ADLINK COM-HPC Ampere Altra 80-core Arm server module targets embedded applications

ADLINK COM-HPC Ampere Altra

ADLINK has integrated Ampere Altra, an up to 80-core Armv8.2 server processor with up to 175W TDP, into a COM-HPC module designed for embedded applications, together with the AVA Developer Platform equipped with a 32-core processor and housed in an “ultra-silent liquid-cooled tower system”. Both the ADLINK COM-HPC Ampere Altra module and the developer kit are compliant with the just-announced Arm’s Scalable Open Architecture for Embedded Edge (SOAFEE), a “software initiative and reference implementation providing a cloud-native environment for embedded edge development”. ADLINK COM-HPC Ampere Altra COM-HPC Ampere Altra key features and specifications: SoC – Ampere Altra with 32x to 80x Armv8.2 Neoverse N1-based cores with up to 3.3 GHz frequency,  up to 128 lanes of high-speed PCIe Gen4 and 8×72 ECC protected DDR4 3200 memory; TDP: 60 to 175 Watts depending on the number of cores System Memory – Up to 768GB DDR4 with 6x individual memory channels Networking […]

Overview and List of System-on-Module and Computer-on-Module Standards – Q7, SMARC, COM HPC, and More

QSeven_vs_SMARC

A System-on-Module (SoM), also known as a Computer-on-Module (CoM), is a small board with the key components of a computer such as SoC, memory, and possibly others components such as PMIC (Power Management IC), an Ethernet PHY, as well as one or more connectors used to connect to a baseboard, also called carrier board, which features standard ports such as Ethernet (RJ45), USB ports, SATA, power jack and so on. The advantages of using of baseboard + SoM design compared to a single board are at least twofold: Most of the PCB design complexity is often around the CPU/SoC and high-speed buses connected to the CPU/SoC. So you could buy an SoM, design your own baseboard and get a complete design relatively in a short amount of time, with reduced development resources and costs. The design is modular, so you could easily upgrade from one SoM to another one. For […]

Congatec COM-HPC & COM Express Xeon modules target high-end IoT gateways, medical edge applications

Tiger Lake-H COM-HPC & COM Express CPU modules

Yesterday, we wrote about ADLink Express-TL COM Express Basic Size Type 6 module powered by the latest Intel Tiger Lake-H Xeon, Core, and Celeron processors designed for high-end industrial & embedded systems. But as one would expect more such modules are coming to market, and Congatec announced both COM-HPC and COM Express CPU modules based on Intel Tiger Lake-H processors with target applications include high-end IoT gateways and medical edge applications. Let’s check out both conga-HPC/cTLH COM-HPC Client Size B modules (120mm x 120mm), as well as the conga-TS570 COM Express Basic Type 6 modules (125mm x 95mm). conga-HPC/cTLH COM-HPC module Key features and specifications: SoC – Choice of ten Intel Xeon, Core i3/i5i/7, or Celeron 6600HE processors with Intel Xe Gen12 graphics part of Tiger Lake-H family System Memory – Up to 4 SO-DIMM sockets for DDR4 ECC memory modules up to 32 GB each (128 GB total) with […]

Congatec Unveils COM Express & COM-HPC Tiger Lake Computers-on-Module

conga-TC570 Tiger Lake COM Express Module

Intel Core “Tiger Lake” processors designed for ultra-thin laptops have just been officially launched together with some laptop announcements. But Tiger Lake processors will find their way into embedded applications as well, with Congatec announcing conga-TC570 COM Express Type 6 Compact module and conga-HPC/cTLU​ COM-HPC high-performance module both featuring Intel Tiger Lake-UP3 (12W to 25W TDP) processors. conga-TC570 Tiger Lake COM Express Module Specifications: SoC – Intel Core i3/i5/i7 Tiger Lake-UP3 processor with up to 96 EU Intel Iris Xe graphics; 12W-28W configurable TDP System Memory – Up to 2x SO-DIMM sockets for DDR4 memory modules up to 32 GB each with 3200 MT/s ECC and non-ECC supported Networking – Intel i225 Gigabit Ethernet controller with TSN support COM Express board-to-board connectors with 440 pins Video Output – HDMI 2.0/2.1, DP 1.4, MIPI D-PHY 2.1; up to 4x independent display unit (4x 4K or 2x 8K) Storage – 2x SATA […]