While we are eagerly waiting for the RK3668 and RK3688 high-end processors, Rockchip is planning to launch two mid-range SoCs with the RK3538 quad-core Cortex-A55 processor designed for TV boxes, and the RK3572 hexa-core Cortex-A73/A53 SoC for HMI (Human Machine Interface) applications. Rockchip RK3538 TV box SoC Rockchip RK3538 specifications: CPU – Quad-core Arm Cortex-A55 processor with NEON, FPU, ARMv8 Crypto… Cache 32KB L1 instruction cache 32KB L1 data cache and 64KB L2 data cache 512KB unified system L3 cache GPU Arm Mali-G310 3D GPU with support for OpenCL 3.0, OpenGL ES1.1/2.0/3.2, Vulkan 1.2 2D Graphics Engine VPU Decoder H.265, H.264, AV1 (up to two simultaneous 1080p60 channels) VP8, VC1, MPEG-4, MPEG-2, MPEG-1 yp to 1920×1088 @ 60 FPS (1088 is not a typo) H.263 up to 720p60 (M)JPEG up to 8176×8176 @ 76 million pixels per second Encoder – N/A MCU core – RISC-V MCU in PMU domain with […]
MediaTek unveils 50 TOPS Genio Pro 5100 Cortex-X925/X4/A720 SoC, 7.2 TOPS Genio 420 Cortex-A78/A55 SoC for AIoT applications
After launching the Genio 360/360P hexa/octa-core SoCs last month, MediaTek has now expanded the lineup with the Genio Pro 5100 and Genio 420 AIoT SoCs at Embedded World 2026. The Genio Pro 5100 is a 3nm SoC with an “all big-core” architecture and a 50+ TOPS NPU for Edge AI applications. The Genio 420, on the other hand, is a cost-efficient 6nm platform designed for smart home, retail, and industrial IoT devices. MediaTek Genio Pro 5100 The Genio Pro 5100 integrates one Cortex-X925, three Cortex-X4, and four Cortex-A720 cores, as well as an Arm Immortalis-G925 GPU, and supports LPDDR5X memory up to 8533 Mbps. It can handle up to three 4K displays, up to 16 cameras via virtual channels, and 8K30 video encode/decode, and offers interfaces such as PCIe Gen4, USB 3.2 Gen2, USB 2.0, and dual 2.5GbE MAC. Genio Pro 5100 (MT8894) specifications: CPU – 8-core Arm v9.2 processor […]
NXP i.MX 937 cost-effective Cortex-A55/M7/M33 MPU is a drop-in replacement for NXP i.MX 95 SoC family
The 1 .4 GHz NXP i.MX 937 quad-core Cortex-A55 microprocessor (MPU) for HMI and Edge AI applications aims to fill the gap between entry-level NXP i.MX 93 SoCs and higher-end parts like the NXP i.MX 952 processor family, while offering pin-to-pin compatibility with the latter. The i.MX 937 MPU also features a dedicated 667 MHz Arm Cortex -M7 for real-time workloads and a low-power Arm Cortex-M33 core for system management tasks, supports LPDDR4x or LPDDR5 memory, integrates an Arm Mali G310 3D GPU, a VPU for 1080p H.26x video encoding and decoding, and a 2 eTOPS NXP eIQ Neutron NPU for machine learning (ML) acceleration. Since it targets HMI applications, we’ll also find MIPI DSI and LVDS display interfaces, and a 4-lane MIPI CSI camera interface, plus various other I/Os. NXP i.MX 937 specifications: (highlights in bold compared to other i.MX 93 parts) CPU Up to 4x Arm Cortex-A55 cores […]
NXP i.MX 93W wireless MPU SiP pairs dual-core Arm Cortex-A55 processor with NXP iW610 WiFi 6, Bluetooth LE, and 805.15.4 radio
NXP i.MX 93W is the company’s first integrated wireless MPU System-in-Package (SiP) and combines a dual-core Cortex-A55 processor (NXP i.MX 93) with an iW610 WiFi 6, Bluetooth LE, and 802.15.4 tri-radio into a single chip. The 14.2 x 12 mm package also includes all the external radio components needed for wireless connectivity, replacing up to 60 discrete components on the PCB. NXP says it reduces the PCB area, simplifies PCB design and regulatory approval, and speeds up time-to-market. NXP i.MX 93W specifications: CPU Dual-Core Arm Cortex-A55 at up to 1.7 GHz Arm Cortex-M33 core at 250 MHz for real-time control GPU – 2D graphics accelerator AI accelerator – Arm Ethos-U65 microNPU Memory I/F – Up to 3.7GT/s 16-bit LPDDR4/LPDDR4X with inline ECC Storage I/F – 2x SD 3.0/SDIO 3.0/eMMC 5.1 Display Interfaces MIPI DSI up to 1080p60 LVDS up to 720p60 24-bit parallel RGB Camera Interface – 2-lane MIPI CSI up […]
Renesas RZ/G3E Arm Cortex-A55/M33 MPU targets mid-range HMI systems requiring AI acceleration
Renesas RZ/G3E is a new member of the company’s RZ/G SoCs with a quad-core Cortex-A53 application processor, a Cortex-M33 real-time core, and an Ethos-U55 NPU for mid-range, AI-enhanced HMI (Human Machine Interface) systems with up to two 1920 x 1080 resolution displays. The industrial-grade processor features MIPI-DSI, dual-link LVDS, and Parallel RGB display interfaces, 2D and 3D graphics accelerators, H.264/H.265 video decoding, a 4-lane MIPI CSI interface, two gigabit Ethernet interfaces, 2-lane PCIe Gen3, USB 3.0/2.0, and a range of analog and digital I/Os. Renesas RZ/G3E specifications: CPU Dual- or quad-core Arm Cortex-A55 processor clocked at up to 1.8 GHz Arm Cortex-M33 system management processor clocked at up to 200 MHz GPU – Arm Mali-G52 3D GPU, Image Scaling Unit (ISC), Frame Data Processor (FDP) VPU – H.264/H.265 Video codec unit (VCD) NPU – Optional Arm Ethos-U55 NPU clocked at up to 1 GHz (512 GOPS) Memory 512KB on-chip SRAM […]
1GHz Renesas RZ/A3M Cortex-A55 MPU embeds 128MB on-chip DDR3L for HMI applications
Renesas RZ/A3M is an Arm Cortex-A55 microprocessor (MPU) clocked at up to 1.0 GHz with 128MB on-chip DDR3L for cost-effective, yet advanced HMI applications with up to 1280×800 resolution. The RZ/A3M is similar to its predecessor, the Renesas RZ-A3UL, but it integrates 128MB on-chip RAM in a single System-in-Package (SiP), supports both MIPI DSI and parallel display interfaces, and adds a 2D graphics accelerator for smoother user interfaces. Renesas RZ/A3M specifications: CPU – Single-core Arm Cortex-A55 @ up to 1.0 GHz GPU – 2D drawing engine Memory 128KB on-chip SRAM with ECC Built-in 128MB DDR3L-1600 SDRAM (16-bit bus width) Storage SPI Multi I/O Bus Controller× 1 channel (4-bit Double data rate) Boot from Serial NAND or Serial NOR flash SD card host interface Display I/F – 4-lane MIPI DSI or Digital parallel output up to 1280×800 resolution @ 60 Hz Audio – Serial sound interface (SSI/I2S) USB – 1x USB […]
IMDT V2N Renesas RZ/V2N SoM powers Edge AI SBC with HDMI, MIPI DSI, dual GbE, WiFi 4, and more
IMD Technologies has recently introduced the IMDT V2N SoM based on the newly launched Renesas RZ/V2N low-power AI MPU and its SBC carrier board designed for robotics, smart cities, industrial automation, and IoT applications. The SoM ships with 8GB RAM and 32GB eMMC flash, and supports various interfaces through B2B connectors including two 4-lane MIPI CSI-2 interfaces, a MIPI DSI display interface, and more. The SBC supports MIPI DSI or HDMI video output, dual GbE, WiFi 4 and Bluetooth 5.2, as well as expansion capabilities through M.2 sockets. IMDT V2N SBC specifications: IMDT V2N SoM SoC – Renesas RZ/V2N Application Processor – Quad-core Arm Cortex-A55 @ 1.8 GHz (0.9V) / 1.1 GHz (0.8V) L1 cache – 32KB I-cache (with parity) + 32KB D-cache (with ECC) per core L3 cache – 1MB (with ECC, max frequency 1.26 GHz) Neon, FPU, MMU, and cryptographic extension (for security models) Armv8-A architecture System Manager […]
Allwinner A733 octa-core Cortex-A76/A55 AI SoC supports up to 16GB RAM for Android 15 tablets and laptops
Allwinner A733 is an octa-core Cortex-A76/A55 processor with an optional 3 TOPS NPU and support for up to 16GB RAM designed for Android 15 tablets and laptops such as the Teclast P50Ai with a 10.92-inch touchscreen display. With two Cortex-A76 cores, six Cortex-A75 cores, an Imagination BXM-4-64 MC1 GPU, and an NPU, the Allwinner A733 looks very similar to the Allwinner A736 we noted in a roadmap last year. But there’s no news about the A736, so maybe the name was dropped and the Allwinner A733 was launched instead. Allwinner A733 specifications: CPU Dual-core Arm Cortex-A76 @ up to 2.00 GHz Hexa-core Arm Cortex-A55 @ up to 1.79 GHz Single-core RISC-V E902 real-time core GPU – Imagination Technologies BXM-4-64 MC1 VPU 8Kp24 H.265/VP9/AVS2 decoding (no mention of AV1) 4Kp30 H.265/H.264 encoding AI accelerator – Optional 3 TOPS NPU Memory 192 KB SRAM + 512 KB shared SRAM 32-bit LPDDR4/LPDDR4x/LPDDR5 interface […]


