Octavo OSD32MP2 System-in-Package (SiP) packs an STM32MP25 SoC, DDR4, EEPROM, and passive components into a single chip

Octavo Systems OSD32MP2 is a family of two System-in-Package (SiP) modules, comprised of the OSD32MP2 and OSD32MP2-PM, based on the STMicro STM32MP25 Arm Cortex-A35/M33 AI processor, DDR4 memory, and various components to reduce the complexity, size, and total cost of ownership of solutions based on the STM32MP2 chips.

The OSD32MP2 is a larger, yet still compact, 21x21mm package with the STM32MP25, DDR4, EEPROM, oscillators, PMIC, passive components, and an optional RTC, while the OSD32MP2-PM is even smaller at 14x9mm and combines the STM32MP25, DDR4, and passive components in a single chip.

OSD32MP2 specifications:

• SoC – STMicro STM32MP25
  • CPU – Up to 2x 64-bit Arm Cortex-A35 @ 1.5 GHz
  • MCU
    • 1x Cortex-M33 @ 400 MHz with FPU/MPU;
    • 1x Cortex M0+ @ 200 MHz in SmartRun domain
  • GPU – VeriSilicon 3D GPU @ 900 MHz with OpenGL ES 3.2 and Vulkan 1.2 APIs support
  • VPU – 1080p60 H.264, VP8 video decoder/encoder
  • Neural Processing Unit – 1.35 TOPS
• System Memory – DDR4
• Storage – EEPROM
• Access to All STM32MP2 peripherals via 437-ball BGA including
  • Display – 4-lane MIPI DSI, LVDS, and 24-bit parallel display interfaces up to 1080p60 resolution
  • Camera – 2-lane MIPI CSI-2 camera interface
  • Networking – 2 + 1 (Switch) Gigabit Ethernet with TSN support
  • USB and PCIe
    • PCIe Gen2 1 lane + USB2.0 Host/Device HS OR USB 3.0 Type-C
    • USB 2.0 Host HS
  • Analog – 3x ADCs
  • Misc – 3x CAN-FD/TTCAN, 3x SDIO, and more
• Other components – Oscillators, passive components, optional RTC
• Power Management
  • PMIC – STPMIC2
  • All Power sequencing handled internally in SiP
  • Rails available for system users.
• Dimensions – 21 x 21mm BGA package (437-ball BGA) with 1.0mm BGA spacing
• Temperature Range – 0° to 85° C, or -40° to 85°C

The OSD32MP2-PM is a smaller version of the OSD32MP2 still with the STM32MP25 processor, DDR4, and passive components, but without EEPROM, oscillators, and RTC.

OSD32MP2-PM key features:

• SoC – STMicro STM32MP25 as described above
• System Memory – DDR4
• Access to All STM32MP2 peripherals via 500-ball BGA including
  
  • Display – 4-lane MIPI DSI, LVDS, and 24-bit parallel display interfaces up to 1080p60 resolution
  • Camera – 2-lane MIPI CSI-2 camera interface
  • Networking – 2 + 1 (Switch) Gigabit Ethernet with TSN support
  • USB and PCIe
    • PCIe Gen2 1 lane + USB2.0 Host/Device HS OR USB 3.0 Type-C
    • USB 2.0 Host HS
  • Analog – 3x ADCs
  • Misc – 3x CAN-FD/TTCAN, 3x SDIO, and more
• Other components – Passive components
• Dimensions – 17 x 9mm BGA package (500-ball BGA) with 0.5mm BGA spacing
  
• Temperature Range – 0° to 85° C, or -40° to 85°C

Octavo Systems has a longer history of providing system-in-package solutions based on Texas Instruments and STMicro chip starting with the OSD3358 SiP with a TI Sitara AM3358 introduced in 2016 and found in the PocketBone SBC.  Their first SiP based on an STMicroelectronics chip was unveiled in 2019 with the OSD32MP15x mixing the STM32MP1 SoC with up to 1GB DDR3L and various other chips.

Advantages of using a system-in-package instead of rolling up your own board with an STM32MP2 processor include a simpler PCB design without having to take care of the high-speed DDR4 interface and power management, smaller board with Octava Systems claiming up to 60% reduction in board area, and a lower total cost of ownership since the PCB design time can be greatly reduced, by up to nine months according to the company, although I find that estimation potentially excessive… It also lowers PCB and assembly costs and makes the customer’s supply chain simpler to handle since fewer components are required.

Octavo Systems states samples of the OSD32MP2-PM will be available at the end of 2024, and OSD32MP2 samples are expected to follow in early 2025. Further information may be found on the products page and in the announcement.

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