osm News - CNX Software - Embedded Systems News

May 12, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Geniatech launches Renesas RZ/V2N, RZ/V2H, and RZ/V2L OSM Size-M/L system-on-modules

Geniatech has introduced three OSM system-on-modules powered by Renesas RZ/V2N/V2H/V2L Cortex-A55/M33 microprocessors, namely the OSM Size-M (45x35mm) SOM-V2N-OSM, plus the OSM Size-L (45x45mm) SOM-V2H-OSM and SOM-V2L-OSM modules, all designed for Edge AI and computer vision applications. Geniatech SOM-V2N-OSM Specifications: SoC – Renesas RZ/V2N CPU Quad-core Arm Cortex-A55 @ 1.8 GHz Arm Cortex-M33 @ 200 MHz GPU – Arm Mali-G31 3D graphics engine (GE3D) with OpenGL ES 3.2 and OpenCL 2.0 FP VPU – Encode & decode H.264 – Up to 1920×1080 @ 60 fps (Renesas specs, but SOMDEVICES also mentions up to 4K @ 30 FPS) H.265 – Up to 3840×2160 @ 30 fps AI accelerator – DRP-AI3 up to 4 dense TOPS / 15 sparse TOPS System Memory – 8GB LPDDR4x RAM Storage – 64GB eMMC flash 476 LGA contacts with Display – 4-lane MIPI-DSI Camera – 2x 4-lane MIPI CSI-2 Audio – 2x I²S Networking – 2x Gigabit Ethernet […]

April 16, 2026April 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

ADLINK OSM-MTK520 – A MediaTek Genio 520-based OSM Size-L system-on-module

MediaTek Genio 520 OSM Size L system-on-module

ADLINK OSM-MTK520 is a 45 x 45mm OSM Size-L system-on-module (SoM) powered by a MediaTek Genio 520 AIoT processor with a 10 TOPS NPU for Edge AI workloads. It’s basically an upgrade to the company’s OSM-MTK510 OSM Size-L module with a Genio 510 hexa-core SoC (3.2 TOPS NPU), up to 32GB eMMC flash, and 8GB LPDDR4 with a Genio 520 octa-core SoC (10 TOPS NPU), up to 256GB or 512GB UFS 3.1 storage, and up to 16GB LPDDR5 memory. There are also some minor changes to I/Os with an extra USB OTG interface, DisplayPort instead of HDMI, an extra MIPI CSI camera interface, fewer I2C interfaces, and more GPIOs. ADLINK OSM-MTK520 specifications: SoC – MediaTek Genio 520 (MT8371) CPU – Octa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 6x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU up to 880 MHz […]

March 31, 2026April 1, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Toradex OSM and Lino SoMs – 30×30mm NXP i.MX 93/i.MX 91 modules with solder-down or B2B connector designs

Toradex has launched two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, powered by NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications. The OSM iMX91 and OSM iMX93 variants comply with the OSM Size-S standard, featuring a 332-ball contact grid designed to be soldered to the carrier board. The Lino is a proprietary format that keeps the OSM Size-S dimensions but features two board-to-board (B2B) connectors offering more flexibility for potential replacement or future upgrades. Toradex Lino iMX91/iMX93 system-on-module Toradex Lino specifications: SoC (one or the other) NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, and color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Security – EdgeLock Secure Enclave NXP i.MX 91 CPU – Single-core Arm Cortex-A55 […]

January 15, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Geniatech introduces SMARC and OSM system-on-modules powered by NXP i.MX 95 SoC

Geniatech NXP i.MX 95 SMARC OSM system-on-modules

Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 Size L-compliant SOM-iMX95-OSM and the SMARC 2.1-compliant SOM-iMX95-SMARC. Both ship with up to 16GB LPDDR5 and up to 128GB eMMC flash, and are designed for markets such as smart retail, industrial automation, intelligent transportation, medical devices, and commercial IoT. Geniatech SOM-iMX95-SMARC SOM-iMX95-SMARC specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode JPEG Encoder, JPEG Decoder AI Accelerator – NXP eIQ Neutron 2 TOPS neural processing […]

December 11, 2025June 11, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

iWave Systems iG-RainboW-G69M TI AM62L OSM Size-S system-on-module powers Raspberry Pi-sized SBC

Yesterday, I wrote about the Beacon AM62L SoM, one of the first system-on-module based on Texas Instruments AM62L dual-core Cortex-A53 SoC for low-power IoT and HMI applications. It turns out there’s another AM62L module compliant with the OSM Size-S standard, along with a Raspberry Pi-sized carrier board. iWave Systems iG-RainboW-G69M is a 30x30mm CPU module with 1GB or 2GB LPDDR4, 8GB eMMC flash by default, and 332 LGA contacts exposing interfaces such as RGB LCD and MIPI CSI display interfaces, dual gigabit Ethernet, I2S audio, USB 2.0 interfaces, and a range of low-speed I/Os. iWave Systems iG-RainboW-G69M specifications: SoC – Texas Instruments AM62Lx CPU – Dual-core Arm Cortex-A53 processor up to 1.25GHz Cache – 32KB L1 D-cache, 32KB L1 I-cache per core; shared 256KB L2 cache System Memory – 1GB LPDDR4, expandable up to 2GB Storage 8GB eMMC flash (other capacities available upon request) 32Kbit EPPROM 332 LGA contacts Storage […]

October 21, 2025October 21, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

TechNexion unveils SO-DIMM and OSM system-on-modules based on Synaptics SL2610

Last week, we wrote about the Synaptics SL2610 Edge AI SoC family integrating Google’s open-source Coral NPU, and the first system-on-modules have already been announced, courtesy of TechNexion. The AIOM-SL2610 is a 260-pin SO-DIMM CPU module with a Realtek RTL8211F Gigabit Ethernet transceiver, a WiFi 6E and Bluetooth 6.0 module, and an on-module JTAG debug interface, while the OSM-SL260 is a smaller, lighter, solder-down module compliant with the OSM Size S specification. Both come with up to 2GB LPDDR4 memory, 64GB eMMC flash, and Arm PSA Level 2 or 3 security. TechNexsion AIOM-SL2610 SO-DIMM system-on-module AIOM-SL2610 specifications: SoC – Synaptics SL2610 (SL2613, SL2617, or SL2619) Application cores – Single and dual-core Arm Cortex-A55 @ up to 2.0 GHz Real-time cores – Arm Cortex-M52 with Helium System Manager (SM) domain, 256KB SRAM GPU – Optional Arm Mali-G31 3D GPU NPU (Optional) – Transformer-capable Torq and Coral NPU (RISC-V ML Core) for […]

October 14, 2025October 15, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK OSM-IMX95 – An NXP i.MX 95 OSM Size-L system-on-module for IoT and industrial applications

ADLINK OSM-IMX95 is an OSM Size-L solder-on system-on-module powered by an NXP i.MX 95 hexa-core Arm Cortex-A55 SoC with an up to 2 TOPS eIQ Neutron NPU/AI accelerator. It follows the OSM-IMX93 OSM Size-L module based on NXP i.MX 93 SoC, but features a more powerful SoC, up to 16GB LPDDR4L RAM, up to 256GB eMMC flash, and high-speed interfaces like USB 3.0 and PCIe Gen3. The new NXP i.MX 95 OSM module is designed for Smart Home, Smart Building, Smart City, medical, and Industry 4.0 applications. ADLINK OSM-IMX95: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 cores @ up to 1.8 GHz Real-time co-processors – Arm Cortex-M7 @ 800MHz and Cortex-M33 @ 250MHz 2D/3D Graphics Acceleration Arm Mali-G310 3D GPU with OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0 2D GPU Video Encode / Decode – 4Kp30 H.265 and H.264 AI/ML – 2 TOPS eIQ Neutron NPU System […]

October 1, 2025September 30, 2025 by Debashis Das - 1 Comment

ARIES MSRZG3E OSM-compliant SiP with Renesas RZ/G3E MPU targets industrial HMI and Edge AI

ARIES Embedded MSRZG3E OSM compliant SiP

ARIES Embedded MSRZG3E is an OSM-compliant system-in-package (SiP) built around the Renesas RZ/G3E MPU, designed for HMI, industrial, medical, and edge AI applications. The Renesas RZ/G3E SoC integrates a quad-core Arm Cortex-A55 CPU, a Cortex-M33 real-time core, and an Ethos-U55 NPU delivering up to 512 GOPS for AI power. Other features include PCIe Gen3, USB 3.2, dual Gigabit LAN, plus CAN FD, UART, I2C, SPI, and ADC. Multimedia support includes dual displays, MIPI-CSI camera input, and H.264/H.265 video codec. The SiP ships with 512 MB to 8 GB LPDDR4 RAM and 4 GB to 64 GB eMMC flash, with commercial and industrial-grade temperature support. MSRZG3E MSRZG3E SiP specifications: SoC – Renesas RZ/G3E dual or quad Arm Cortex-A55, Arm Cortex-M33 core MCU Memory – 512 MB to 8 GB LPDDR4 RAM Storage 4 GB to 64 GB eMMC NAND flash 2 Mbit to 512 Mbit SPI NOR flash 476-pad land grid […]