MediaTek Dimensity 1000+ 5G Mobile SoC Supports 144Hz FHD+ Displays, 5G UltraSave Technology, and More

Mediatek Dimensity 1000+

MediaTek Dimensity 1000 5G processor for premium mobile devices was announced in Q4 2019 with eight Cortex-A77/A55 cores, an Arm Mali-G77 MC9, and APU 3.0 AI coprocessor. Since then, several companies have announced plans to launch Dimensity 1000 smartphones with products such as Astro Slide 5G Transformer. But while there aren’t any Dimensity 1000 phones available for sale just yet (AFAIK), MediaTek has already announced an updated version with Dimensity 1000+ (Dimensity 1000 Plus). The new version of the processor runs the CPU and GPU cores at the same frequencies, and the differences are instead in other specific features of the processor, as we’ve highlighted below. MediaTek Dimensity 1000+ specification: Processor 4x Arm Cortex-A77 @ 2.6GHz 4x Arm Cortex-A55 @ 2.0GHz DynamIQ heterogeneous multi-processing technology GPU – 9-core Arm Mali-G77 MC9 AI Coprocessor – APU 3.0 hexa-core AI accelerator with 2x big cores, 3x small cores, and 1x tiny core […]

Congatec conga-TR4 COM Express Module is Powered by AMD Ryzen Embedded SoC

conga-TR4 AMD-Ryzen V1000 COM Express

We’ve covered plenty of AMD Ryzen Embedded V1000-series SBCs, and some Ryzen Embedded mini PCs,  but so far, we had not written about any AMD Ryzen Embedded V1000 or R1000 system-on-module (SoM) or computer-on-module (CoM), partially because there aren’t many yet, and because we missed Advantech SOM-5871 CPU module earlier this year. But there’s now another option courtesy of Congatec with conga-TR4 AMD Ryzen Embedded COM Express module with consumer or industrial temperature range, and a choice of seven different processors. conga-TR4 COM Express module specifications: SoC (one or the other) AMD Ryzen V1807B quad-core processor @ up to  3.35 GHz with 2MB L2 cache, Vega 11 graphics; 35-54W TDP AMD Ryzen V1756B quad-core processor @ up to 3.25 GHz with 2MB L2 cache, Vega 8 graphics;  35-54W TDP AMD Ryzen V1605B quad-core processor @ 2.0 GHz with 2MB L2 cache, Vega 8 graphics; 12-25W TDP AMD Ryzen V1202B dual-core […]

Rockchip RK3588 8K TV Box Triples as 5G & WiFi 6 Router, Home Automation Gateway

Rockchip RK3588 8K TV Box 5G & WiFi 6

Rockchip RK3588 octa-core Cortex-A76/A55 processor was only expected in the second half of 2020 for IoT and vision/AI applications, but at least one company is working on a 3-in-1 product based on Rockchip high-end processor with a “5G AIoT 8K TV box” that also works as a 5G and WiFi 6, and with features such as Zigbee can also act as a home automation gateway. “5G AIoT Android TV Box” preliminary specifications: Main SoC – Rockchip 3588 octa-core processor with 4x Cortex-A76 and 4x Cortex-A55 cores in dynamIQ configuration, Arm “Natt” GPU (i.e. NOT Mali-G31 MP2), NPU 2.0, 8K H.265/AV1 video decoder, 4K video encoder System Memory – 4GB DDR4 Storage – 32GB eMMC flash, MicroSD card slot up to 64GB?! Video Output – HDMI 2.1 up to 8K resolutions Audio – SPDIF audio output, HDMI audio Connectivity 802.11 b/g/n/ac/ax WiFi 6 and Bluetooth 5.1 via Qualcomm QCA6391 WiSoC 1x […]

HiSilicon Kirin 820 5G Platform Targets Mid-Range 5G Smartphones

Kirin 820 5G SoC

5G connectivity used to be only found in premium smartphones, but there’s now been several 5G SoC introduced for mid-range 5G smartphones including Qualcomm Snapdragon 765/765G and MediaTek Dimensity 800. Huawei now has its own as the company’s unveiled Hisilicon Kirin 820 5G platform found in its latest Honor 30S at a launch event in China. Hisilicon Kirin 820 5G  key features and specifications: CPU – 1x Cortex-A76 @ 2.36 GHz, 3x Cortex-A73 @ 2.22 GHz, 4x Cortex-A55 @ 1.84 GHz GPU- Arm Mali-G57 GPU (6 cores) with GPU Turbo and Kirin Gaming+ 2.0 NPU – 1-big Core ISP – Kirin ISP 5.0 with BM3D SLR image noise reduction, video dual-domain noise reduction, and support for 4K video capture at 60fps. Cellular Connectivity 2G/3G/4G/5G modem Dual-mode SA/NSA 5G Process – 7nm The new processor extracts 27% extra CPU performance compared to Kirin 810, a 38% graphics performance boost over Mali-G52 […]

Astro Slide 5G Transformer Smartphone Comes with a Slide-out Keyboard, MediaTek Dimensity 1000 SoC (Crowdfunding)

Astro Slide 5G Transformer

Planet Computers has introduced several smartphones with physical keyboards over the last few years including Gemini PDA and Cosmo Communicator with the later recently received its promised Debian Linux images besides just running Android 9.0. The company is now back with the new model. Powered by a MediaTek Dimensity 1000 processor, Astro Slide 5G Transformer supports 5G connectivity and comes with a slide-out keyboard following on the steps of the company’s previous smartphones. Astro Slide 5G Transformer preliminary hardware specifications: SoC- MediaTek Dimensity 1000 (MT6889)octa-core processor with 4x Arm Cortex-A77 cores @ 2.6 GHz, 4x Arm Cortex-A55 CPU efficient cores @ 2.0 GHz, Arm Mali-G77 GPU, 4.5 TOPS APU 3.0 AI accelerator / NPU System Memory – At least 6GB LPDD4x RAM Storage – 128 GB flash, MicroSD card slot Display – 6.53″ touchscreen display with 2340×1080 resolution, scratch-resistant glass Camera – 48MP rear camera with flash, 5.0MP front-facing camera […]

Thundercomm Announces Qualcomm based Modules for Smart Speakers, LTE IoT, Smart Retail, and 5G Applications

TurboX C865 Snapdragon 865 SoM

Based in California in the US, Thundercomm Technology Co., Ltd. (aka Thundercomm) is a provider of IoT products & technologies for OEM/ODMs, enterprises and developers. The company introduced several Qualcomm based “TurboX Systems-on-Module” for smart speakers, LPWAN IoT devices with NB-IoT and LTE Cat M1 connectivity, smart retail applications, and 5G powered devices. TurboX C404 and C405 SOMs for Smart Speakers and Soundbars Key features and specifications: SoC – Qualcomm Snapdragon C404 / C405 with CPU – Quad-core Arm Cortex-A53 @, 1.4 GHz GPU (C405 Only) – Qualcomm Adreno 306 GPU @ 600 MHz DSP -2x Hexagon QDSP6 v66 – Low Power Audio Subsystem & Audio Compute DSP System Memory & Storage – 1GB LPDDR3 + 8GB eMMC flash in eMCP package; SD card signals Connectivity 2×2 MIMO WiFI 5 802.11 a/b/g/ac + Bluetooth 5.0 + FM via WCN3999 Gigabit Ethernet (RGMII) Display Interfaces (C405 Only) 4-lane MIPI DSI port […]

Marvell OCTEON TX2 CN9130, CN9131 and CN9132 SoCs Target 5G Base Stations, Edge Networking, Storage Applications

Octeon TX2 CN9130 Block Diagram

A while ago, I was informed three new Marvell processors had made it to mainline Linux, namely CN9130, CN9131, and CN9132, but at the time, the description was a bit cryptic: The CN9130 is made of one AP807 and one internal CP115. There are three development boards that are made of this SoC: * CN9130-DB * CN9131-DB (with one additional modular CP115 compared to CN9130-DB) * CN9132-DB (with two additional modular CP115 compared to CN9130-DB) No other public information was available either, but Marvell has now published more details and those are OCTEON TX2 Infrastructure processors with four Cortex-A72 cores @ 2.2 GHz, up to 18x SERDES IO, and 10GbE. Octeon TX2 CN9130 key features and specifications: CPU – Quad-core Armv8 Cortex-A72 @ up to 2200 MHz with 48 KB I-cache, 32 KB D-cache, 1 MB total L2 cache divided into two clusters of 512 KB ECC shared cache, 1MB […]

UNISOC Unveils T7520 5G SoC Manufactured with 6nm EUV Process Technology

UNISOC T7520

UNISOC has launched its second-generation 5G mobile SoC with T7520 processor manufactured with a 6nm EUV process technology and equipped with four Arm Cortex-A76 cores, four Arm Cortex-A55 cores, as well as an Arm Mali-G57 GPU, and the company’s Makalu 5G platform. T7520 processor is said to support “coverage enhancement for any application scenario, by allowing carriers to deploy 5G on their existing 4G spectrums” (aka NSA = Non-stand Alone). and is optimized for use on 500 km/h high-speed railway. Highlights of the processor include: Advanced 6nm EUV process technology with extremely high lithographic resolution and a better balance between cost, performance and power consumption. Compared to the previous 7nm process, the new process has an 18% improvement in density of transistors and reduces power consumption by 8%. Lower power consumption made possible by the improved process mentioned above as well as an improved low-power consumption architecture and AI-based power […]

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