INNOTECH AX-1020 Atom x6000E Elkhart Lake SBC targets fanless equipment

INNOTECH AX-1020

Japan-based INNOTECH has announced the AX-1020 SBC based on Intel Atom x6000E Elkhart Lake processor designed for fanless industrial equipment, medical equipment, surveillance/security, and transportation applications. The board supports up to 16GB of RAM, SATA & NVMe storage, and is equipped with three display interfaces, two Gigabit Ethernet ports, six USB3.0/2.0 interfaces, one RS-485/422, and four RS-232C serial interfaces. INNOTECH AX-1020 specifications: Choice of Atom x6000E Elkhart Lake SoC Intel Atom x6425E quad-core processor @ 2.00 GHz / 3.0 GHz with 32 EU UHD graphics; 12W TDP Intel Atom x6413E quad-core processor @ 1.50 GHz / 3.0 GHz with 16 EU UHD graphics; 9W TDP Intel Atom x6211E dual-core processor @ 1.30 GHz / 3.0 GHz with 16 EU UHD graphics; 6W TDP System Memory – 4GB to 16GB DDR4 SO-DIMM (The company tells customers to contact them first when using 8GB or 16GB RAM) Storage – 1x SATA port, […]

Intel Xeon D network and edge processors find their way into COM Express & COM-HPC modules

Intel Xeon D: D-2700 and D-1700

Intel has recently launched the Intel Xeon D (Ice Lake-D) processor family with the D-2700 and the D-1700 models designed for software-defined network and edge applications with integrated AI and crypto acceleration, built-in Ethernet, support for Intel Time Coordinated Computing (TCC) and Time-Sensitive Networking (TSN), plus high reliability. The new processors are bringing data center-class hardware to the edge, and at least two embedded systems companies, namely ADLINK Technology and Congatec, have already launched COM-HPC server modules and COM Express Type 7 module based on the new Intel Xeon D family. Intel Xeon D processors Intel Xeon D-2700 and Intel Xeon D-1700 are designed for space- and power-constrained ruggedized environments, feature industrial-class reliability, hardware-based security, and up to 56 high-speed PCIe lanes to support networks with up to 100Gbps Ethernet. While the Intel Xeon D-1700 sub-family is scalable from 2 to 10 cores, the Intel Xeon D-2700 family goes up […]

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors (Sponsored)

Alder Lake COM-HPC COM Express

congatec – a leading vendor of embedded and edge computing technology – introduces the 12th Generation Intel Core mobile and desktop processors (formerly code-named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high-performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. Offering up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), the 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low-power Efficient-cores (E-cores) and DDR5 memory support to […]

COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

COM-HPC Alder Lake-H

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family. Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control. Alder Lake-H COM Express / COM-HPC module Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications: SoC (12th Gen Intel Core Alder Lake-H) Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W […]

Intel unveils Alder Lake desktop and mobile IoT processors

Intel Alder Lake-H Mobile IoT processsor

Intel introduced high-end Alder Lake Hybrid processor family for consumer devices a couple of months ago, with Pentium G7400 and Celeron G6900 leaking a few weeks later, and now the company has formally announced the Alder Lake-S and Alder Lake-H processor families for respectively desktop IoT and mobile IoT solutions, as well as more efficient U-series and P-series of 12th Gen Intel Core Alder Lake IoT processors with a TDP ranging from 15W to 28W. Alder Lake S-Series desktop processors for IoT Key features and specifications: CPU Up to 16 cores, up to 24 threads in IoT SKUs Up to 30 MB Intel Smart Cache TDP – 35W to 65W Real-time capability on select SKUs Graphics/Video Intel UHD Graphics 770 driven by Intel Xe architecture with up to 32 EUs Up to four independent displays up to 4K or one display at 8K resolution Up to two video decode boxes […]

AMD Ryzen Embedded V2000 series on COM Express Compact (Sponsored)

conga-TCV2 AMD Ryzen Embedded V2000 COM Express

8 cores for heterogeneous edge computing Tasks at the embedded edge are getting more and more complex. Supporting up to 8 cores and 16 threads, the recently-launched AMD Ryzen Embedded V2000 processors are paving the way for x86-based embedded designs with unprecedented compute density and performance per watt. congatec is offering the new Zen 2 based processor generation, which complements V1000 processor technology with 6- and 8-core versions, on COM Express Compact modules. As the trend towards more IIoT connectivity and digitization continues, embedded systems must handle a growing number of tasks. Additional tasks include the collection of application data that needs to be transcoded, and sometimes analyzed locally using artificial intelligence (AI). In parallel, data must be exchanged with customers’ enterprise clouds and other OEM apps, and this communication must be highly secure, because new pay-per-use models turn the devices, machines, and systems into an OEM revenue source that […]

Kontron Introduces Tiger Lake 3U VPX Computer Blade and COM Express Type 6 Module

Tiger Lake 3U VPX Computer-Blade SBC COM Express

Intel launched several new embedded processors last month including the brand new Elkhart Lake family and some additional Tiger Lake UP3 processors designed for the IoT edge market. There’ve been several products announced with the new processors, but here are more with Kontron introducing two new Tiger Lake embedded hardware with COMe-cTL6 COM Express Compact Type 6 module and VX3060 3U VPX computer blade. As shown in the collage above, a 3.5-inch SBC is also in the works, but while we do not have the full details yet, the company expect the board to comes with SATA 3.0, M.2 socket, 2.5 GbE LAN, as well as four DP channels driving up to four independent 4Kp60 displays. VX3060 3U VPX computer blade Key features for both “3E” and “XG” variants: SoC – Intel quad-core Tiger Lake UP3 processor up to 2.5 GHz with up to 96EU Intel Iris Xe Graphics  – […]

Intel Tiger Lake UP3 COM Express Module Offers High AI Performance, PCIe Gen4 Interface

cExpress-TL Tiger Lake UP3 COM Express Module

Earlier today, Intel announced the Elkhart Lake IoT edge processor family, and as well as more 15W Tiger Lake Core i3/i5/i7 UP3 processors designed for IoT & embedded applications, and with a configurable TDP from 12W to 28W. ADLINK Technology is leveraging existing and those new Tiger Lake UP3 processors with the cExpress-TL COM Express Type 6 module based on the various Intel Core i7/i5/i3 and Celeron Tiger Lake UP3 SKUs delivering three times the AI inferencing performance of older platforms thanks to AVX-512 Vector Neural Network Instructions (AVX512 VNNI) instructions and equipped with the latest PCIe Gen4 expansion interface. cExpress-TL COM Express Tiger Lake module specifications: SoC (one or the other) Intel Core i7-1185G7E quad-core/octa-thread processor with 12MB cache, Intel Iris Xe graphics with 96x EU; up to 28W TDP (cTDP 15W) Intel Core i5-1145G7E quad-core/octa-thread processor with 8MB cache, Intel Iris Xe graphics with 80x EU; up to […]

Exit mobile version