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ISEE Introduces IGEP COM CYGNUS & AQUILA Powered by TI Sitara AM335x Processor

February 23rd, 2013 Leave a comment Go to comments

ISEE will officially launch and showcase 2 new computers-on-module at Embedded World 2013 on February 26-28, in Nuremberg, Germany: IGEP COM CYGNUS and IGEP COM AQUILA. Both CoM shares the same characteristics except the former is powered by TI Sitara AM3352 (Cortex A8, no GPU) and the later by TI Sitara AM3354 (Cortex A8 + PowerVR GPU). This makes the CYGNUS suited for cost sensitive applications such as industrial control, home automation, and test and measurement devices, and the AQUILA for applications that requires more advanced graphics and multimedia capabilities such as gaming, auto infotainment and navigation devices.

ISEE IGEP COM CYGNUS (Click to Enlarge)

ISEE IGEP COM CYGNUS (Click to Enlarge)

The key specifications of the 2 modules are as follows:

  • Processor – Texas instruments Sitara AM3352 Cortex A8 @ 720 Mhz (CYGNUS) and AM3354 Cortex A8 @ 720 Mhz + PowerVR SGX GPU (AQUALIA)
  • System memory – 256 MB DDR3 SDRAM, 303 MHz, 16-bit
  • Storage – 128 MB SLC NAND FLASH + on-board micro-SD socket
  • Networking – 1x Ethernet PHY
  • Debug Interface – JTAG
  • Sitara AM335x interfaces – USB Host/OTG, I2C, SPI, CAN, UART, LCD controller, GPIOs, etc…
  • Power – 4V to 5,5V DC via SODIMM connector. 1x Linear 3V3@1A regulator
  • Dimensions – 67,6mm x 26 mm (SODIMM form factor)
  • Temperature Range – Industrial: -40 to +85 C
ISEE IGEP COM AQUALIA Block Diagram

ISEE IGEP COM AQUALIA Block Diagram

The company will provide open source software for the board such as Linux and Android. That’s about all I know for now. Those two COMs will most probably be compatible with the three existing carrier boards: IGEP Paris, IGEP New York and IGEP Berlin (Update: They are not currently compatible with these baseboards), and you’ll eventually be able to get more information on the Wiki.

I don’t have availability nor pricing information at this time, but we’ll certainly learn more at Embedded World 2013.

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