We just noticed some Intel Tiger Lake-H Xeon/Core/Celeron processors for embedded systems last week, and at the time it was not clear when they’d be announced and/or become available. It turns out it did not take long, as ADLINK has just unveiled their TL-Express COM Express Basic Size Type 6 module with the new processors.
The new computer-on-module offers a more powerful alternative to the company’s cExpress-TL Tiger Lake UP3 COM Express Compact module, with up to 8 cores/16 threads, 128 GB memory, 8K video output, support for -40°C – 85°C industrial temperature range, and the company also claims it is the first COM Express module to support PCI Express Gen 4 x16, doubling the bandwidth of previous COM Express modules in the market.
- Tiger Lake-H Embedded SoC (one or the other)
- Intel Celeron 6600HE dual-core processor @ 2.6GHz with 8MB L3 Cache, 16EU Intel UHD graphics, 35W TDP
- Intel Core i3-11100HE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.4GHz in Turbo Boost) with 8MB L3 Cache, 16EU Intel UHD graphics, 45/35W cTDP
- Intel Xeon W-11155MRE processor with 4 cores / 8 threads @ 2.4GHz (up to 4.0GHz in Turbo Boost), 8MB L3 Cache, 16EU Intel UHD graphics, ECC and TCC/TSN, 45/35W cTDP – Industrial (w/ Turbo OFF)
- Intel Core i5-11500HE processor with 6 cores / 12 threads @ 2.6GHz (up to 4.1GHz in Turbo Boost), 12MB L3 Cache, 45/35W cTDP
- Intel Xeon W-11555MRE processor with 6 cores / 12 threads @ 2.6GHz (up to 4.1GHz in Turbo Boost), 12MB L3 Cache, 32EU Intel UHD graphics, ECC, TCC/TSN and Functional Safety (FuSa), 45/35W cTDP – Industrial (w/ Turbo OFF)
- Intel Core i7-11850HE processor with 8 cores / 16 threads @ 2.6GHz (up to 4.2GHz in Turbo Boost), 24MB Cache L3, 32EU Intel UHD graphics, 45/35W cTDP
- Intel Xeon W-11865MRE processor with 8 cores / 16 threads @ 2.6GHz (up to 4.2GHz in Turbo Boost), 24MB L3 Cache, 32EU Intel UHD graphics, ECC, TCC/TSN and Functional Safety (FuSa), 45/35W cTDP – Industrial (w/ Turbo OFF)
- Chipset – RM590E (support ECC, with Xeon CPU), QM580E, HM570E
- System Memory
- Dual-channel up to 3200 MT/s DDR4 memory up to 128GB in four SODIMM sockets
- 2x SO-DIMM on top side, 2x SO-DIMM on bottom side (3 or 4 socket
versions by build option) - ECC support by Xeon CPU paired with RM590E PCH
- Storage
- 4x SATA III ports
- Optional on-board storage: soldered type PCIe based SSD
- 16MB or 32MB flash for Embedded BIOS (optional dual BIOS)
- Video
- DDI1/2/3 supporting DisplayPort/HDMI/DVI
- Single/dual channel 18/24-bit LVDS from eDP-to-LVDS IC, max. resolution
1920×1200@60Hz in dual mode - Optional VGA supported by DP-to-VGA IC (in place of DDI3), max. resolution 1920×1200@60Hz
- Optional 4-lane eDP in place of LVDS, max. resolution 8K@60Hz
- Simultaneous display combinations of DisplayPort/HDMI/LVDS, eDP or
VGA outputs up to 4x 4K60; 8K60 at eDP and DDI 1/2 will occupy two display pipelines.
- Audio
- Intel HD Audio integrated on CPU
- Audio Codec – On carrier Express-BASE6 (ALC886 standard support)
- Networking
- Intel LAN controller i225 series (i225-IT feature TSN by build option)
- 2.5GbE and Gigabit Ethernet connection
- USB – 4x USB 3.2/2.0/1.1 (USB 0,1,2,3), 4x USB 2.0/1.1 (USB 4,5,6,7)
- Expansion Busses
- PCIe x16 Gen4 (CD) – Lanes 15-31 (configurable to one x16, two x8, one x8 + two x4)
- 6x PCIe x1 Gen3 (AB) – Lanes 0/1/2/3 (configurable to x1, x2, x4) and Lanes 4/5 (x2, x1)
- 2x PCIe x1 Gen3 (CD) – Lanes 6/7 (configurable to x2, x1)
- LPC bus (through an ESPI to LPC bridge IC), SMBus (system) , I2C (user)
- Serial – 2x UART ports with console redirection
- GPIO/SD – 4x GPO and 4x GPI from EC (GPI with interrupt TBC)
- SEMA Board Controller – Support for Voltage/current monitoring, power sequence debug support, AT/ATX mode control, logistics and forensic information, flat-panel control, general-purpose I2C, watchdog timer, fan control, and failsafe BIOS
- Debug Headers – 30-pin multipurpose flat cable connector for use with DB-30 x86 debug module providing BIOS POST code LED, EC access, SPI BIOS flashing, power testpoints, debug LEDs
- Security – Infineon TPM 2.0 (SPI based)
- Power Supply
- Standard Input – ATX: 12V±5% / 5Vsb ±5%; or AT: 12V±5%
- Wide Input – ATX: 8.5-20 V / 5Vsb ±5%; or AT: 8.5-20V
- Management – ACPI 5.0 compliant, Smart Battery support
- Power States – C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3/S4, WOL S3/S4/S5)
- ECO mode – supports deep S5 mode for power saving
- Dimensions – 125 x 95 mm (Basic size PICMG COM.0: Rev 3.0 Type 6)
- Temperature Range – Standard: 0°C to 60°C (storage: -20°C to 80°C); extreme rugged: -45°C to +85°C (storage: -40°C to 85°C
- Humidity
- 5-90% RH operating, non-condensing
- 5-95% RH storage (and operating with conformal coating)
- Shock and Vibration
- IEC 60068-2-64 and IEC-60068-2-27
- MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
- HALT – Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
The new Tiger Lake-H embedded processors also include AVX-512 VNNI instructions to provide artificial intelligence (AI) inferencing performance. The company says Express-TL is well-suited for image processing and analysis, high-speed video encoding and streaming, medical ultrasound, predictive traffic analysis, and other demanding applications.
The information on the product page is still shown as preliminary, and Express-TL Tiger Lake-H COM Express Basic Size Type 6 module should become available in the next few months.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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