Qualcomm-based Open-Q 2290CS and 4290CS SIPs target industrial IoT and machine vision applications

Lantronix has just unveiled two new System-in-Packages (SiP) with the entry-level Open-Q 2290CS SIP based on Qualcomm QCS2290 quad-core Cortex-A53 processor designed for industrial IoT applications and safety vehicle equipment control, and the pin-compatible, mid-range Open-Q 4290CS SIP based on Qualcomm QCS4290 octa-core Kryo 260 CPU for applications requiring artificial intelligence and machine learning capabilities.

The Open-Q 2290CS module comes with 2GB LPDDR4, 16GB eMMC flash, WiFi 5 and Bluetooth 5.0 connectivity, while the Open-Q 4290CS module is equipped with up to 6GB LPDDR4, up to 256GB eMMC flash., and Wi-Fi 5 with some Wi-Fi 6 features (TWT & 8SS), and Bluetooth 5.1. Lantronix also offers the Open-Q AL2 development kit supporting either both SIP modules for evaluation and rapid prototyping.

Open-Q 2290CS – Qualcomm QCS2290 SiP

Lantronix Open-Q 2290CSSpecifications:

  • SoC – Qualcomm QCS2290 quad-core Cortex-A53 processor at up to 2.0 GHz with Adreno 702 GPU at 845 MHz with support for OpenGL ES 3.1, Vulkan 1.1, OpenCL 2.0, Hexagon QDSP6 v66 DSP, 1080p 30 fps encode / 1080p 30fps decode
  • System Memory – 2GB LPDDR4
  • Storage – 16GB eMMC flash
  • Wireless – WiFi 5 802.11 a/b/g/n/ac 1×1 and Bluetooth 5.0 with WCN3950 chipset
  • GNSS – External GNSS circuitry and WGR7640 chip with support for Gen 9, GPS, Glonass, BeiDou, Galileo, QZSS, SBAS, NavIC.
  • LGA pads
    • External Storage – SD card
    • Display Interface – 4-lane MIPI DSI D-PHY 1.2 up to HD+ (1680×720) @ 60 fps
    • Camera Interfaces
      • 2x 4-lane MIPI CSI
      • Two cameras: 13 MP +13 MP @ 30fps
      • One camera: 25MP @ 30fps
    • Audio – 4x DMIC, support for two voice activation engines, integrated low power island for voice activation, supports always-on noise suppression
    • USB – USB 3.1
    • Low-speed I/Os – SDIO, UART, SPI, I2C, I3C, GPIO
  • Battery Charger
  • Dimensions – 35 x 35 x 2.8mm (SIP LGA)
  • Temperature Range – Extended: -25°C to 85°C
  • Certifications – FCC, RED

Open-Q 2290CS LGA SiP

The module runs Android 12 Go, and target markets include industrial HMI IoT applications, POS/kiosks, vending machines, exercise equipment displays, camera applications, and entry-level robotics notably in warehouses and for logistics operations.

Open-Q 4290CS – Qualcomm QCS4290 system-in-package

Lantronix Open-Q 4290CS

Specifications:

  • SoC – Qualcomm QCS4290
    • CPU – Octa-core Qualcomm Kryo 260 at up to 2.0 GHz
    • GPU – Qualcomm Adreno 610 with OpenGL ES 3.1, Vulkan 1.1, OpenCL 2.0
    • DSP – Qualcomm Hexagon 683
    • VPU
      • Decode: Up to 1080p60 8-bit H.264, 1080p60 8-bit HEVC (H.265), VP9
      • Encode: Up to 1080p60 8-bit HEVC (H.265), 1080p60 8-bit H.264
    • AI – Up to 1.7 TOPS
  • System Memory – 2 to 6GB LPDDR4
  • Storage – 16 to 256GB eMMC flash
  • Wireless – WiFi 5 802.11 a/b/g/n/ac with Wi-Fi 6 features such as 8×8 sounding & Target Wake Time (TWT), 1×1, Bluetooth 5.1, and FM RDS/RBDS
  • GNSS – External GNSS circuitry and WGR7640 chip with support for Gen 9, GPS, Glonass, BeiDou, Galileo, QZSS, SBAS, NavIC.
  • Audio codec – WCD9370 with Qualcomm SoundWire support
  • LGA pads
    • External Storage – SD card
    • Display interface – 4-lane MIPI DSI, D-PHY 1.2 (1.5 Gbps / lane) up to FHD+ (1080 × 2520)
    • Camera Interfaces
      • 3x 4-lane MIPI CSI
      • Three cameras: 13 MP + 13 MP + 5 MP or 13 MP + 8MP + 8 MP
      • Two cameras: 25 MP + 5 MP or 21 MP + 8 MP
      • (13 MP + 13 MP) / (25 MP + 5 MP) at 30 fps, or 16 MP + 16 MP at 24 fps
    • Audio – Qualcomm SoundWire, 4x DMIC
    • USB – USB 3.1 Type C
    • Low-speed I/Os – SDIO, UART, SPI, I2C, I3C, GPIO
  • Battery Charger
  • Dimensions – 36 x 36 x 2.76mm (SIP LGA)
  • Temperature Range – Extended: -25°C to 85°C
  • Certifications – FCC, RED

Open-Q 4290CS LGA SiP

The Qualcomm QCS4290 systemin-package supports Android 12 Go, as well as Android 12. It’s expected to be found in Smart surveillance cameras, dash cameras, body cameras, fleet management systems with video analytics, warehouse and logistic robots, rugged handheld computers, interactive display boards, and drones.

Open-Q AL2 development kit

Qualcomm QCS4290 development board

The company also provides a development kit with a 96boards-compliant carrier board that takes either system-in-package (since they are pin-to-pin compatible) and a mezzanine board with camera and display connectors, as well as some sensors and sensor interfaces.

Open-Q AL2 specifications:

  • Supported SiP – Open-Q 2290CS and Open-Q 4290CS
  • Storage – MicroSD card slot
  • Display Interfaces
    • 4.99-inch RGB TFT LCD with 1280 x 720 resolution
    • HDMI Type-A port
  • Camera Interfaces
    • 2x 4-lane MIPI CSI
    • 1x 1-lane MIPI CSI
    • 1x 4-lane or 2-lane MIPI CSI
    • 2x GMSL2 camera inputs
  • Audio Interfaces
    • 4x Digital PMD mics
    • Speaker connectors
  • Networking
    • Gigabit Ethernet RJ45 port via USB 3.0 bridge
    • Antenna on interposer
  • USB – 1x USB Type-C port, 2x USB Type-A ports
  • I/O Interfaces
    • 3x Low-speed connectors compliant with 96Boards standard
    • 3x High-speed connectors compliant with 96Boards standard
  • Debugging – Debug UART, JTAG
  • Misc – 3x Infrared interfaces
  • Power Supply – 12V DC
  • Dimensions – 96Boards compliant

Open-Q AL2 96Boards SBC and Mezzanine with Camera, Display, sensors

Android 12 or/and Android 12 OS are supported and the development kit ships with a demo BSP.

Both modules and the development kit appear to be available now and for sale at an undisclosed price. More information may be found on the product pages for Open-Q modules and the development kit. A few additional details may also be found in the press release.

Share this:
FacebookTwitterHacker NewsSlashdotRedditLinkedInPinterestFlipboardMeWeLineEmailShare

Support CNX Software! Donate via cryptocurrencies, become a Patron on Patreon, or purchase goods on Amazon or Aliexpress

ROCK Pi 4C Plus

One Reply to “Qualcomm-based Open-Q 2290CS and 4290CS SIPs target industrial IoT and machine vision applications”

  1. Lantronix has introduced variants with the entry-level Open-Q 2210RB and mid-tier Open-Q 4210RB System-in-Package (SIP) chipset modules and Open-Q RB1 and RB2 Development Kits. It’s unclear whether the devkits are the Qualcomm Robotics RB1 and RB2 platforms introduced at Embedded World 2023, but they could be.

Leave a Reply

Your email address will not be published. Required fields are marked *

Khadas VIM4 SBC
Khadas VIM4 SBC