ARIES Embedded unveils OSM modules based on Renesas Arm or RISC-V microprocessor

In another case of “Arm or RISC-V? Why not both“, ARIES Embedded has introduced “MSRZG2UL” and “MSRZFive” OSM compliant system-in-packages (SIPs) based on respectively Renesas RZ/G2UL Arm Cortex-A55/Cortex-M33 and RZ/Five AX45MP RISC-V microprocessors and designed for industrial controllers, IoT devices, and embedded systems with a basic GUI.

Both solder-on modules come in the OSM Size S form factor (30x30mm), 512MB to 4GB of DDR4 RAM, a 4GB eMMC NAND flash, various interfaces including Gigabit Ethernet and CAN-FD, and are available in either commercial (-0°C to +70°C) or industrial (-40°C to +85°C) temperature ranges.

Renesas Arm & RISC-V OSM module

“MSRZG2UL” and “MSRZFive” specifications:

  • SoC
    • MSRZG2UL moduleRenesas RZ/G2UL single-core Cortex-A55 processor @ up to 1GHz with Cortex-M33 real-time core @ up to 200MHz
    • MSRZFive moduleRenesas RZ/Five single-core RISC-V AX45MP processor @ to 1.0 GHz
  • System Memory – 512MB – 4GB DDR4 RAM
  • Storage – 4GB eMMC NAND Flash
  • 332 contacts with
    • Display I/F – Parallel LCD interface (MSRZG2UL only)
    • Camera I/F – MIPI CSI (MSRZG2UL only)
    • 2x 10/100/1000MBit Ethernet
    • USB – USB 2.0 Host/OTG
    • 2x CAN
    • Low-speed I/Os – UART, I2C, SPI
    • Analog input – ADC
  • Dimensions – 30 x 30 mm, compliant with the SGET OSM standard
  • Temperature Range – Commercial: 0°C..+70°C; industrial: -40°C..+85°C

solder-on osm module renesas RZ/G2UL

Renesas RZ/G2UL and RZ/Five microprocessors are pin-to-pin compatible, so the PCB should be the same for both modules. An important difference is that the RISC-V microprocessor lacks display/camera interfaces. ARIES Embedded did not mention anything about software, but we know that both Renesas Arm and RISC-V microprocessors support the Civil Infrastructure Platform (CIP) Linux designed for industrial applications with over 10 years of support. The company has also been incorporated into Renesas’ Preferred Partner Program, so they work in close collaboration with the Japanese silicon vendor.

The MSRZG2UL and MSRZFive SiPs will be available as samples from Q3 2022, while mass production will start in Q4 2022. ARIES Embedded will also present the new system-in-packages publicly for the first time at Embedded World 2022, stand 108 in hall 5 in Nuremberg, Germany, from June 21 to 23. More information may be found in the product pages for the Arm and RISC-V modules.

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