OSM Size M SiP Integrates STM32MP1 MPU for industrial & IoT applications

MSMP1 STM32MP1 SiP

ARIES Embedded MSMP1 OSM-compatible system-in-package (SiP) based on STM32MP1 CortexA7/M4 microcontroller for Industrial and IoT applications follows the company’s MSRZG2UL and MSRZFive OSM-compatible SiPs with Renesas Arm or RISC-V microprocessor introduced a few months ago. But instead of coming in the ultra-compact 30×30 mm OSM Size S form factor, the new MSMP1 complies with the larger 45x30mm OSM Size M form factor with a total of 476 contacts to allow for more I/Os. The SiP also integrates 512 MB to 4 GB DDR3L RAM, and 4 to 64 GB eMMC flash. MSMP1 SIP specifications: SoC – STMicro STM32MP1 single or dual-core Arm Cortex-A7 processor up to 800MHz, with Arm Cortex-M4 real-time core up to 209MHz, Vivante GPU compatible with OpenGL ES 2.0 System Memory – 512MB – 4GB DDR3L RAM Storage – 4GB – 64GB eMMC NAND Flash 476-contact LGA with Networking – Gigabit Ethernet USB – USB 2.0 Host/OTG […]

OSM Size-0 solder-on LGA module comes with ESP32 WiFi & BLE MCU

OSM Size-0 ESP32 module

German embedded systems company iesy’s ESP32 OSM-0F is an ESP32-based solder-on LGA system-on-module that complies with SGET OSM Size-0 (30x15mm) form factor, offers WiFi and Bluetooth connectivity, and more. The SGET Open Standard Module (OSM) standard defines four module sizes, namely Size-0 (30x15mm), Size-S (30x30mm), Size-M (45x30mm), and Size-L (45x45mm), and all the modules we’ve covered so far were powered by a Linux-capable processor. But it’s more challenging, albeit not impossible, to design a Linux-capable OSM Size-0 module, and that form factor is better suited to microcontroller-class chips like ESP32. (Technically, ESP32 can run Linux, but it’s more for show that any practical applications) ESP32 OSM-0F specifications: Microcontroller – Espressif ESP32 dual-core Xtensa LX6 MCU @ 240 MHz with 512KB RAM, Wi-Fi 802.11 b/g/n and Bluetooth/BLE Storage – 32 Mbit SPI flash Antenna – u.FL connector 188 LGA contact points with Storage – SDIO Networking – 1x 10/100M Ethernet (RMII), […]

ARIES Embedded unveils OSM modules based on Renesas Arm or RISC-V microprocessor

In another case of “Arm or RISC-V? Why not both“, ARIES Embedded has introduced “MSRZG2UL” and “MSRZFive” OSM compliant system-in-packages (SIPs) based on respectively Renesas RZ/G2UL Arm Cortex-A55/Cortex-M33 and RZ/Five AX45MP RISC-V microprocessors and designed for industrial controllers, IoT devices, and embedded systems with a basic GUI. Both solder-on modules come in the OSM Size S form factor (30x30mm), 512MB to 4GB of DDR4 RAM, a 4GB eMMC NAND flash, various interfaces including Gigabit Ethernet and CAN-FD, and are available in either commercial (-0°C to +70°C) or industrial (-40°C to +85°C) temperature ranges. “MSRZG2UL” and “MSRZFive” specifications: SoC MSRZG2UL module – Renesas RZ/G2UL single-core Cortex-A55 processor @ up to 1GHz with Cortex-M33 real-time core @ up to 200MHz MSRZFive module – Renesas RZ/Five single-core RISC-V AX45MP processor @ to 1.0 GHz System Memory – 512MB – 4GB DDR4 RAM Storage – 4GB eMMC NAND Flash 332 contacts with Display I/F […]

Geniatech launches OSM Size-L modules with Renesas RZ/G2L, Rockchip RK3566

Rockchip RK3566 OSM module

Geniatech has introduced LGA system-on-modules compliant with the SGET OSM (Open Standard Module) Size-L standard and designed to be soldered directly on the carrier board. Two models have been launched with the SOM-G2L-OSM equipped with Renesas RZ/G2L Arm Cortex-A55/M33 processor, and the SoM-3566-OSM powered by a Rockchip RK3566 quad-core Cortex-A55 SoC. SOM-G2L-OSM module Specifications: SoC – Renesas RZ/G2L dual-core Cortex-A55 processor, Cortex-M33 real-time core,  Arm Mali-G31 GPU, H.264 video encoder/decoder System Memory – 1GB RAM (2GB/4GB optional) Storage – 8GB eMMC flash (16GB/32GB optional) 662 contacts with Display – 1x MIPI DSI, 1x RGB Camera – 1x MIPI CSI Audio – I2S Networking – 2x Gigabit Ethernet USB – 1x USB OTG 2.0, 1x USB 2.0 host Serial – 2x CAN bus SDIO 3.0 Low-speed I/Os – 5x UART including debug, 2x I2C, 3x SPI, 3x PWM, 16x GPIO, 2x ADC Dimensions – 45 x 45 mm (OSM Size-L form […]

OSM Size-S compliant LGA system-on-module is powered by NXP i.MX 8XLite processor

OSM Size-S iMX 8XLite system-on-module

iWave Systems has launched another system-on-module compliant with the SGET OSM (Open Standard Module) standard with the iW-RainboW-G46M powered by NXP i.MX 8XLite Cortex-A35 processor designed for V2X and IIoT applications and following OSM Size-S (30x30mm) form factor The new system-on-module follows the iW-RainboW-G40M module with NXP i.MX 8M Plus processor and OSM Size-L (45x45mm) form factor launched at the beginning of the year. The iW-RainboW-G46M comes with 2GB RAM and 8GB flash by default, Gigabit Ethernet, PCIe, and CAN interfaces among others, and can operate in a wide -40°C to +125°C temperature range. iW-RainboW-G46M specifications: SoC – NXP i.MX 8XLite Dual/Solo Cortex-A35 processor @ up to 1.2 GHz with Cortex-M4F real-time core, on-chip V2X accelerator (but no GPU, no VPU) System Memory – 2GB LPDDR4 (expandable) Storage – 8GB eMMC Flash (expandable) 332 balls contact grid with Display – 18-bit RGB LCD interface Audio – 1x I2S Networking – […]

i.MX 8M Plus solderable LGA module follows OSM Size-L standard

Solderable OSM module SBC

SGET Open Standard Module (OSM) specification was ratified in November 2020. It defined specifications for solderable LGA system-on-modules, and we first noticed it though through the launch of F&S Elektronik “FS 8MM OSM-SF” module powered by an NXP i.MX 8M Mini processor, and following OSM Size-S standard (30x30mm). As we noted in our introduction about the Open Standard Module, SGET defined four sizes from Size-0 (30x15mm) to Size-L (45x45mm), and there’s now at least one “Large” OSM module courtesy of iWave Systems, and their iW-RainboW-G40M module equipped with an NXP i.MX 8M Plus processor for AI applications. iW-RainboW-G40M specifications: SoC- NXP i.MX 8M Plus Q/QL/D quad-/dual-core Cortex-A53 processor up to 2.0 GHz, with Arm Cortex-M7 real-time core @ 800 MHz, Vivante GC7000UL 3D GPU, Vivante GC520L 2D GPU, 2.3 TOPS NPU System Memory – Up to 8GB LPDDR4 Memory Storage – Up to 256GB eMMC flash Wireless – 802.11a/b/g/n/ac/ax Wi-Fi […]

SGET OSM (Open Standard Module) compliant SoM features NXP i.MX 8M Mini SoC

Open Standard Module (OSM) i.MX 8M Mini

The SGET (Standardization Group for Embedded Technologies) non-profit organization ratified another system-on-module standard last November, with the “Open Standard Module” (OSM) standard that instead of relying on edge or board-to-board connectors is meant to be soldered on the carrier board as a solder-on module LGA package. F&S Elektronik has unveiled one of the first SGET OSM compliant SoM with “FS 8MM OSM-SF” equipped with an NXP i.MX 8M Mini processor, up to 8GB DDR4, 32GB eMMC flash or 512MB NAND flash on a 30x30mm “Size-S OSM” form factor. FS 8MM OSM-SF system-on-module FS 8MM OSM-SF module specifications: SoC – NXP i.MX 8M Mini single, dual, or quad-core Arm Cortex-53 processor @ 1.8 GHz with real-time Cortex-M4 core @ 400 MHz,  Vivante 2D & 3D GPU, 1080p60 H.265, VP9, H.264, VP8 video decoder System Memory –  Up to 8GB LPDDR4 Storage – Up to max. 512MB SLC NAND flash or up […]