Qualcomm Snapdragon 636 Delivers Up to 40% Better Performance Over Snapdragon 630, Supports FHD+ Displays

Qualcomm has announced a new “Mobile Platform” with Snapdragon 636 that combines eight Kryo 260 cores, an Adreno 509 GPU, and X12 LTE modem for “high quality devices with top-level features at a low price point”, which must mean “mid range”. The new Snapdragon 636 offers an update to Snapdragon 630 / 660 solutions released last year with up to 40% performance boost, 10% faster 3D graphics, and support for ultra-wide FHD+ displays (18:9 aspect ratio). Key features for Snapdragon 636: CPU – 8x Qualcomm Kryo 260 cores clocked at up to 1.8 GHz GPU – Adreno 509 with support for OpenGL ES 3.2, OpenCL 2.0 full,Vulkan, DX12 DSP – Hexagon 680 DSP with All-Ways Aware Technology, Neural Processing Engine SDK, Caffe/Caffe2 and Tensorflow support Memory I/F –  LPDDR4/4X, dual channel up to 1333MHz, 8GB RAM Storage I/F – eMMC and UFS flash Display – Up to 2160×1080 FHD+ resolution; […]

Mediatek Helio X20 vs Qualcomm Snapdragon 625 – 3D Graphics Benchmarks and CSR2 Game

I’ve been using Vernee Apollo Lite smartphone with a Mediatek Helio X20 deca-core ARM Cortex A72/A53 processor coupled with an ARM for a little over a year. Recently, I’ve received Xiaomi Mi A1 smartphone for a Qualcomm Snapdragon 625 SoC featuring eight ARM Cortex A53 cores and an Adreno 506 GPU. In theory, the latter is a downgrade, and the Xiaomi phone is indeed quite slower in Antutu with overall score of 60,161 points against 85,840 points in the Mediatek phone. 3D graphics performance is also lower with 12,849 vs 17,828 points. Both smartphone have the same resolution (1920×1080), so it’s a little confusing to be told you’d “better to play games in low quality mode” for the Mediatek phone, and “game performance is mid-level” for the Snapdragon one. But anyway Helio 20 should work better in 3D games than Snapdragon 625 if we are to believe the numbers. Most […]

Snapdragon X50 5G Modem Makes it First Data Connection

5G technology is expected to launch in 2019, and Qualcomm has recently made a step towards this goal with the company announcing their first 5G data connection with Snapdragon X50 modem on on 28GHz mmWave Spectrum. The demonstration took place in Qualcomm Technologies’ laboratories in San Diego, and achieved Gigabit download speeds using several 100 MHz 5G carriers. Snapdragon X50 5G Modem’s product page lists some of the key features of the chip: Up to 5 gigabits per second download speeds Initial support for operation in the 28 GHz millimeter wave band. It can connect using up to 800 MHz of bandwidth via 8×100 MHz carrier aggregation. Supports advanced multiple input, multiple output (MIMO) techniques such as adaptive beamforming and beam tracking Composed of the modem as well as the SDR051 mmWave transceiver The modem can be paired with a Snapdragon processor to provide multi-mode 4G/5G capability, and the company […]

Qualcomm Provides Details about 64-bit ARM Falkor CPU Cores used in Centriq 2400 Server-on-Chip

Qualcomm officially announced they started sampling Centriq 2400 SoC with 48 ARMv8 cores for datacenters & cloud workloads using a 10nm process, but at the time the company did not provide that many details about the solution or the customization made to the CPU cores. Qualcomm has now announced that Falkor is the custom CPU design in Centriq 2400 SoC with the key features listed by the company including: Fully custom core design – Designed specifically for the cloud datacenter server market, with a 64-bit only micro-architecture based on ARMv8 (Aarch64). Scalable building block – The Falkor core duplex includes two custom Falkor CPUs, a shared L2 cache and a shared bus interface to the Qualcomm System Bus (QSB) ring interconnect. Designed for performance, optimized for power 4-issue, 8-dispatch heterogeneous pipeline designed to optimize performance per unit of power, with variable length pipelines that are tuned per function to maximize […]

Qualcomm Snapdragon 450 is a 14nm LTE “Mobile Platform” for Mid-Range Smartphones and Tablets

Qualcomm has a made several announcements at Mobile World Congress Shanghai 2017, with processors like Snapdragon Wear 1200 Wearables SoC, as well as Snapdragon 450 octa-core mobile platform, allegedly the first 14nm processor made for mid-range mobile devices. Qualcomm Snapdragon 450 specifications: CPU – 8x ARM Cortex A53 cores @ up to 1.8 GHz GPU – Adreno 506 GPU with OpenGL ES 3.1, OpenCL 2.0 Full, DirectX 12, GPU tessellation, geometry shading DSP – Hexagon 546 DSP Memory I/F – LPDDR3 Display – Full HD 1080p60; Qualcomm EcoPix,TruPalette, improveTouch technology Audio – Qualcomm Aqstic with VoLTE w/Ultra HD Voice (EVC), high-fidelity music playback (24-bit/192 KHz), Dolby 5.1 Modem – Snapdragon X9 LTE modem up to 300 Mbps download (Cat 7) and 150 Mbps uplink (Cat. 13) Wireless Connectivity – 802.11ac MU-MIMO, Gen8C Lite location technology, Bluetooth 4.1 LE USB – USB 3.0 interface Camera – Up to 13MP dual camera, […]

Qualcomm Snapdragon Wear 1200 Platform for Wearables Supports LTE Cat M1 and NB1 (NB-IoT)

After Snapdragon Wear 2100 and 1100 launched last year , Qualcomm has announced a new Snapdragon Wear 1200 platform still designed for wearables, but with lower power consumption, less processing power, a more compact package, and built-in support for LTE IoT communications standards such as LTE Cat M1 and LTE NB-IoT (Cat NB1).   Qualcomm Snapdragon Wear 1200 key features and specifications: CPU – ARM Cortex A7 @ 1.3 GHz Memory / Storage – Support for discreet or MCP NAND and LPDDR2 Display – Support via SPI for simple UI and displays Modem Global multi-mode supporting Cat-M1 / NB1 / E-GPRS. Supports LTE FDD and TDD for Cat-M1 and E-GRPS and FDD only for Cat-NB1 Up to 300 kbps downlink and 350 kbps uplink for Cat-M1 10 kbps download and 60 kbps upload speeds for Cat-NB1 Integrated voice support for VoLTE Other Connectivity – Pre-integrated support for Qualcomm 11ac Wi-Fi […]

Qualcomm Announces Audio Platforms for Smart Speakers, Headphones, and Hearables

Smart speakers are getting a lot of buzz recently with products like Amazon Echo or Google Home, and many home automation products are advertised with Amazon’s Alexa support, so that they can be controlled by voice commands. Qualcomm is now going after this market, and others audio markets via 5 new platforms for streaming audio, high resolution audio, wireless audio, USB -C audio devices – due to the “death” of the 3.5mm headphone jack -, and hearables. The five platforms include: Bluetooth and BLE Audio SoCs such as Qualcomm CSRA68100 for premium wireless speakers and headphones. The SoC comes with flash, DSP, a 2-ch audio CODEC, USB & I/Os interfaces. Qualcomm QCC3xxx entry-level Bluetooth audio SoC for mid to low-cost Bluetooth headsets and speakers. Qualcomm WHS9420 (192kHz/24-bit audio) and WHS9410 (entry-level) USB-C audio SoC for USB-C headphones Qualcomm DDFA Digital Amplifier Technology with CSRA6xxx amplifier Smart Speaker Platform shown above […]

Intrinsyc Open-Q 835 Development Kit Features Qualcomm Snapdragon 835 Processor, Support Android 7 and Windows 10

Intrinsyc has just launched one of the first development boards powered by Qualcomm Snapdragon 835 processor with their Open-Q 835 devkit equipped with 4GB LPDDR4x, 128GB UFS 2.1 flash, 802.11ad WiFi, dual camera support and more. Open-Q 835 development kit is comprised of a “processor board” and a baseboard with the following specifications: Processor Board SoC – Qualcomm Snapdragon 835 (APQ8098) octa-core processor with four high performance Kryo 280 cores @ 2.20 GHz/ 2.30 GHz (single core operation), four low power Kryo cores @ 1.9 GHz, Adreno 540 GPUwith  OpenGL ES 3.2, OpenCL 2.0 Full support, and Hexagon 682 DSP with Hexagon Vector eXtensions (dual-HVX512) System Memory – 4GB LPDDR4x RAM Storage – 128GB UFS2.1 Gear3 2 lane Flash Connectivity Wi-Fi 802.11a/b/g/n/ac 2.4/5Ghz 2×2 Bluetooth 5.0 + BLE WiGig60 802.11ad with on-board antenna Dimensions – 70 x 60 mm Carrier Board Display – 1x HDMI 2.0 out up to 4K Ultra […]