osm News - CNX Software - Embedded Systems News

October 21, 2025October 21, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

TechNexion unveils SO-DIMM and OSM system-on-modules based on Synaptics SL2610

Last week, we wrote about the Synaptics SL2610 Edge AI SoC family integrating Google’s open-source Coral NPU, and the first system-on-modules have already been announced, courtesy of TechNexion. The AIOM-SL2610 is a 260-pin SO-DIMM CPU module with a Realtek RTL8211F Gigabit Ethernet transceiver, a WiFi 6E and Bluetooth 6.0 module, and an on-module JTAG debug interface, while the OSM-SL260 is a smaller, lighter, solder-down module compliant with the OSM Size S specification. Both come with up to 2GB LPDDR4 memory, 64GB eMMC flash, and Arm PSA Level 2 or 3 security. TechNexsion AIOM-SL2610 SO-DIMM system-on-module AIOM-SL2610 specifications: SoC – Synaptics SL2610 (SL2613, SL2617, or SL2619) Application cores – Single and dual-core Arm Cortex-A55 @ up to 2.0 GHz Real-time cores – Arm Cortex-M52 with Helium System Manager (SM) domain, 256KB SRAM GPU – Optional Arm Mali-G31 3D GPU NPU (Optional) – Transformer-capable Torq and Coral NPU (RISC-V ML Core) for […]

October 14, 2025October 15, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK OSM-IMX95 – An NXP i.MX 95 OSM Size-L system-on-module for IoT and industrial applications

ADLINK OSM-IMX95 is an OSM Size-L solder-on system-on-module powered by an NXP i.MX 95 hexa-core Arm Cortex-A55 SoC with an up to 2 TOPS eIQ Neutron NPU/AI accelerator. It follows the OSM-IMX93 OSM Size-L module based on NXP i.MX 93 SoC, but features a more powerful SoC, up to 16GB LPDDR4L RAM, up to 256GB eMMC flash, and high-speed interfaces like USB 3.0 and PCIe Gen3. The new NXP i.MX 95 OSM module is designed for Smart Home, Smart Building, Smart City, medical, and Industry 4.0 applications. ADLINK OSM-IMX95: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 cores @ up to 1.8 GHz Real-time co-processors – Arm Cortex-M7 @ 800MHz and Cortex-M33 @ 250MHz 2D/3D Graphics Acceleration Arm Mali-G310 3D GPU with OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0 2D GPU Video Encode / Decode – 4Kp30 H.265 and H.264 AI/ML – 2 TOPS eIQ Neutron NPU System […]

October 1, 2025September 30, 2025 by Debashis Das - 1 Comment

ARIES MSRZG3E OSM-compliant SiP with Renesas RZ/G3E MPU targets industrial HMI and Edge AI

ARIES Embedded MSRZG3E OSM compliant SiP

ARIES Embedded MSRZG3E is an OSM-compliant system-in-package (SiP) built around the Renesas RZ/G3E MPU, designed for HMI, industrial, medical, and edge AI applications. The Renesas RZ/G3E SoC integrates a quad-core Arm Cortex-A55 CPU, a Cortex-M33 real-time core, and an Ethos-U55 NPU delivering up to 512 GOPS for AI power. Other features include PCIe Gen3, USB 3.2, dual Gigabit LAN, plus CAN FD, UART, I2C, SPI, and ADC. Multimedia support includes dual displays, MIPI-CSI camera input, and H.264/H.265 video codec. The SiP ships with 512 MB to 8 GB LPDDR4 RAM and 4 GB to 64 GB eMMC flash, with commercial and industrial-grade temperature support. MSRZG3E MSRZG3E SiP specifications: SoC – Renesas RZ/G3E dual or quad Arm Cortex-A55, Arm Cortex-M33 core MCU Memory – 512 MB to 8 GB LPDDR4 RAM Storage 4 GB to 64 GB eMMC NAND flash 2 Mbit to 512 Mbit SPI NOR flash 476-pad land grid […]

August 4, 2025August 4, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

Renesas RZ/G3E Arm Cortex-A55/M33 MPU targets mid-range HMI systems requiring AI acceleration

Renesas RZ/G3E is a new member of the company’s RZ/G SoCs with a quad-core Cortex-A53 application processor, a Cortex-M33 real-time core, and an Ethos-U55 NPU for mid-range, AI-enhanced HMI (Human Machine Interface) systems with up to two 1920 x 1080 resolution displays. The industrial-grade processor features MIPI-DSI, dual-link LVDS, and Parallel RGB display interfaces, 2D and 3D graphics accelerators, H.264/H.265 video decoding, a 4-lane MIPI CSI interface, two gigabit Ethernet interfaces, 2-lane PCIe Gen3, USB 3.0/2.0, and a range of analog and digital I/Os. Renesas RZ/G3E specifications: CPU Dual- or quad-core Arm Cortex-A55 processor clocked at up to 1.8 GHz Arm Cortex-M33 system management processor clocked at up to 200 MHz GPU – Arm Mali-G52 3D GPU, Image Scaling Unit (ISC), Frame Data Processor (FDP) VPU – H.264/H.265 Video codec unit (VCD) NPU – Optional Arm Ethos-U55 NPU clocked at up to 1 GHz (512 GOPS) Memory 512KB on-chip SRAM […]

August 4, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

Advantech unveils NXP i.MX 95 SMARC 2.2 and OSM Size L system-on-modules

Advantech has introduced two new NXP i.MX 95 system-on-modules: the AOM-5521, compliant with the SMARC 2.2 standard, and the solder-on AOM-2521 OSM Size L system-on-module. With up to six Arm Cortex-A55 cores running at up to 2.0 GHz, a dedicated 2 TOPS NPU, and up to 8GB LPDDR4/5 memory, the AOM-5521 and AOM-2521 modules target industrial automation, medical devices, intelligent vision systems, and other Edge AI and IoT applications. AOM-5521 SMARC 2.1 CPU module AOM-5521 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode […]

February 18, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]

February 5, 2025February 5, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iW-RainboW-G54S credit card-sized OSM SBC

iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]

April 8, 2024April 8, 2024 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93 is an OSM r1.1 Size-L module based on NXP i.MX 93 Arm Cortex-A55 & Cortex-M33 AI processor, and the first from the company to comply with the Open Standard Module (OSM) standard. The 45x45mm module is fitted with up to 2GB LPDDR4L, 128GB eMMC flash, an optional WiFi/Bluetooth module, and its 662 contacts provide a range of interfaces that include LVDS and DSI graphics output, 2x GbE (including 1x TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and more. ADLINK OSM-IMX93 specifications: SoC – NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Memory – 640 KB OCRAM w/ ECC Security – EdgeLock Secure Enclave System Memory – 1 or 2GB LPDDR4L Storage […]