i.MX 8M Plus solderable LGA module follows OSM Size-L standard

SGET Open Standard Module (OSM) specification was ratified in November 2020. It defined specifications for solderable LGA system-on-modules, and we first noticed it though through the launch of F&S Elektronik “FS 8MM OSM-SF” module powered by an NXP i.MX 8M Mini processor, and following OSM Size-S standard (30x30mm).

As we noted in our introduction about the Open Standard Module, SGET defined four sizes from Size-0 (30x15mm) to Size-L (45x45mm), and there’s now at least one “Large” OSM module courtesy of iWave Systems, and their iW-RainboW-G40M module equipped with an NXP i.MX 8M Plus processor for AI applications.

iW-RainboW-G40M specifications:

  • SoC- NXP i.MX 8M Plus Q/QL/D quad-/dual-core Cortex-A53 processor up to 2.0 GHz, with Arm Cortex-M7 real-time core @ 800 MHz, Vivante GC7000UL 3D GPU, Vivante GC520L 2D GPU, 2.3 TOPS NPU
  • System Memory – Up to 8GB LPDDR4 Memory
  • Storage – Up to 256GB eMMC flash
  • Wireless – 802.11a/b/g/n/ac/ax Wi-Fi 6 & Bluetooth 5.0 (802.11ax is optional)
  • Power Supply – 5V/2.5A
  • Dimensions – 45×45 mm (OSM v1.0, Size-L Solderable Module)
  • 10+ years of Product Longevity Program

The module supports Android 11 and Ubuntu 20.04 with Linux 5.4.24 or higher.

iWave Systems also provides a Pico-ITX SBC with the following specifications:

  • Supported SoM – iW-RainboW-G40M
  • Storage – MicroSD card socket
  • Video Output
    • 1x HDMI port
    • MIPI DSI for 5.5-inch 1080p display (option)
    • LVDS connector for 10.1” LVDS display (option)
  • Camera I/F – 1x MIPI CSI connector
  • Audio – Audio In & Out Jack through I2S Codec
  • Networking – 2x Gigabit Ethernet jack
  • GNSS – GNSS receiver Module – GPS/GLONASS/Galileo/BeiDou
  • USB – 2x USB 3.0, 1x USB 2.0 OTG (micro AB Receptacle Connector), 2x USB 2.0 Host Type-A ports
  • Debugging –  1x UART
  • Expansion
    • 1x CAN header
    • 1x RS232 header
    • 1x M.2 Connector Key B/M (Key M is optional)
    • 8-bit SD (Optional)
  • Misc – RTC with a backup battery
  • Power Supply – Via power barrel jack
  • Dimensions  – 100 x 72 mm (Pico-ITX form factor)

The module and SBC appears to be available now, but the company does not provide public pricing. More information may be available on the product page.

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2 Replies to “i.MX 8M Plus solderable LGA module follows OSM Size-L standard”

    1. To get an idea about the price of system-on-modules, I’d recommend checking out MYIR Tech and Compulab. Not only for i.MX 8M PLus, but any modules.

      https://www.cnx-software.com/2021/12/22/myir-introduces-i-mx-8m-plus-module-and-devkit-with-ai-ml-capabilities/
      https://www.cnx-software.com/2021/03/03/i-mx-8m-plus-systems-on-module-list-embedded-world-2021/#compulab-ucm-imx8m-plus

      You can even see a table with the price of options for the Compulab module.

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