industrial

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

ADLINK unveils Intel Atom x7000RE & x7000C Amston Lake COM Express and SMARC 2.1 modules

Intel Amston Lake COM Express module

ADLINK has released two Intel Atom X7000RE & x7000C Amston Lake-powered modules with the cExpress-ASL COM Express Type 6 Compact module and the LEC-ASL SMARC 2.1 system-on-module both offered with up to 16GB LPDDR5 soldered-down memory and 2.5GbE networking. The modules are designed for high-performance, low-power, and ruggedized edge solutions running 24/7, and with support for Intel TCC and Time Sensitive Networking (TSN), the modules are also suitable for hard-real-time computing workloads required by use cases such as industrial automation, AI robots, smart retail, transportation, network communication, and more. Intel Atom x7000RE and x7000C Amston Lake processors The announcement came as a surprise because I had never heard about Intel Amston Lake processors so far. It might be because they were just announced and all seven SKUs are embedded parts with two to eight cores, and as a result, they may not quite get as much coverage as consumer processors. […]

Posted on by Tomisin Olujinmi - 1 Comment on SolidRun Bedrock R8000 is the first Industrial PC to feature AMD Ryzen Embedded 8000 series

SolidRun Bedrock R8000 is the first Industrial PC to feature AMD Ryzen Embedded 8000 series

Bedrock 8000 AMD Ryzen Embedded 8000 industrial PC

Israeli embedded systems manufacturer, SolidRun, has recently introduced the Bedrock R8000, a new fanless, Industrial PC targeted at edge AI applications. The Bedrock R8000 integrates the newly-announced AMD Ryzen Embedded 8000 series processors with 8 Zen 4 cores and 16 threads clocked at up to 5.1 GHz. The Ryzen Embedded 8000 Series has a 16 TOPS NPU for AI workloads and offers up to 10 years of guaranteed availability. Also, up to 3 AI accelerators (either Hailo-10 or Hailo 8) can be combined with the onboard NPU to achieve over 100 TOPS for generative or inferencing AI workloads. Apart from the Ryzen Embedded 8000 series, the Bedrock R8000 series also supports other Accelerated Processing Units (APU) in the “Hawk Point” family. The CPU power limit can be adjusted in the BIOS within a range of 8W to 54W. Memory goes up to 96GB DDR5 ECC/non-ECC and three NVME PCIe Gen4 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Arm Ethos-U85 NPU delivers up to 4 TOPS for Edge AI applications in Cortex-M7 to Cortex-A520 SoCs

Arm Ethos-U85 NPU delivers up to 4 TOPS for Edge AI applications in Cortex-M7 to Cortex-A520 SoCs

Arm Ethos-U85 NPU

Arm has just Introduced its third-generation NPU for edge AI with the Arm Ethos-U85 that scales from 256 GOPS to 4 TOPS or up to four times the maximum performance of the previous generation Ethos-U65 microNPU, while also delivering 20% higher power efficiency. While previous Arm microNPUs were paired with Cortex-M microcontroller-class cores potentially embedded into a Cortex-A application processor, the new Ethos-U85 can be married with Cortex-M microcontrollers and Cortex-A application processors up to the Cortex-A510/A520 Armv9 cores. Arm expects the Ethos-U85 to find its way into SoC designed for factory automation and commercial or smart home cameras with support for the new Transformer Networks and the more traditional Convolutional Neural Networks (CNNs). The Arm Ethos-U85 supports 128 to 2,048 MACs with performance ranging from 256 GOPS to 4 TOPS at 1 GHz, embeds 29 to 267KB RAM, offers SRAM, DRAM, and flash interface for external memory, and up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93

ADLINK OSM-IMX93 is an OSM r1.1 Size-L module based on NXP i.MX 93 Arm Cortex-A55 & Cortex-M33 AI processor, and the first from the company to comply with the Open Standard Module (OSM) standard. The 45x45mm module is fitted with up to 2GB LPDDR4L, 128GB eMMC flash, an optional WiFi/Bluetooth module, and its 662 contacts provide a range of interfaces that include LVDS and DSI graphics output, 2x GbE (including 1x TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and more. ADLINK OSM-IMX93 specifications: SoC – NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Memory – 640 KB OCRAM w/ ECC Security – EdgeLock Secure Enclave System Memory – 1 or 2GB LPDDR4L Storage […]

Posted on by Tomisin Olujinmi - 1 Comment on Digi ConnectCore MP25 SoM targets Edge AI and computer vision applications with STM32MP25 MPU

Digi ConnectCore MP25 SoM targets Edge AI and computer vision applications with STM32MP25 MPU

digi connectcore mp25 module

Digi International, an American Industrial IoT solutions provider, has announced its latest system-on-module, the Digi ConnectCore MP25 SoM, at Embedded World 2024 in Nuremberg, Germany. The Digi ConnectCore MP25 SoM is built upon STMicroelectronics’ STM32MP25 microprocessor. It supports artificial intelligence and machine learning functionality through an integrated neural processing unit (NPU) capable of 1.35 tera operations per second (TOPS) and an image signal processor (ISP). It is powered by two 64-bit Arm Cortex-A35 cores running at 1.5GHz, supported by a 32-bit Cortex-M33 core operating at 400MHz and a 32-bit Cortex-M0+core running at 200MHz. With its machine learning capabilities, support for time-sensitive networking, and versatile connectivity features, the ConnectCore MP25 module is suitable for edge AI, computer vision, and smart manufacturing applications in various sectors, including medical, energy, and transportation. Digi ConnectCore MP25 specifications: SoC – STMicroelectronics STM32MP257F CPU – 2x 64-bit Arm Cortex-A35 @ 1.5 GHz; MCU 1x Cortex-M33 @ […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Toradex Aquila AM69 SoM features TI AM69A octa-core Cortex-A72 AI SoC, rugged 400 pin board-to-board connector

Toradex Aquila AM69 SoM features TI AM69A octa-core Cortex-A72 AI SoC, rugged 400 pin board-to-board connector

Toradex Aquila AM69

Toradex Aquila AM69 is the first system-on-module (SoM) from the company’s Aquila family with a small form factor and a rugged ~400-pin board-to-board connector targetting demanding edge AI applications in medical, industrial, and robotics fields with Arm platforms that deliver x86 level of performance at low power. The Aquila AM69 SoM is powered by a Texas Instruments AM69A octa-core Arm Cortex-A72 SoC with four accelerators delivering 32 TOPS of AI performance, up to 32GB LPDDR4, 128GB eMMC flash, built-in WiFi 6E and Bluetooth 5.3 module, and a board-to-board connector for display, camera, and audio interfaces, as well as dual gigabit Ethernet, multiple PCIe Gen3 and SerDes interfaces. All that in a form factor that’s only slightly bigger (86x60mm) than a business card or a Raspberry Pi 5. Toradex Aquila AM69 specifications: SoC  – Texas Instruments AM69A Application processor – Up to 8x Arm Cortex-A72 cores at up to 2.0 GHz […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000

AMD has recently “announced” the Ryzen Embedded 8000 Series processors in a community post with the latest AMD embedded devices combining a 16 TOPS NPU based on the AMD XDNA architecture with CPU and GPU elements for a total of 39 TOPS designed for industrial artificial intelligence. The Ryzen Embedded 8000 CPUs will be found in machine vision, robotics, and industrial automation applications to enhance the quality control and inspection processes, enable real-time, route-planning decisions on-device for minimal latency, and predictive maintenance, and autonomous control of industrial processes. AMD Ryzen Embedded 8000 key features and shared specifications: CPU – Up to 8 “Zen 4” cores, 16 threads Cache L1 Instruction Cache – 32 KB, L1 Data Cache = 32 KB (per core) L2 Cache – Up to 8 MB (total) L3 Cache-  Up to 16 MB unified Graphics – RDNA 3 graphics with up to 6 WGPs (Work Group processors) […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Cincoze DA-1200 fanless industrial embedded computer features Intel N97 CPU, operates in -40 to 70°C temperature range

Cincoze DA-1200 fanless industrial embedded computer features Intel N97 CPU, operates in -40 to 70°C temperature range

Cincoze DA-1200 fanless industrial embedded computer

Cincoze DA-1200 is a compact, fanless industrial embedded computer powered by an Intel Processor N97 Alder Lake-N CPU with up to 16GB DDR5, and equipped with M.2 Key-B sockets and 2.5-inch SATA slot for storage, dual 2.5GbE, optional WiFi and 5G connectivity, DisplayPort video output, and a CMI connector for expansion. Designed for challenging industrial environments, the mini PC works across a wide temperature range (-40 to 70°C) and wide voltage range (9 to 48V) and complies with the MIL-STD-810H shock and vibration standard, as well as various EMC/EMI standards such as EN IEC 61000-6-2 and EN IEC 61000-6-4. Cincoze DA-1200 specifications: SoC – Intel Processor N97 Alder Lake-N quad-core processor @ up to 3.6 GHz with 6MB cache, 24 EU Intel UHD graphics @ up to 1.20 GHz; TDP: 12W System Memory – Up to 16GB DDR5-4800 via SO-DIMM socket Storage M.2 SSD shared by M.2 Key B Type […]

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