com-hpc News - CNX Software - Embedded Systems News

January 26, 2026January 26, 2026 by Debashis Das - 1 Comment

Innodisk EXEC-Q911 COM-HPC Mini kit is powered by a Qualcomm Dragonwing IQ-9075 Edge AI SoC

EXEC Q911 Qualcomm Solution COM HPC Mini Starter Kit

Innodisk has recently introduced the EXEC-Q911, a COM-HPC Mini starter kit designed for edge AI applications powered by a Qualcomm Dragonwing IQ-9075 System-on-Chip (SoC), also known as the QCS9075, which delivers up to 200 TOPS of AI performance. The platform includes 36GB LPDDR5X memory and 128GB UFS 3.1 storage, supports dual 2.5GbE, two 4-lane MIPI CSI-2 camera interfaces, DisplayPort 1.2 and eDP outputs, and multiple expansion options via M.2 (PCIe Gen4 x4/x2) slots. Designed for industrial applications, it operates in a wide -40°C to 85°C operating temperature range, accepts 9–36V DC input, integrates TPM 2.0 security, and offers various I/Os, USB 3.2 Gen 2, CAN FD, RS-232/422/485, GPIO, SPI, and I²C, with longevity guaranteed until 2038. Innodisk EXEC-Q911 specifications: Compute-on-Module – Innodisk EXMA-Q911 COM-HPC Mini module SoC – Qualcomm DragonWing IQ-9075 CPU Octa-core Kryo Gen 6 (Cortex-A78C-based) application cores @ up to 2.36 GHz Quad-core Cortex-R52 real-time cores @ up […]

November 21, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

COM-HPC Mini Computer-on-Module (CoM) features up to Intel Core Ultra 7 255H “Arrow Lake” processor

AAEON HPC-ARHm is a COM-HPC Mini R1.2 module powered by a choice of 28W Intel Core Ultra Arrow Lake and Meteor Lake processors with Intel Arc/Arc 140T/130T GPU and up to 96 TOPS of combined AI performance. The Computer-on-Module supports up to 64GB LPDDR5x, offers three 4K-capable display interfaces through two DDI (DP/HDMI) and one eDP interface, dual 2.5GbE networking, twelve USB interfaces, including four 10 Gbps USB 3.2, sixteen PCIe Gen4/Gen3 lanes, and more. It primarily targets Edge AI solutions such as UAVs, robots, IC testing equipment, and healthcare imaging devices. HPC-ARH-m COM-HPC Mini module specifications: Meteor Lake-H or Arrow Lake-H SoC (one or the other) Intel Core Ultra 5 125H 14-core/18-thread (4P+8E+2LPE) processor @ up to 4.9 / 3.6 / 2.5 GHz with 18MB cache, 7x Xe-Cores Intel Arc graphics @ 2.2 GHz (18 TOPS), Intel AI Boost NPU (11 TOPS); PBP: 28W Intel Core Ultra 7 155H […]

July 21, 2025July 20, 2025 by Debashis Das - 1 Comment

BCM ESM-HRPL COM-HPC Client Size C module supports up to 24-core Intel Core i9-14900K CPU

The BCM ESM-HRPL is an industrial-grade COM-HPC Client Size C module based on Intel Core 12th to 14th Gen processors, supporting up to the 24-core Intel Core i9-14900K Raptor Lake SoC via an LGA1700 socket. It features PCIe Gen5, Intel Deep Learning Boost, and AI Boost for AI inference, delivering up to 8.2 TOPS of AI processing power. The module follows the PICMG COM-HPC Client Type specification and supports up to 128GB DDR5 memory via four 262-pin SO-DIMM sockets and optional ECC support depending on the CPU. Interfaces include 2x SATA III ports, dual 2.5GbE, USB 3.2 Gen2x2, eDP, and triple DDI display interfaces (for a total of 4 independent displays). Designed for long-term support, this board targets applications such as AI inference, medical imaging, smart energy, and automation. BCM ESM-HRPL specifications: Processor Support – Compatible with 12th/13th/14th Gen. Intel Core i9/i7/i5/i3/Pentium/Celeron “Alder Lake-S” or “Raptor Lake-S” processor via LGA1700 […]

April 8, 2025April 8, 2025 by Jean-Luc Aufranc (CNXSoft) - No Comments

ADLINK COM-HPC-mMTL – A COM-HPC Mini Computer-on-Module with up to 16-core Intel Core Ultra 7 165H processor

COM-HPC-mMTL 16-core Intel Core Ultra COM-HPC Mini

ADLINK COM-HPC-mMTL is an industrial-grade COM-HPC Mini Computer-on-Module based on Intel Meteor Lake processors up to the 16-core Intel Core Ultra 7 165H featuring Intel Arc Graphics with eight Xe cores, Intel AI Boost NPU up to 8.2 TOPS, and 16x PCIE Gen4 lanes. The COM-HPC R1.2-compliant Mini size module also supports up to 64GB LPDDR5x memory soldered directly onto the board, an optional NVMe BGA SSD, and features two SATA interfaces, two 2.5 Gbps Ethernet, multiple DDI/USB4, and USB 3.0/2.0 through the standard 400-pin board-to-board connector of the 95x70mm CoM. ADLINK COM-HPC-mMTL specifications: Meteor Lake H/U SoC (one or the other) Intel Core Ultra 7 165H 16-core (6P+8E+2LPE) processor @ up to 5.0 / 3.8 / 2.5 GHz with 24MB cache, 8x Xe-cores Intel Arc graphics @ 2.35 GHz, Intel AI Boost NPU; TDP: 28W Intel Core Ultra 7 155H 16-core (6P+8E+2LPE) processor @ up to 4.8 / 3.8 […]

January 19, 2025February 6, 2026 by Debashis Das - No Comments

Intel Core Ultra 200S/200U/200H-powered COM-HPC Client modules support up to 192GB DDR5 memory, PCIe Gen5

Portwell COM HPC client modules PCOM B887 and PCOM B886

Portwell PCOM-B887 and PCOM-B886 are two new COM-HPC client modules built around Intel Core Ultra 200S/200U/200H processors delivering high-performance computing and AI acceleration for industrial, edge, and AI-driven applications. The Portwell PCOM-B887 (Size C) module is built around the 200S Series, offers up to 36 TOPS, supports 192GB DDR5 memory, and features 42 PCIe lanes up to Gen5. The PCOM-B886 (Size B) module supports 200H/200U Series processors, which deliver up to 99 TOPS, support 96GB DDR5 memory, and include 24 PCIe lanes. Both modules feature various I/O options, including USB4, USB3.2 Gen2, and multiple display outputs. Portwell PCOM-B887 – COM-HPC Client Type Size C module The PCOM-B887 COM-HPC Client Type Size C module is powered by Intel Core Ultra 200S Series processors, which feature up to 36 TOPS of AI performance via an integrated neural processing unit (NPU). It supports up to 192GB of DDR5 memory at 4800MT/s with 42 […]

January 8, 2025January 8, 2025 by Jean-Luc Aufranc (CNXSoft) - 1 Comment

conga-HPC/cBLS COM-HPC Client Size C Computer-on-Module features Intel Core Bartlett Lake S processor (series 2)

conga-cBLS COM-HPC Intel Barlett Lake S module

Congatec conga-HPC/cBLS is a family of COM-HPC Computer-on-Modules (COMs) powered by Intel Core Bartlett Lake S processors and designed for edge and infrastructure applications such as medical imaging, test & measurement, communication & networking, retail, energy, banking, video surveillance (traffic monitoring) and optical inspection among others. The COM-HPC Client Size C (120×160 mm) modules feature up to an Intel Core 7 251E Bartlett Lake S processor with eight Performance cores and sixteen Efficient cores for a total of 32 threads, support up to 128GB DDR5 memory via four SO-DIMM sockets, and integrate two 2.5GbE controllers. Congatec conga-HPC/cBLS specifications: Bartlett Lake-S SoC Intel Core 3 201E quad-core processor with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770; PBP: 60W Intel Core 5 211E 10-core processor with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / […]

June 2, 2024June 5, 2024 by Sponsored Post - No Comments

High-Performance Edge Computing with PICMG COM-HPC: A Virtual Event Series (Sponsored)

Doug Sandy is the CTO of PICMG, an industry consortium focused on developing open and modular computing specifications. He, along with dozens of member companies who participated in the development of the upcoming COM-HPC specification, believes that engineers building edge systems need new hardware. “Between converged network rollouts and advances in AI, the hardware requirements for edge computing have changed,” Sandy says. “Modern edge workloads need a combination of high-end compute, managed power consumption, and low-latency data transmission.” These merging requirements led PICMG to pursue a new standard for high-performance computing. The result is COM-HPC, a computer-on-module specification that brings unprecedented computing power and I/O bandwidth to resource-constrained applications. First ratified in 2021, COM-HPC has expanded to address various use cases. Most recently, COM-HPC Mini was created to address small form factor applications. “COM-HPC Mini introduces a credit-card-sized form factor with features like expanded connectivity support, efficient thermal management, and […]

October 11, 2023November 21, 2025 by Jean-Luc Aufranc (CNXSoft) - 2 Comments

COM-HPC 1.2 specification released with COM-HPC Mini 95x70mm form factor

PICMG has announced the release of the COM-HPC 1.2 specification adding the COM-HPC Mini form factor that’s about the size of a credit card (95x70mm) or half the size of the next-smallest COM-HPC form factor but still provides access to high-speed interfaces such as PCIe Gen5, USB4, and 10GbE. The COM-HPC “High-Performance Computing” form factor was introduced a few years ago for more powerful CPUs (higher TDP) with support for PCIe Gen4 (the COM Express form factor can’t handle PCIe Gen 4 clock speeds and throughputs well), and until now four sizes were available with COM-HPC Client Type modules measuring 95 x 120mm (Size A) to 160 x 120mm (Size C) and Server Type modules having either 160 x 160mm (Size D) or 200 x 160mm (Size E) dimensions. The COM-HPC Mini brings a smaller (95 x 60 mm) credit card-sized form factor to the COM-HPC standard for applications such […]