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Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on DIN-Rail mountable industrial 4G LTE router takes 9V to 36V DC power input

DIN-Rail mountable industrial 4G LTE router takes 9V to 36V DC power input

DIN Rail 4G router VPN

Waveshare WS-431E is an industrial-grade 4G LTE router with three Ethernet ports, WiFi 4, wall and DIN-Rail mounting options, and support for a wide power input range between 9V and 36V DC. The router is said to be based on two Qualcomm chips without further details provided, support various VPN protocols, and be suitable for networked medical equipment, Smart Agriculture, Smart Cities, robots, and security monitoring applications. Waveshare WS-431E specifications: SoC – “Dual Qualcomm chips” for WiFi and 4G LTE Networking Ethernet 1x 10/100Mbps Ethernet RJ45 WAN port (can be configured as LAN) with auto MDI/MDIX, 1.5KV electromagnetic isolation protection 2x 10/100Mbps Ethernet RJ45 LAN ports with auto MDI/MDIX, 1.5KV electromagnetic isolation protection 2.4 GHz 802.11b/g/n WiFi 4 2×2 MIMO up to 300 Mbps, and 500-meter LoS range 4G LTE cellular 4G TDD-LTE – B38/40/41 4G FDD-LTE – B1/3/7/8/20/28A 3G WCDMA – B1/8 2G GSM/EDGE – B3/8 Nano SIM card […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Bedrock R7000 Edge AI fanless computer combines AMD Ryzen 7 7840HS CPU with Hailo-8 AI accelerators

Bedrock R7000 Edge AI fanless computer combines AMD Ryzen 7 7840HS CPU with Hailo-8 AI accelerators

Bedrock R7000 Edge AI fanless computer

SolidRun Bedrock R7000 Edge AI fanless computer combines an 8-core AMD Ryzen 7840HS/U Zen4 processor and up to three Hailo-8 AI accelerators for artificial intelligence applications in harsh environments with an industrial temperature range of -40ºC to 85ºC. The industrial embedded system comes with up to 64GB DDR5 memory, supports up to three M.2 NVMe SSD, and offers various interfaces such as dual 2.5GbE and four 4K-capable display interfaces using HDMI and DisplayPort. Just like the previous generation mode, the AMD Ryzen Embedded V3000-powered Bedrock V3000 fanless industrial computer, the BedRock R7000 is offered in three different form factors including the 30W and 60W dissipation model with integrated heatsink fins, and a tile variant designed to be fastened to a cold plate on a chassis. Bedrock R7000 Edge AI specifications: SoC – AMD Ryzen 7  7840HS or 7840U octa-core Zen4 processor clocked at 3.8 GHz / 5.1GHz (Turbo) with Radeon […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Toshiba “MH3 Group (2)” Arm Cortex-M3 MCU supports firmware updates without interrupting operation

Toshiba “MH3 Group (2)” Arm Cortex-M3 MCU supports firmware updates without interrupting operation

Toshiba MH3 Group 2 microcontroller

Toshiba “MH3 Group (2)” Arm Cortex-M3 microcontrollers come with a 1MB flash memory partitioned into two 512KB partitions to enable firmware updates without interrupting microcontroller operation using an area swap function to rotate to the new firmware seamlessly. The new M3H Group (2) builds upon the M3H Group(1) by expanding the code flash memory up to 1MB, and the RAM capacity from 66KB to 130KB. Both are part of the “TXZ+ Family Advanced Class” manufactured with a 40nm process, and equipped with a 120 MHz Arm Cortex-M3 core as well as various interface and motor control options such as UART, I2C, Advanced Encoder Input Circuit, and Advanced Programmable Motor Control Circuit. Toshiba MH3 Group 2 key features and specifications: CPU core – Arm Cortex-M3  @ 120 MHz with memory protection unit (MPU) Internal oscillator – 10MHz (+/-1%) Internal memory Code flash memory – 512KB to 1024KB (program/erase cycles: up to […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on CompuLab UCM-iMX93 – A miniature NXP i.MX 93 module with WiFi 5 & Bluetooth 5.3

CompuLab UCM-iMX93 – A miniature NXP i.MX 93 module with WiFi 5 & Bluetooth 5.3

Compulab UCM-iMX93 system-on-module

CompuLab UCM-iMX93 is a miniature system-on-module powered by the new NXP i.MX93 Cortex-A55 AI processor family with up to 2GB RAM and 64GB eMMC flash. The tiny 38x28mm features a Gigabit Ethernet PHY, a WiFi 5 and Bluetooth 5.3 wireless modules, and plenty of multimedia, communication, and peripheral interfaces through two 100-pin high-density connectors including display and camera interfaces, USB ports, CAN FD, and up to 79 GPIOs. UCM-iMX93 specifications: SoC – NXP i.MX9352 or i.MX9331 dual-core/single-core Arm Cortex-A55 @ 1.5 GHz (industrial) / 1.7 GHz (commercial) with Arm Cortex-M33 real-time core @ 250 MHz, Arm Ethos U65 microNPU System Memory – 512MB to 2GB LPDDR4 Storage – 8GB to 64GB eMMC flash Networking Gigabit Ethernet PHY Certified WiFi 5 (802.11ac) and Bluetooth 5.3 BLE module (NXP 88W8997) 2x 100-pin 0.4mm pitch high-density UCM connectors Display 4-lane MIPI-DSI up to 1920 x 1080 @ 60Hz 4-lane LVDS up to 1366 […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 9 Comments on UP Squared i12 is a compact Alder Lake-P single board computer

UP Squared i12 is a compact Alder Lake-P single board computer

UP Squared i12

AAEON’s UP Squared i12 is a single board computer with the same dimensions as the UP Squared (Apollo Lake) and UP Squared V2 (Elkhart Lake) boards, and mostly the same ports layout, but powered by a more powerful 12th generation Intel Alder Lake-P processor from a Celeron 7305E up to an Intel Core i7-1270PE. The board comes with up to 8 or 16GB LPDDR5 memory, SATA and NVMe storage support, triple 4K display support through HDMI, DisplayPort and USB-C interfaces, dual Gigabit Ethernet, a few USB boards, and some wafers and headers such as a Raspberry Pi-compatible GPIO header. UP Squared i12 specifications: 12th generation Alder Lake-P SoC: Intel Core i7-1270PE 12-core/16-thread processor @ 3.30GHz / 4.50GHz (Turbo) with 96EU Intel Xe graphics – PBP: 28W, up to 64W MTP Intel Core i5-1250PE 12-core/16-thread processor @ 3.20GHz / 4.40GHz (Turbo) with 80EU Intel Xe graphics – PBP: 28W, up to […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 7 Comments on NXP i.MX 91 single-core Cortex-A55 SoC to power Linux-based cost-optimized edge devices

NXP i.MX 91 single-core Cortex-A55 SoC to power Linux-based cost-optimized edge devices

NXP i.MX 91 CPU

NXP has just unveiled the NXP i.MX 91 single-core Cortex-A55 processor following the introduction of the i.MX 93 in 2021, and designed for cost-optimized edge devices running Linux. The NXP i.MX 93 processor comes with up to two Cortex-A55 cores, a Cortex-M33 real-time core, and an Ethos U65 microNPU, but targeting entry-level Linux systems, the NXP i.MX 91 processor does without the real-time core and the AI acceleration, while still integrating NXP EdgeLock Secure Enclave, and the company highlights support for multiple wireless connectivity options through companion chips such as the IW612 that supports Wi-Fi 6, Bluetooth 5.2, 802.15.4, and the new Matter protocol. NXP i.MX 91 specifications: CPU – Arm Cortex-A55 running at up to 1.4GHz with 256KB L2 cache System Memory – Up to 2.4GT/s x16 LPDDR4 with Inline ECC Storage 3x SD 3.0, SDIO 3.0, eMMC 5.1 1x Octal SPI including support for SPI NOR and SPI […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Versal AI Edge SoC FPGA system-on-module targets ADAS, robotics, medical imaging, and other AI applications

AMD Xilinx Versal AI Edge System-on-Module

iWave Systems iW-Rainbow-G57M is a system-on-module (SoM) based on the AMD (Xilinx) Versal AI Edge series of Cortex-A72/R5 SoC FPGAs designed to deliver AI acceleration at relatively low power for demanding applications such as ADAS, robotics, and medical imaging. The module comes with up to 8GB 64-bit LPDDR4, 16GB eMMC Flash, 256MB QSPI Flash, delivers up to 45 TOPS of AI performance, and features eight transceivers that can be used for high-speed Ethernet, PCIe, MIPI DSI/CSI interfaces, and/or others as required by the customer’s specific project. iW-Rainbow-G57M specifications: FPGA SoC – AMD Xilinx Versal AI Edge/Prime SFVA784 package (VE2302, VE2202, VE2102,  or VE2002) with Dual Arm Cortex-A72 core processor @ up to 1.6 GHz Dual-core Arm Cortex-R5F Up to 328K Logic cells & 150K LUTs Programmable Network on Chip (NoC) Up to 45 TOPS (INT4) AI compute 8x GTYP Transceivers @ 28.21 Gbps (VE2302 & VE2202 only) Memory – Up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on The world’s smallest Bluetooth SoC: InPlay NanoBeacon SoC IN100 in 2.0×1.1mm WLCSP package

The world’s smallest Bluetooth SoC: InPlay NanoBeacon SoC IN100 in 2.0×1.1mm WLCSP package

world smallest bluetooth soc IN100 WLCSP

InPlay has just announced a Wafer Level Chip Scale Package (WLCSP) for its NanoBeacon SoC IN100, making it the world’s smallest Bluetooth System-on-a-Chip (SoC) at just 2.0 x 1.1 x 0.35mm. The NanoBeacon IN100 is not new per se, and we covered the still tiny Bluetooth SoC when writing about Sparkfun NanoBeacon Bluetooth 5.3 module based on the DFN8 package measuring 2.5×2.5mm. The highlights include its low-code/no-code interface and an ultra-low power consumption of below 1 uW. InPlay NanoBeacon SoC IN100 specifications: Memory – 4 KB SRAM +  4 Kbit OTP memory Bluetooth 5.3 compliant Beacon Modes: Proprietary, BT, Google Eddystone, and Apple iBeacon compliant 2.4GHz RF frequency band, MedRadio band (2.36GHz) Programming-free and firmware-less design Long-range transmission: up to several hundred meters Security Authentication of beacon ID Privacy of advertising payload Supply voltage range – 1.1V ~ 3.6V (Single 1.5V coin battery support) Power consumption Sub-uW power consumption for […]

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