTek Genio 360 and Genio 360P are respectively hexa-core and octa-core Arm Cortex-A76/A55 AIoT processors featuring a MediaTek NPU delivering up to 8 TOPS of AI performance, and designed for cost-sensitive embedded applications. The chips support up to 8GB of memory and eMMC 5.1, SPI NOR, and SD 3.0 storage interfaces. They feature two 4-lane MIPI DSI and one 4-lane DP/eDP interfaces for single or dual display setups, two 4-lane MIPI CSI camera interfaces, audio inputs/outputs, Gigabit Ethernet with TSN, optional WiFi 5 and Bluetooth 5.3 via MT6631N, USB 3.1 and USB 2.0 interfaces, PCIe Gen2 x1, and low-speed interfaces. MediaTek Genio 360/360P specifications: CPU MediaTek Genio 360 (MT8366) – Hexa-core processor 1x Arm Cortex-A76 core clocked at up to 1.9 GHz (industrial) / 2.0GHz (commercial) 5x Arm Cortex-A55 cores clocked at up to 1.7 GHz (industrial) / 2.0GHz (commercial) MediaTek Genio 360P (MT8367) – Octa-core processor 2x Arm Cortex-A76 […]

February 18, 2026February 21, 2026 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

NXP S32N79 octa-core Arm Cortex-A78E/12-core Cortex-R52 “Super-Integration Processor” targets Software-Defined Vehicles (SDV)

NXP recently introduced the S32N79 “Super-Integration” automotive processor, part of the S32N7 series, equipped with up to eight Arm Cortex-A78E application cores and twelve Arm Cortex-R52 cores for real-time processing. Building on the earlier 5 nm S32N55 16-core Cortex-R52 + 2x Lockstep Cortex-M7 automotive processor, the S32N79 automotive processor is still designed for software-defined vehicles (SDV), but its Cortex-A78E applications cores further enable features such as ADAS sensor fusion and data AI services, as well as improved vehicle gateway/processing functions. NXP S32N79 key features and specifications: CPU Up to 8x split-lock Arm Cortex-A78AE cores operating at up to 1.8 GHz Up to 12x split-lock Arm Cortex-R52 cores operating at up to 1.4 GHz RISC-V-based accelerator for networking, math, and data-intensive workloads AI accelerator – eIQ Neutron neural processing unit (NPU) for vehicle core NeuroNetwork offload Memory Up to 2x LPDDR4X/5/5X DRAM interfaces Up to 36 MB platform SRAM Storage 2x […]

February 13, 2026February 13, 2026 by Debashis Das - 5 Comments

STMicroelectronics Stellar P3E quad-core Arm Cortex-R52+ automotive MCU features Neural-ART AI accelerator

Stellar P3E AI automotive MCU Block Diagram

STMicroelectronics has introduced the Stellar P3E, the first automotive MCU with an embedded Neural-ART AI accelerator, designed to simplify X-in-1 Electronic Control Units (ECUs) by consolidating powertrain functions like the inverter, on-board charger (OBC), and DC-DC converter into a single module. The MCU enables smart sensing, predictive maintenance, and virtual sensor applications without the cost and complexity of a separate SoC. The microcontroller features four 500 MHz Arm Cortex-R52+ cores with 19.5 MB of xMemory, which is based on phase-change memory (PCM), offering roughly twice the density of embedded flash. The chip integrates multiple ADC channels for precise sensing, high-resolution PWM down to 102 ps for fine motor control, and 10 timer modules for deterministic real-time operation. Connectivity options include Gigabit Ethernet and CAN-XL, for high-speed, low-latency in-vehicle communication. Stellar P3E (SR6P3EC4/SR6P3EC6) specifications: MCU – SR6P3EC4 / SR6P3EC6 CPU Cores – 4x Arm Cortex‑R52+ cores at up to 500 MHz; […]

February 10, 2026February 11, 2026 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

TOPST D3-G maker SBC is powered by Telechips TCT8050 “Dolphin3” Cortex-A72/A53/R5 automotive-grade SoC

TOPST D3-G is a single board computer (SBC) powered by a Telechips TCT8050 “Dolphin3/3M” 9-core automotive-grade SoC with four Cortex-A72 cores, four Cortex-A53 cores, and one real-time Cortex-R5 core. The board features 4GB or 8GB LPDDR4 RAM, 32GB eMMC flash and a microSD card for storage, a Gigabit Ethernet port, a DisplayPort 1.2 connector capable of driving four display through MST, two MIPI CSI connectors, a PCIe Gen3x 1 slot, a few USB ports, a 40-pin GPIO header compatible with Raspberry Pi HAT+, and three CAN Bus interfaces. TOPST D3-G specifications: SoC – Telechips TCC8050 (Dolphin3) CPU(45,180 DMIPS) Quad-core Arm Cortex-A72 @ 1.69 GHz, 31,840 DMIPS Quad-core Arm Cortex-A53 @1.45 GHz, 13,340 DMIPS Real-time MCU core – Arm Cortex-R5 @ 600 MHz GPU – Imagination Technologies PowerVR 9XTP (GT9524) delivering up to 168 GFLOPS; Supported APIs: OpenGL ES 1.1 / 2.0 / 3.2, Vulkan 1.2, OpenCL 2.0 / 3.0 System […]

February 10, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Black Sesame Technologies Wudang C1200 “cross-domain” automotive SoCs feature up to 10x Cortex-A78AE cores

I found two interesting automotive SoCs in the Linux 6.19 changelog: Renesas R-Car X5H 16-/32-core Cortex-A720AE SoC and Black Sesame Technologies’ “Wudang” C1200 8-/10-core Cortex-A78AE processor family. While announced in 2024, there’s still no product page for the Renesas chip. So today, I’ll focus on the Wudang C1200 family. They are designed to be automotive-grade “cross-domain computing platforms” capable of handling multiple functions such as in-cabin sensing systems (e.g., driver attention monitoring), infotainment, auto-parking systems, safety information, autonomous driving, and more. Wudang C1296 10-core SoC Wudang C1296 specifications: CPU 10x Arm Cortex-A78AE automotive-grade cores Dual-Core Lockstep (DCLS) supported, ASIL-D compliance Up to 32K DMIPS (or 16K DMIPS in DCLS) GPU – Automotive-grade Arm Mali-G78AE GPU; DCLS supported, ASIL-D compliance NPU – DynamAl NN Engine Hybrid precision 4-bit/8-bit MAC array Overall 80% utilization of convolution layers MAC Array Sparse support for storage and acceleration INT8/INT16, FP16 GEMM and nonlinear functions acceleration […]

January 30, 2026January 31, 2026 by Jean-Luc Aufranc (CNXSoft) - 10 Comments

Microchip PIC32CM PL10 Cortex-M0+ microcontrollers are pin-to-pin compatible with AVR MCUs, support 5V operation

Microchip has added the PIC32CM PL10 MCUs to its PIC32C Arm Cortex-M0+ microcontroller family. Pin-to-pin compatible with AVR MCUs, the new PL10 MCUs feature a range of Core Independent Peripherals (CIPs), 5V operation, and functional safety (FuSa) compliance. The microcontrollers notably integrate a 12-bit ADC with strong noise immunity, a Peripheral Touch Controller (PTC) for responsive touch applications, and two serial communication interfaces with USART, I2C, and/or SPI support. Target applications include industrial control, building automation, consumer appliances, power tools, and sensor-based systems. Microchip PIC32CM PL10 specifications: MCU core – Arm Cortex-M0+ core up to 24 MHz Memory – Up to 16 KB SRAM (8 KB in current datasheet) Storage – Up to 128 KB Flash (64 KB in current datasheet) I/Os and peripherals Up to 55x programmable I/O pins Up to 16x external interrupts Multi-Voltage I/Os (MVIO), removing the need for external level shifters Peripheral Touch Controller (PTC) with […]