HPMicro HPM64G0 – A 1 GHz RISC-V microcontroller

1GHz RISC-V Microcontroller

Yesterday, I ended up on the HPMicro website showing the illustration above about a 1 GHz MCU called HPM64G0. It looked interesting enough so I clicked on the link to a page with some documentation for the company’s HPM6700/6400 microcontrollers. But in typical Chinese fashion, I was asked for a mobile phone number to download the documents. No luck this time since a Chinese mobile phone number is required. If anybody can set up a mirror on Mega or other websites easily accessible outside of China that would be appreciated. But eventually, I found an article in Chinese on EETrend where we can learn more about the HPM64G0 which happens to be a 1GHz microcontroller based on the RISC-V architecture. We already had one of those for Arm with the NXP i.MX RT1170, but I had yet to see any RISC-V microcontrollers clocked at such a high frequency. HPMicro HPM64G0 […]

LILYGO T-RSC3 ESP32-C3 board features isolated RS232 & RS485 interfaces, 5 to 24V DC input

ESP32-C3 board with RS232 and RS485

LILYGO T-RSC3 is a relatively compact ESP32-C3 board with WiFi 4 and Bluetooth LE 5.0 connectivity, support for RS232 and RS485 communication protocols through a DB9 connector and a terminal connector respectively, and a wide 5V to 24V DC power input. LILYGO had already made an ESP32 board with CAN Bus and RS485 interfaces called the T-CAN485, but without any isolation. The new T-RSC3 offers both RS232 and RS485 interfaces, but no CAN Bus, protected by isolated transceiver modules that should make it safer to use in industrial environments. LILYGO T-RSC3 board specifications: Wireless module – Espressif Systems ESP32-C3-MINI-1U module with ESP32-C3 RISC-V microcontroller @ 160 MHz with 400 KB SRAM, 2.4 GHz WiFi 4, Bluetooth 5.0 LE & Mesh, 4MB flash, and a u.FL antenna connector Industrial control interfaces RS232 via DB9 connector, RSM232MT5V isolated transceiver with 3000V isolation, 4.75~5.25V input, 5V/50mA output, baud rate from 1200 to 256,000 […]

ArmSoM RK3588 AIModule7 NVIDIA Jetson Nano-compatible SOM

Quiet, ultrathin AirJet solid state active cooling chips could replace fans

AirJet Mini

Frore Systems Airjet Mini and Airjet Pro are active cooling chips that are just 2.8mm thick and quietly suck cool air in from the top of the chip before pushing it out the sides with the aim to replace traditional fan-based solutions in ultrabooks, or be integrated into VR headsets and smartphones for improved cooling. Yesterday we saw that cameras could clean themselves with micro-vibrations, and it happens that processors can be cooled with vibrations too as the Airjet chips are comprised of tiny membranes that vibrate at ultrasonic frequencies to generate a flow of air that enters through inlet vents in the top and transformed into high-velocity pulsating jets exiting from one side of the chip. The AirJet module is actually not placed directly on the processor in ultrabooks but on copper pipes because it allows for thinner designs that way. The company says the AirJet Mini and Pro […]

VAR-SOM-MX93 SO-DIMM NXP i.MX 93 SoM features WiFi, Bluetooth, Audio codec

NXP i.MX 93 development board

Variscite VAR-SOM-MX93 is a 200-pin SO-DIMM system-on-module based on NXP i.MX 93 dual-core Cortex-A55/M33 AI processor with up to 2 GB LPDDR4 RAM, 64GB eMMC flash, and onboard WiFi & Bluetooth module and audio driver. The Variscite module follows the announcement of two other NXP i.MX 93 system-on-modules, namely the Forlinx FET-MX9352-C with board-to-board connectors and the iWave Systems iW-RainboW-G50M LGA module compliant with OSM Size L form factor to be soldered directly on the carrier board. VAR-SOM-MX93 specifications: SoC – NXP i.MX 93 with up to 2x Cortex-A55 cores @ 1.7GHz, 1x Cortex-M33 real-time co-processor @ 250 MHz, 0.5 TOPS NPU, 2D PxP graphics engine System Memory – 512MB to 2GB LPDDR4 Storage – 8 to 64GB eMMC flash, 4KB EEPROM Ethernet – ADIN1300 Gigabit Ethernet PHY Wireless module Single-band 802.11 b/g/n WiFi 4 or dual-band 802.11 ac/a/b/g/n WiFi 5 Bluetooth 5.2 classic + LE Audio – Unnamed Audio […]

CHIPSEA CST85F01 480 MHz Cortex-M4 MCU supports dual-band WiFi 6 and Bluetooth 5.0 LE

Dual-band WiFi 6 IoT module

CHIPSEA CST85F01 is an Arm Cortex-M4F microcontroller clocked at up to 480 MHz and designed for IoT applications with dual-band (2.4/5.0 GHz) WiFi 6 with TWT (Target Wake Time) support, Bluetooth 5.0 LE, and a range of I/Os. Following the recent availability of 2.4 GHz WiFi 6 IoT chips such as Espressif Systems ESP32-C6 and Bouffalo Lab BL616, CHIPSEA CST85F01 offers an alternative with dual-band WiFi 6 connectivity while we are waiting for the launch of the ESP32-C5 RISC-V microcontroller. CST85F01 specifications: CPU core – Arm Cortex-M4F CPU with MPU and FPU @ up to 480 MHz Memory – 992 KB SRAM, SDR/DDR PSRAM interfaces Storage – 752 KB ROM, 8 Mbit to 128 Mbit flash WiFi features 2.4GHz/5GHz Wi-Fi 6 Data rates up to 286.8 Mbps (Tx) and 229.4 Mbps (Rx) with 20/40 MHz bandwidth Rx sensitivity – -98dBm in 11b mode, -93.5dBm in MCS0 HT20 mode Tx power […]

XCY-X66 is a tiny Intel Celeron N5105 Mini PC with four 2.5GbE ports

Mini PC 4x 2.5GbE ports

XCY-X66 is a tiny (75 x 75 x 52mm) mini PC based on Intel Celeron N5105 Jasper Lake and equipped with four 2.5GbE ports using Intel i225V controllers that should make it suitable for a range of networking applications. The small actively-cooled computer also comes with 8GB LPDDR4X, an M.2 2242 socket suitable for NVMe or SATA storage, one 4K-capable HDMI 2.0 port, and a few USB ports. XCY-X66 mini PC specifications: SoC – Intel Celeron N5105 quad-core Jasper Lake processor @ 2.0GHz / 2.9GHz (Turbo) with Intel UHD graphics 605; 10W TDP System Memory – 8GB LPDDR4X Storage 1x M.2 M-key 2242 socket for NVMe PCIe 3.0 or SATA 3.0 SSD MicroSD card slot Video Output – 1x HDMI 2.0 up to 4Kp60 Networking – 4x 2.5GbE RJ45 ports via Intel i225V 2.5GbE controllers USB – 2x USB 3.0, 1x USB 3.0 Type-C port, 1x USB Type-C  for power […]

Rockchip RK3568, RK3588 and Intel x86 SBCs and SoMs in 2025

Teledyne e2v releases Hydra3+ high-resolution ToF sensor with 832 x 600 resolution

Hydra3D+ high-resolution ToF sensor

Teledyne e2v Hydra3D+ is a high-resolution Time-of-Flight (ToF) CMOS image sensor with 832 x 600 resolution, designed for real-time 3D detection and measurement without motion artifacts. The first ToF sensor I used was an STMicro VL53L0X ranging sensor that could measure distances accurately and quickly up to 2 meters away, then the company started to launch multi-zone ToF ranging sensors such as the VL53 that enabled new features such as touch-to-focus, multiple-target identification, flash dimming, or video tracking assistance, and one variant used for human detection. But the 832×600 resolution of Hyrdra3D+ brings even more interesting use cases with the ability to create 3D maps in real time. Hydra3D+ ToF sensor specifications: Sensor Resolution – 832 x 600 pixels Aspect Ratio – 4 : 3 Size type – 2/3″ (10.3 mm diagonal) Pixel type/size – square – Three-tap global shutter – gated global shutter / 10 μm Maximum frame rate […]

UP Xtreme i12 Edge mini PC features Alder Lake-P SoC up to Intel Core i7-1270PE

UP Xtreme i12 Edge mini PC

AAEON has just launched the UP Xtreme i12 Edge mini PC based on the company’s UP Xtreme i12 SBC equipped with an Intel Core i7-1270PE and other Alder Lake processors, up to 32GB LPDDR5 memory, and support for two M.2 NVMe SSD as well as SATA storage The Xtreme i12 Edge is the successor of the Xtreme i11 Edge Compute Enabling Kit powered by a choice of Intel Tiger Lake processors. It also comes with 2.5GbE and GbE networking, one USB4 port, several USB 3.2 Gen2 ports, HDMI and DisplayPort video outputs, plus some COM ports and a terminal block for GPIOs. UP Xtreme i12 Edge mini PC specifications: Alder Lake-P SoC (One or the other) Intel Core i7-1270PE 12-core/16-thread processor @ 3.30GHz / 4.50GHz (Turbo) with 96EU Intel Xe graphics – PBP: 28W, up to 64W MTP Intel Core i5-1250PE 12-core/16-thread processor @ 3.20GHz / 4.40GHz (Turbo) with 80EU […]

Boardcon CM3588 Rockchip RK3588 System-on-Module designed for AI and IoT applications