Lantronix Open-Q 2210RB and 4210RB SiPs for robotics power RB1/RB2 development kit

Open-Q RB1 RB2 Development Kit with Qualcomm QRB2210 or QRB4210

What comes after Qualcomm Robotics RB3, RB5, and RB6 platforms? Apparently, it’s Qualcomm Robotics RB1 and RB2 platforms powered by Qualcomm QRB2210 and Qualcomm QRB4210 processors respectively and optimized for cheaper, smaller robots with lower power consumption. But Qualcomm is one of the lamest companies known to man, so they did not include any photos when announcing the Robotics RB1 and RB2 platforms, so I’ll focus this post on Lantronix Open-Q 2210RB and 4210RB system-in-packages (SiP) based on the same processors, as well as the Open-Q RB1/RB2 development kit. Open-Q 2210RB and 4210RB SiP The new system-in-packages are very similar to the earlier Open-Q 2290CS and 4290CS SIPs for industrial IoT and machine vision applications, with the only difference being the Qualcomm processor used, so I invite you to read the earlier post for the full details, and I’ll just provide summaries here. Open-Q 2210RB key features: SoC – Qualcomm […]

Qualcomm-based Open-Q 2290CS and 4290CS SIPs target industrial IoT and machine vision applications

Open-Q AL2 96Boards SBC and Mezzanine with Camera, Display, sensors

Lantronix has just unveiled two new System-in-Packages (SiP) with the entry-level Open-Q 2290CS SIP based on Qualcomm QCS2290 quad-core Cortex-A53 processor designed for industrial IoT applications and safety vehicle equipment control, and the pin-compatible, mid-range Open-Q 4290CS SIP based on Qualcomm QCS4290 octa-core Kryo 260 CPU for applications requiring artificial intelligence and machine learning capabilities. The Open-Q 2290CS module comes with 2GB LPDDR4, 16GB eMMC flash, WiFi 5 and Bluetooth 5.0 connectivity, while the Open-Q 4290CS module is equipped with up to 6GB LPDDR4, up to 256GB eMMC flash., and Wi-Fi 5 with some Wi-Fi 6 features (TWT & 8SS), and Bluetooth 5.1. Lantronix also offers the Open-Q AL2 development kit supporting either both SIP modules for evaluation and rapid prototyping. Open-Q 2290CS – Qualcomm QCS2290 SiP Specifications: SoC – Qualcomm QCS2290 quad-core Cortex-A53 processor at up to 2.0 GHz with Adreno 702 GPU at 845 MHz with support for […]

OSM Size M SiP Integrates STM32MP1 MPU for industrial & IoT applications

MSMP1 STM32MP1 SiP

ARIES Embedded MSMP1 OSM-compatible system-in-package (SiP) based on STM32MP1 CortexA7/M4 microcontroller for Industrial and IoT applications follows the company’s MSRZG2UL and MSRZFive OSM-compatible SiPs with Renesas Arm or RISC-V microprocessor introduced a few months ago. But instead of coming in the ultra-compact 30×30 mm OSM Size S form factor, the new MSMP1 complies with the larger 45x30mm OSM Size M form factor with a total of 476 contacts to allow for more I/Os. The SiP also integrates 512 MB to 4 GB DDR3L RAM, and 4 to 64 GB eMMC flash. MSMP1 SIP specifications: SoC – STMicro STM32MP1 single or dual-core Arm Cortex-A7 processor up to 800MHz, with Arm Cortex-M4 real-time core up to 209MHz, Vivante GPU compatible with OpenGL ES 2.0 System Memory – 512MB – 4GB DDR3L RAM Storage – 4GB – 64GB eMMC NAND Flash 476-contact LGA with Networking – Gigabit Ethernet USB – USB 2.0 Host/OTG […]

X1501 Pico SoM – MIPS, Linux in a 16x16mm module

SudoMaker X1501 Pico EVB

We’ve just written about the Notkia phone repurposing Nokia 168x phones with a new PCB featuring an Ingenic X1000E MIPS processor running mainline Linux, but it turns out the developer (Reimu NotMoe, CTO of SudoMaker) has also designed the X1501 Pico SoM, a tiny 16×16 system-on-module equipped with Ingenic X1501 MIPS system-in-package (SiP). The module can be that small because the single-core 1GHz Ingenic 1501 SiP embeds 8MB LPDDR, as well as apparently a 16Mbit NOR flash that stores stripped-down versions of U-boot and the Linux kernel, plus a minimal, busybox-based rootfs. X1501 Pico system-on-module specifications: SoC – Ingenic X1501 MIPS32r2 processor @ 1GHz, a MIPSr2 real-time core @ 300 MHz (not shown in datasheet), 8MB LPDDR and 16KB tightly coupled SRAM, 16Mbit NOR flash Castellated holes with USB 2.0 OTG, I2C, SPI, SDIO and DVP, analog mono audio output & digital microphone input EFUSE based Secure Boot Power Management […]

POP32 & POP64 SIPs combine Allwinner A33 and A133 with SDRAM into a single package

POP32 POP64 Allwinner SIPs

Kettlepop is a board based on Allwinner GR8 system-in-package (SiP) with an Allwinner R8/A13 Arm Cortex-A8 CPU and 256MB RAM, and itself a derivative of the CHIP Pro board from Next Thing Co that closed doors a few years ago. Source Parts has just posted an update explaining that the GR8 SiP is not available anymore, so they worked on their own SiPs: POP32 and POP64. POP32 combines an Allwinner A33 quad-core Cortex-A7 processor with 128MB DDR4, while POP64 features an Allwinner A133 quad-core Cortex-A53 processor with 1GB LPDDR4. POP32 system-in-package POP32 highlights: SoC – Allwinner A33 quad-core Arm Cortex-A7 processor with Arm Mali-400 MP2, 1080p60 H.264, VP8, MPEG 1/2/4, JPEG/MJPEG video decoding, 1080p60 H.264 video encoding Memory – Built-in 128MB DDR3 Peripherals from SoC Storage I/F – NAND flash, 3x SD/MMC Display – MIPI DSI, LVDS, RGB LCD up to 1280×800 resolution Camera I/F – Parallel camera interface up […]

OSZU3 System-in-Package (SiP) combines AMD Xilinx Zynq UltraScale+ MPSoC with 2GB RAM, PMIC, passive components

OSZU3 system-in-package

Octavo Systems has collaborated with AMD Xilinx for the OSZU3 system-in-package (SiP) that combines Zynq UltraScale+ MPSoC ZU3 with up to 2GB RAM, power management circuitry, and other components into a compact (40×20.5mm) 600-ball BGA package. We’ve already written about other Octavo Systems SiPs in the past with solutions like OSD3358x (TI Sitara AM3358) and OSD32MP15x (STMicro STM32MP1), but the OSZU3 packs a much more powerful and flexible chip with the AMD Xilinx Zynq UltraScale+ MPSoC offering both Cortex-A53 & Cortex-R5F cores, Arm Mali-400 GPU, and FPGA fabric.   Octavo Systems OSZU3 SiP specifications: SoC – AMD Xilinx Zynq UltraScale+ MPSoC ZU3 with CPU – 4x Arm Cortex-A53 up to 1.2GHz, 2x Arm Cortex-R5F up to 500MHz GPU – Arm Mali-400 FPGA 154K System Logic Cells 141K Flip-Flops 71K CLB LUTs 360 DSP Slices 7.6 Mb Block RAM System Memory – 2GB LPDDR4 Storage – 128MB SQPI, and 4K EEPROM (by […]

Omnichip Devkit 2 Features Nordic nRF52832 based zGlue ZiP Multichip Module

zGlue Omnichip Devkit

We first covered zGlue Integration Platform (ZiP) in 2018 when the company introduced its chip-stacking technology with a fitness tracker based on ZGZL1BA ZiP equipped with chips from Dialog Semiconductor, Analog Devices, Macronix, MCube and others. The concept is similar to SiP (System-in-Package), but zGlue claims the costs and lead times are much lower with the technology. Earlier this year, ZiP was back in the news thanks to Antmicro GEM custom RISC-V/Arm ASIC, and today, I was informed about zGlue Omnichip devkit 2 that is equipped with a ZiP of the same name, and that can be used to evaluate the technology. zGlue OmniChip ZiP zGlue OmniChip ZiP is a multichip module with the following ICs (aka Chiplets) and specifications: Nordic Semiconductor nRF52832 Cortex-M4F microcontroller with Bluetooth LE and NFC connectivity Texas Instruments BQ25120AYFPR battery charger, buck regulator Maxim Integrated MAX86140ENP+ optical pulse oximeter Texas Instruments TMP108AIYFFR temperature sensor Bosch […]

Octavo Systems Unveils OSD32MP15x STM32MP1 SiP (System-in-Package)

Octavo Systems OSD32MP15X STM32MP1 SiP

STMicro STM32MP1 is one of the most interesting microprocessor recently announced, as it should allow a relatively easy upgrade path for projects based on the traditional STM32 Cortex-M4 microcontrollers, thanks to backward compatibility, and the extra one or two Arm Cortex-A7 cores enabling Linux support. We’ve already seen several upcoming evaluation and development boards based on STM32MP157 processor including STMicro’s own discovery kits and evaluation platform, as well as Arrow Electronics Avenger96 board fitted with a tiny 29x29mm SoM.  But I suspect we could see even more compact designs soon, as Octavo Systems has now unveiled OSD32MP15x system-in-package with STM32MP15x MPU, up to 1GB RAM, 4K EEPROM, STPMIC1 power management IC, two oscillators, and over 100 passive components all brought together into a 18x18mm package. Octavo Systems OSD32MP15x system-in-package main components and specifications: MPU (MicroProcessor Unit) – STMicroelectronics STM32MP15x with Dual Arm Cortex-A7 @ 650MHz, Arm Cortex-M4 real-time core @ […]

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