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February 11, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

PiLink PL-R5/R5M Series – IP20/IP65 Industrial PCs powered by Raspberry Pi CM5

Made by Japan-based PiLink, the PL-R5 and PL-R5M Series are compact industrial PCs powered by a Raspberry Pi Compute Module 5 (CM5) and offered with either IP20 or IP65 ingress protection rating. The PL-R5 Series provides one USB 3.0 port, one Gigabit Ethernet port, and 9V to 40V DC input, while the PL-R5M Series offers one USB 2.0 port, one 100 Mbps Ethernet port, an optional extra Gigabit Ethernet port, and a 10.7V to 28.8V DC input range. Both include optional WiFi 5 and Bluetooth, an M.2 B-Key socket for cellular, optional RS-232, RS-485, I2C interfaces, and more. The IP65 models are offered in Basic, Basic Plus (adds 4x analog inputs, 4x DI/DO), and USB (3x USB ports) configurations. The PL-R5 also adds a DIO CAN IP65 variant with two DI, two DO, and two CAN Bus interfaces. The IP20 variants have an even wider choice of options. PiLink PL-R5/R5M […]

February 3, 2026 by Jean-Luc Aufranc (CNXSoft) - 5 Comments

End-of-life notice for Samsung/Nexell S5P4418 processor

Samsung/Nexell S5P4418 SoC is being phased out, according to a somewhat recent post by EmbSoM/Graperain stating that the SoC was discontinued by the original manufacturer. Most people will likely not care about an old quad-core Cortex-A9 SoC being discontinued, but the S5P4418 was found in several interesting hardware platforms we’ve covered here, mostly from FriendlyELEC, previously FriendlyArm. This includes the FriendlyELEC Core4418, NanoPi2 and Fire2A SBCs, Samsung Artik 530 modules, and several others. Graperain provides more details about the end-of-life notice, notably the key dates for their products: Last Time Buy (LTB) – 2026-03-31 Last Shipment Date – 2026-09-30 This impacts the company’s S5P4418 system-on-module and the S5P4418 single board computer. The Samsung Artik family has been discontinued for several years, and if I look at the FriendlyELEC store, they only sell the Fire2A and Smart4418 CPU board without an end-of-life notice, but they should probably be subject to a similar […]

January 30, 2026January 30, 2026 by Debashis Das - No Comments

Forlinx OK153-S12 Mini – A low-cost Allwinner T153 SBC with Raspberry Pi GPIO header and long-term availability

Forlinx has introduced the OK153-S12 Mini, an Allwinner T153 SBC/development board, which looks to be a low-cost version of the OK153-S SBC that we previously covered. It keeps the same FET153-S SoM, but swaps the industrial terminal blocks, mini PCIe, and some other interfaces for a more compact footprint and a Raspberry Pi-compatible 40-pin header. The SBC supports up to 1 GB of DDR3 memory, up to 512 MB of NAND flash or 8 GB eMMC flash, and also features a microSD card slot for storage. Other interfaces include two Gigabit Ethernet ports, two USB Type-C ports for power, data, and debugging, and a USB 2.0 host port. Display is supported via an RGB LCD interface with backlight control via PWM. Other features include mono audio line-out via a 3.5mm headphone jack, multiple GPIOs, and buttons for reset, download, and user input, along with various status LEDs, and a 40-pin […]

January 30, 2026January 31, 2026 by Jean-Luc Aufranc (CNXSoft) - 33 Comments

Jupiter 2 – RVA23-compliant SBC features SpacemiT K3 octa-core RISC-V AI SoC, up to 32GB RAM, 256GB UFS

MILK-V Shenzhen Technology has just unveiled the Jupiter 2, the first RVA23-compliant RISC-V SBC powered by a 2.4 GHz SpacemiT K3 octa-core X100 CPU with up to 60 TOPS of AI performance, up to 32GB LPDDR5, 256GB UFS, and PCIe Gen3 x4 NVMe SSD support. Designed by SpacemiT themselves, the board also features an eDP connector, a 10GbE SFP+ cage, a Gigabit Ethernet RJ45 port, built-in WiFi 6 and Bluetooth 5.2 wireless connectivity, two USB Type-C connectors, four USB 2.0 ports, an M.2 Key-B socket coupled with a NanoSIM card slot for 4G LTE or 5G cellular connectivity, and more. Jupiter 2 specifications (preliminary): System-on-Module – K3-CoM260 (aka Jupiter 2 NX) SoC – SpacemiT K3 CPU 8x 64-bit RISC-V X100 “big” cores clocked up to 2.4 GHz, RVA23 compliance; 130 KDMIPS performance (similar to RK3588) 8x RISC-V A100 AI Cores with support for up to 1024-bit RVV1.0 parallel computing, optimized for […]

January 19, 2026January 19, 2026 by Jean-Luc Aufranc (CNXSoft) - 3 Comments

Bedrock RAI300 fanless industrial PC is powered by an AMD Ryzen AI 9 HX 370 mobile AI SoC

SolidRun Bedrock RAI300 is the first industrial PC powered by a 12-core/24-thread AMD Ryzen AI 9 HX 370 mobile processor, typically used in premium consumer and commercial AI laptops. The fanless industrial computer supports up to 128GB DDR5 SO-DIMM memory to run AI models on the 50 TOPS NPU (80 TOPS combined) of the AMD processor, up to three M.2 NVMe 2280 PCIe Gen4 x4 storage devices, up to four display through HDMI 2.1 and DP 2.1 video outputs, and features up to four 2.5 Gbps Ethernet ports, a USB4 port, four USB 3.2 ports, and more. It’s available in two models: a thin “Tile” model and a thicker “60W model” to cater to different TDP configurations, ranging from 8W to 54W, and cooling options. Bedrock RAI300 specifications: SoC – AMD Ryzen AI 9 HX 370 “Strix Point” CPU – 12-core/24-thread processor with four Zen 5 cores up to 2.0/5.1 […]

January 15, 2026 by Jean-Luc Aufranc (CNXSoft) - No Comments

Geniatech introduces SMARC and OSM system-on-modules powered by NXP i.MX 95 SoC

Geniatech NXP i.MX 95 SMARC OSM system-on-modules

Geniatech has released two new System-on-Modules (SoMs) powered by the NXP i.MX 95 Edge AI application processor: the OSM 1.1 Size L-compliant SOM-iMX95-OSM and the SMARC 2.1-compliant SOM-iMX95-SMARC. Both ship with up to 16GB LPDDR5 and up to 128GB eMMC flash, and are designed for markets such as smart retail, industrial automation, intelligent transportation, medical devices, and commercial IoT. Geniatech SOM-iMX95-SMARC SOM-iMX95-SMARC specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 1.8 GHz with 32KB I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode JPEG Encoder, JPEG Decoder AI Accelerator – NXP eIQ Neutron 2 TOPS neural processing […]

January 13, 2026January 12, 2026 by Debashis Das - 2 Comments

Radxa launches NX4 SoM with Rockchip RK3576(J) industrial SoC and NX4IO carrier board

Radxa NX4 is a 260-pin SO-DIMM SoM built around the Rockchip RK3576(J) octa-core Cortex-A72/A53 industrial SoC with a 6 TOPS NPU for edge AI workloads. It supports up to 16GB LPDDR5 memory along with optional SPI flash, eMMC 5.1 (up to 256GB), or UFS 2.0 storage (up to 1TB). Radxa has also introduced the NX4 IO carrier board for the module with an HDMI video output, two 4-lane MIPI CSI camera interfaces, four USB 3.2 Type-A ports, one USB 3.2 Type-C port, Gigabit Ethernet with optional PoE, and an M.2 M-key 2280 slot for storage, along with various I/Os. Radxa NX4 SoM specifications: SoC – Rockchip RK3576J (industrial-grade version) CPU – Octa-core CPU with 4x Cortex-A72 cores at 2.2 GHz, 4x Cortex-A53 cores at 2.0 GHz GPU – Arm Mali-G52 MC3 GPU with support for OpenGL ES 1.1, 2.0, and 3.2, OpenCL 2.0, and Vulkan 1.2 NPU – 6 TOPS […]

December 30, 2025January 18, 2026 by Jean-Luc Aufranc (CNXSoft) - 7 Comments

Rockchip RK1820/RK1828 SO-DIMM and M.2 LLM/VLM AI accelerator modules, devkits, and benchmarks

Rockchip RK1820/RK1828 SO-DIMM module development board

Rockchip unveiled two RK182X LLM/VLM accelerators at its developer conference last July, namely the RK1820 with 2.5GB RAM for 3B parameter models, and the RK1828 with 5GB RAM for 7B parameter models. A few months have passed, and we have a few more details since a development kit based on Rockchip RK1820/RK1828 SO-DIMM module is now available, some basic documentation has been released, and the RK1828 has been benchmarked against the Rockchip RK3588’s NPU. I was also told that M.2 modules are coming soon. Firefly RK182X 3D RAM Stacking Development Kit The “RK182X 3D RAM Stacking Development Kit” is based on the AIO-GS1N2 carrier board, previously offered with a Rockchip RK3576 or RK3588(s) and with a NVIDIA Jetson Orin Nano or NX AI module. Specifications: Main module (now only RK3588 variant for sale as part of the RK182x kit) Core-3588JD4 – Rockchip RK3588 with 6 TOPS NPU, 4GB to 32GB […]