COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor

We’ve written about the new Intel Alder Lake IoT processors announced right before CES 2022, and the first embedded platforms are starting to show up starting with COM-HPC and COM Express Type 6 modules from ADLink Technology powered by the 35/45W Alder Lake-H mobile IoT processor family.

Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile, and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter tracking, and access control.

Alder Lake-H COM Express / COM-HPC module

COM Express Alder Lake-P module

Besides the form factor, both modules will have very similar specifications. Here are Express-ADP specifications:

  • SoC (12th Gen Intel Core Alder Lake-H)
    • Intel Core i7-12800HE 14-core (6P+8E), 20-thread processor @ up to 4.6 GHz with 24 MB cache, Intel Xe GPU, 45W TDP (35W cTDP)
    • Intel Core i5-12600HE 12-core (4P+8E), 16-thread processor @ up to 4.5 GHz with 18 MB cache, Intel Xe GPU, 45W TDP (35W cTDP)
    • Intel Core i3-12300HE 8-core (4P+4E), 12-thread processor @ up to 4.3 GHz with 12 MB cache, Intel UHD graphics, 45W TDP (35W cTDP)
  • Memory – Up to 64GB (2x 32GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT/s
  • Storage
    • 32 or 16MB (TBC) SPI flash for Embedded BIOS AMI UEFI with CMOS backup
    • On-board Storage NVMe SSD in place of PCIe lanes 28-31 (build option, project basis)
  • Video features
    • Hardware video encode/decode, up to 8K60 HEVC
    • DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D support OneVPL
    • HDCP 2.3
    • Graphics Hardware Virtualization (SRIOV)
  • Networking – Up to 2x Intel i225 2.5GbE controller, including one with optional TSN support
  • SEMA board controller with Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO,
    watchdog timer, fan control
  • 2x standard COM Express connectors
    • Storage – 2x SATA 3.0
    • Video I/F
      • DDI 1/2/3 supporting DP 1.4a, HDMI 2.0b, DVI
      • VGA (build option) via DP-to-VGA IC (in place of DDI 3), max. resolution: 1920×1200 @ 60Hz
      • Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution  920×1200@60Hz in dual mode
      • eDP (build option) in place of LVDS, 4 lanes, eDP 1.4b
      • DP alt. mode (See USB section)
    • Networking – 2x 2.5GbE interfaces
    • USB
      • 4x USB 3.2/2.0/1.1 (USB 0-3), 4x USB 2.0/1.1 (USB 4-7)
      • Up to 2x USB4 in place of DDI 1/2, supports DP 1.4a by DP alternative mode, Thunderbolt 4 capable (TBC)
    •  PCIe
      • PCIe x8 Gen4, lanes 16-23, available for 45W(35W cTDP SKUs)
      • PCIe x4 Gen4, lanes 24-27
      • PCIe x4 Gen4, lanes 28-31
      • 5x PCIe x1 Gen3, lanes 0-3 (configurable to x1, x2, x4), lane 4 (additional PCIe x1, lanes 5-7 via PCIe switch, build option by project basis)
    • LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI (TBC)
    • Serial – 2x UART ports with console redirection
    • 12x GPIO
  • Security – Infineon TOM 2.0
  • Debug Headers – 30-pin multipurpose flat cable connector for use with DB30-x86 debug module providing BIOS POST code LED, SEMA Board Controller access, SPI BIOS flashing, power test points, debug LEDs
  • Power Supply
    • Standard Input ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%
    • Wide Input ATX: 8.5-20V / 5Vsb ±5%; or AT: 8.5-20V
    • Management ACPI 5.0 compliant, Smart Battery support (TBC)
    • Power States C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5) (TBC)
    • ECO Mode Supports deep S5 mode for power saving
  • Dimensions –  125 x 96 mm (PICMG COM.0: Rev 3.0 Type 6 Basic Size)
  • Temperature Range
    • Standard: 0°C to 60°C (storage: -20°C to 80°C)
    • Extreme Rugged: -40°C to 85°C (storage: -40°C to 85°C, TBC, build option, selected SKUs)
  • Humidity
    • 5-90% RH operating, non-condensing
    • 5-95% RH storage (and operating with conformal coating)
  • Shock and Vibration
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (TBC)
    • HALT Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test


Alder Lake-H COM Express Block Diagram
Express-ADP block diagram

The modules will support Windows 10 IOT Enterprise LTSC and Yocto project-based Linux 64-bit, and Ubuntu 64-bit and VxWorks may become available, but this is still to be determined. One difference between Express-ADP and COM-HPC-cADP modules is that the latter is also equipped with MIPI CSI and DSI interfaces. At least as shown in the specs, since the block diagram does not show those…

COM-HPC Alder Lake-H

There seems to have been some confusion since the modules are now launched with Alder Lake-H processors, but the naming and part of the specs show Alder Lake-P processors. I have been told it was because the company plans to launch models with those as well. Both COM Express and HPC-COM starter kits will be offered.

As you might have guessed with the 3D renders and “TBC” references in the specs, ADLINK Express-ADP and COM-HPC-cADP are not available just yet. More details may also be found on the respective product page for Express-ADP and COM-HPC-cADP. ADLINK was not the only company that introduced Alder Lake “IoT” modules today, as I wrote this article, I received emails for various Alder Lake embedded systems including SECO CHPC-D80-CSA COM-HPC Size A module, Vecow ECX-3000 rugged computer with Alder Lake-S desktop IoT processor, and 10 new COM-HPC and COM Express Computer-on-Modules with Alder Lake H-series or S-Series processors from Congatec.

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