Back in May, Intel and Rockchip announced a partnership to develop 3G and LTE “Sofia” SoC for mobile devices, a few months later, Rockchip VP posted a picture of dual core development board (6321 solution) on Weibo with Rockchip and Intel technology, and the companies have showcased solutions based on XMM 6321 during the Hong Kong Electronics Fair.
Intel XMM 6321 appears to be a two-chip solution comprised of:
- XG632 SoC with a dual core Intel processor, a GPU, ISP?, VPU and a 2G/3G modem
- Intel/Infineon AG620 Communication Combo with 2G/3G RF, Wi-Fi/BT, GPS, GLONASS and Audio/PMU.
XG632 will be the first processor from Intel and Rockchip collaboration, but it may not be part of “Sofia” family. with quad core 64-bit Sofia 3G-R and Sofia LTE SoCs coming at later date. XG632 is for entry-level smartphones (<$30) and tablets (<$40), whereas the upcoming Sofia SoCs will be seen in mainstream devices.
Charbax filmed Rockchip solutions at Hong Kong Electronics Fair, and he claims XG632 is actually a dual ARM Cortex A5 processor, but this is not consistent with the diagram above showing an “Intel Dual-Core”, and I could not confirm it with any other news sources, so wait and see.
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