osm

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

ADLINK OSM-MTK510 – An OSM Size-L module with MediaTek Genio 510 AI SoC, up to 8GB RAM and 128GB eMMC flash

OSM-MTK510

ADLINK OSM-MTK510 is an OSM Size-L compliant module powered by a MediaTek Genio 510 hexa-core Arm Cortex-A78/A55 SoC with a 3.2 TOPS AI accelerator and equipped with up to 8GB LPDDR4 and 128GB eMMC flash. The OSM module supports HDMI 2.0, MIPI DSI, and eDP display interfaces, up to 30MP cameras, and I/O options such as gigabit Ethernet, USB 3.0, and PCIe Gen2 x1. The OSM-MTK512 is available in either commercial or industrial (-40°C to 85°C) temperature grades and the company offers at least a 10-year lifecycle for long-term use. ADLINK OSM-MTK510 specifications: SoC – MediaTek Genio 510 (MT8370) CPU – Hexa-core processor with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz GPU – Arm Mali-G57 MC2 GPU VPU for visual processing Encoding up to 4Kp30 with H.265/HEVC or H.264 Decoding up to 4Kp60, AV1, VP9, HEVC, H.264 codecs supported AI […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iWave Systems iW-RainboW-G54S credit card-sized SBC features an STM32MP133/MP135 OSM Size-S module

iW-RainboW-G54S credit card-sized OSM SBC

iWave Systems iW-RainboW-G54S is a credit card-sized SBC fitted with an OSM Size-S (30x30mm) system-on-module based on STM32MP133 or STM32MP135 Cortex-A7 SoC with up to 1GB RAM, and up to 128GB flash. Interfaces include a Gigabit Ethernet port, a USB Type-A port, an 18-bit RGB LCD display interface, and three 100-pin high-density connectors for additional I/Os. The iW-RainboW-G54S SBC is designed for industrial applications with a temperature range of -40 to +85°C. While it’s fitted with an OSM Size-S module, we’ll also notice the carrier board has a footprint for OSM Size-M (45x30mm) and OSM Size-L (45x45mm) modules indicating it will be used with other OSM modules in the future. iWave Systems iW-RainboW-G54S specifications: System-on-Module – iW-RainboW-G54M SoC (one or the other) STMicro STM32MP133 single-core Cortex-A7 with or without Secure boot + Cryptography; for headless applications STMicro STM32MP135 single-core Cortex-A7 with or without Secure boot + Cryptography; supports LCD-TFT parallel […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93 is an OSM Size-L module based on NXP i.MX 93 SoC

ADLINK OSM-IMX93

ADLINK OSM-IMX93 is an OSM r1.1 Size-L module based on NXP i.MX 93 Arm Cortex-A55 & Cortex-M33 AI processor, and the first from the company to comply with the Open Standard Module (OSM) standard. The 45x45mm module is fitted with up to 2GB LPDDR4L, 128GB eMMC flash, an optional WiFi/Bluetooth module, and its 662 contacts provide a range of interfaces that include LVDS and DSI graphics output, 2x GbE (including 1x TSN capable), 2x CAN bus, I2S audio codec interface, USB2 interfaces, and more. ADLINK OSM-IMX93 specifications: SoC – NXP i.MX 93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – PXP 2D GPU with blending/composition, resize, color space conversion NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Memory – 640 KB OCRAM w/ ECC Security – EdgeLock Secure Enclave System Memory – 1 or 2GB LPDDR4L Storage […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on MaaXBoard OSM93 – Business card-sized SBC features NXP i.MX 93 AI SoC, supports Raspberry Pi HATs

MaaXBoard OSM93 – Business card-sized SBC features NXP i.MX 93 AI SoC, supports Raspberry Pi HATs

MaaXBoard OSM93 SBC

MaaXBoard OSM93 is a single board computer (SBC) based on a Size-S OSM module powered by an NXP i.MX 93 Cortex-M55/M33 AI SoC and offered in a business card form factor with support for Raspberry Pi HAT boards through a 40-pin GPIO header and mounting holes. The board also comes with 2GB LDDR4, 16GB eMMC flash, MIPI CSI and DSI interfaces for optional camera and display modules, two gigabit Ethernet ports, optional support for WiFi 6, Bluetooth 5.3, and 802.15.4, three USB 2.0 ports, and two CAN FD interfaces with on-board transceivers. MaaXBoard OSM93 specifications: SoC – NXP i.MX93 CPU 2x Arm Cortex-A55 up to 1.7 GHz 2x Arm Cortex-M33 up to 250 MHz GPU – 2D GPU with blending/composition, resize, color space conversion NPU – 1x Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS Memory – 640 KB OCRAM w/ ECC Security – EdgeLock Secure Enclave System […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on iW-RainboW-G55M is an OSM-LF compliant module based on TI AM62A Cortex-A53 processor

iW-RainboW-G55M is an OSM-LF compliant module based on TI AM62A Cortex-A53 processor

TI AM62Ax OSM Module

iWave Systems iW-RainboW-G55M is an OSM Size L compliant system-on-module based on Texas Instruments AM62A single to quad-core Cortex-A53 processor with up to 8GB RAM, 128GB eMMC flash, and a wireless module with WiFi 6, Bluetooth 5.2, and 802.15.4 radios. The iW-RainboW-G55M can leverage the vision processing and deep learning accelerator and the Arm Cortex-R5F real-time cores for control and device management found in the AM62A processor, as well as its display and camera interfaces, peripheral and networking options, to develop products for “man-machine applications at the edge”. iW-RainboW-G55M SoM specifications: SoC – Texas Instruments AM62A SoC (AM62A3, AM62A3-Q1, AM62A7, or AM62A7-Q1) Application processor – Up to four Arm Cortex- A53 cores @ 1.4GHz Real-time cores 1x Cortex-R5F @ 800MHz (MPU Channel with FFI) 1x Cortex-R5F @ 800MHz to support Device Management C7xV-256 Deep Learning Accelerator up to 2 TOPS System Memory – 2GB (default) to 8GB LPDDR4 RAM Storage […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on OSM Size M SiP Integrates STM32MP1 MPU for industrial & IoT applications

OSM Size M SiP Integrates STM32MP1 MPU for industrial & IoT applications

MSMP1 STM32MP1 SiP

ARIES Embedded MSMP1 OSM-compatible system-in-package (SiP) based on STM32MP1 CortexA7/M4 microcontroller for Industrial and IoT applications follows the company’s MSRZG2UL and MSRZFive OSM-compatible SiPs with Renesas Arm or RISC-V microprocessor introduced a few months ago. But instead of coming in the ultra-compact 30×30 mm OSM Size S form factor, the new MSMP1 complies with the larger 45x30mm OSM Size M form factor with a total of 476 contacts to allow for more I/Os. The SiP also integrates 512 MB to 4 GB DDR3L RAM, and 4 to 64 GB eMMC flash. MSMP1 SIP specifications: SoC – STMicro STM32MP1 single or dual-core Arm Cortex-A7 processor up to 800MHz, with Arm Cortex-M4 real-time core up to 209MHz, Vivante GPU compatible with OpenGL ES 2.0 System Memory – 512MB – 4GB DDR3L RAM Storage – 4GB – 64GB eMMC NAND Flash 476-contact LGA with Networking – Gigabit Ethernet USB – USB 2.0 Host/OTG […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 2 Comments on OSM Size-0 solder-on LGA module comes with ESP32 WiFi & BLE MCU

OSM Size-0 solder-on LGA module comes with ESP32 WiFi & BLE MCU

OSM Size-0 ESP32 module

German embedded systems company iesy’s ESP32 OSM-0F is an ESP32-based solder-on LGA system-on-module that complies with SGET OSM Size-0 (30x15mm) form factor, offers WiFi and Bluetooth connectivity, and more. The SGET Open Standard Module (OSM) standard defines four module sizes, namely Size-0 (30x15mm), Size-S (30x30mm), Size-M (45x30mm), and Size-L (45x45mm), and all the modules we’ve covered so far were powered by a Linux-capable processor. But it’s more challenging, albeit not impossible, to design a Linux-capable OSM Size-0 module, and that form factor is better suited to microcontroller-class chips like ESP32. (Technically, ESP32 can run Linux, but it’s more for show that any practical applications) ESP32 OSM-0F specifications: Microcontroller – Espressif ESP32 dual-core Xtensa LX6 MCU @ 240 MHz with 512KB RAM, Wi-Fi 802.11 b/g/n and Bluetooth/BLE Storage – 32 Mbit SPI flash Antenna – u.FL connector 188 LGA contact points with Storage – SDIO Networking – 1x 10/100M Ethernet (RMII), […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on ARIES Embedded unveils OSM modules based on Renesas Arm or RISC-V microprocessor

ARIES Embedded unveils OSM modules based on Renesas Arm or RISC-V microprocessor

In another case of “Arm or RISC-V? Why not both“, ARIES Embedded has introduced “MSRZG2UL” and “MSRZFive” OSM compliant system-in-packages (SIPs) based on respectively Renesas RZ/G2UL Arm Cortex-A55/Cortex-M33 and RZ/Five AX45MP RISC-V microprocessors and designed for industrial controllers, IoT devices, and embedded systems with a basic GUI. Both solder-on modules come in the OSM Size S form factor (30x30mm), 512MB to 4GB of DDR4 RAM, a 4GB eMMC NAND flash, various interfaces including Gigabit Ethernet and CAN-FD, and are available in either commercial (-0°C to +70°C) or industrial (-40°C to +85°C) temperature ranges. “MSRZG2UL” and “MSRZFive” specifications: SoC MSRZG2UL module – Renesas RZ/G2UL single-core Cortex-A55 processor @ up to 1GHz with Cortex-M33 real-time core @ up to 200MHz MSRZFive module – Renesas RZ/Five single-core RISC-V AX45MP processor @ to 1.0 GHz System Memory – 512MB – 4GB DDR4 RAM Storage – 4GB eMMC NAND Flash 332 contacts with Display I/F […]

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