Intrinsyc has just announced the availability of the Open-Q 212A system-on-module and Home Hub Development Kit based on Qualcomm Home Hub 300 Platform powered by the Qualcomm APQ8009 SoC better known as Snapdragon 212.
The module supports multi-mic beamforming, audio canceling, HiFi audio, as well as WiFi 5 and Bluetooth connectivity, which makes it suitable for integration into cost-sensitive home hub, home automation, and smart audio devices featuring voice control, AI, and wireless connectivity.
Open-Q 212A SoM, which should not be confused with the company’s Open-Q 212 SBC released two years ago, features for the following specifications:
- SoC – Qualcomm Snapdragon 212 processor (APQ8009) quad-core Arm Cortex-A7 @ 1.267GHz with Adreno 304 GPU, Qualcomm QDSP6 DSP
- System Memory – 1GB LPDDR3 RAM
- Storage – 4GB eMMC Flash storage
- Video – [email protected] playback; up to 720p playback with H.264 (AVC) and H.265 (HEVC); up to 720p H.264 (AVC) capture
- Audio – Qualcomm WCD9326 Hi-Fi audio codec
- Pre-certified dual-band Wi-Fi/BT module with 802.11a/b/g/n/ac 2×2 MU-MIMO and Bluetooth 4.2 + BLE
- 3x MHF4 antenna connectors: 2 for Wi-Fi, 1 separate for BT
- Location Services – GPS, GLONASS, Compass (WGR7640) w/ U.FL antenna connector
- 3x 100-pin board-to-board connector exposing:
- 1x headset interface
- 4x analog microphone inputs
- 1x stereo line outputs
- 4x digital mic inputs via audio codec, 2x digital mic inputs connected directly to the processor
- I2S interface for external audio devices
- Camera Interface – Up to 8MP over 4-lane MIPI CSI interface
- Display Interface – 4-lane MIPI DSI interface for LCD up to 720p with a touchscreen interface
- USB – 1x USB 2.0 interface
- Multiple BLSP ports (GPIO, UART, SPI, I2C buses)
- Debug UART
- Power Supply
- Power input – 3.6V to 4.2V
- Qualcomm power management and battery charging solution (PM8916)
- Dimensions – 50mm x 46.5mm with 4x mounting holes for mounting and thermal solutions (aka heatsink and/or fan)
- Temperature Range – 0°C to +50°C
The company provides OpenEmbedded Yocto Linux for Home Hub applications with Qualcomm Fluence Pro. However, as it often the case, not all hardware features are currently supported by the software, so missing features like LCD display support will be implemented over time.
Intrinsyc Home Hub 300 development kit key features and specifications:
- SoM – Open-Q 212A system-on-module as described above
- Carrier Board features:
- Qualcomm stereo speaker amps (WSA8815) with speaker wire terminals
- Digital microphone array (6 mics)
- Digital audio expansion header and analog audio expansion header
- Display – 4-lane MIPI DSI connector for optional LCD (not supported by current SW); Note: There’s clearly an HDMI port in the baseboard, but it’s unclear if that’s supported at all.
- Camera – 4-lane MIPI CSI camera connector for optional camera accessory
- USB – 2x USB2 Type A host ports, 1x USB micro-B device ADB port, 1x Debug UART USB micro-B port
- Wireless Antennas
- 2x Wi-Fi PCB antennas (2×2 MIMO) + separate Bluetooth PCB antenna for isolation
- GNSS receiver front-end LNA/BPF + PCB antenna
- Power Supply – 12V/3A
- Dimensions – 170 x 115mm
The development kit will also support Zigbee, 802.15.4, and Bluetooth LE 5.0 via an optional Qualcomm QCA4024 SoC add-on board that should become available in late June 2019.
The development kit aims to jump-start the development of home hub, voice controlled, or smart speaker products requiring noise cancellation, voice recognition, or other advanced audio features.
The Open-Q 212A SoM goes for $65 for one sample, while the Open-Q 212A development kit can be purchased for $595 with the board and module, 12V power supply, Quick Start Guide, and access to documentation, software update, and basic support. More details can be found in the respective product pages here and there.
Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.
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