Intrinsyc Open-Q 820Pro SoM Comes with a Faster Snapdragon 820E Processor, 4GB RAM

Snapdragon 820E Development Board

Intrinsyc Open-Q 820 system-on-module was introduced in 2017 with a Qualcomm Snapdragon 820 processor, 3GB RAM, and a built-in wireless module for 802.11ac WiFi 5, and Bluetooth 4.1 connectivity. The company has now announced an almost identical ultra-compact module but based on Qualcomm Snapdragon 820E and featuring 4GB RAM. Open-Q 820Pro μSoM is a drop-in replacement for Open-Q820 requiring only some software changes. Snapdragon 820E is said to deliver 9% faster CPU and 5% faster GPU speeds at the same power consumption compared to Snapdragon 820. Open-Q 820Pro μSoM specifications: SoC – Qualcomm Snapdragon 820E (APQ8096SG) Embedded Platform with four Kryo cores including 2x cores @ up to 2.342GHz, and 2x cores @ up to 1.6GHz, Adreno 530 GPU @ 652.8 MHz,  Hexagon 680 DSP @ 825 MHz System Memory – Dual-channel 4 GB LPDDR4  @ 1866 MHz (PoP) Storage – 32 GB UFS 2.0 1-lane gear3 flash Connectivity Pre-certified 802.11 b/g/n/ac 2×2 MU-MIMO WiFi 5 and  Bluetooth 4.1 module …

Intrinsyc Launches Open-Q 212A SoM & Qualcomm Home Hub 300 Development Kit

Snapdragon 212 Home Hub SBC

Intrinsyc has just announced the availability of the Open-Q 212A system-on-module and Home Hub Development Kit based on Qualcomm Home Hub 300 Platform powered by the Qualcomm APQ8009 SoC better known as Snapdragon 212. The module supports multi-mic beamforming, audio canceling, HiFi audio, as well as WiFi 5 and Bluetooth connectivity, which makes it suitable for integration into cost-sensitive home hub, home automation, and smart audio devices featuring voice control, AI, and wireless connectivity. Open-Q 212A system-on- module Open-Q 212A SoM, which should not be confused with the company’s Open-Q 212 SBC released two years ago, features for the following specifications: SoC – Qualcomm Snapdragon 212 processor (APQ8009) quad-core Arm Cortex-A7 @  1.267GHz with Adreno 304 GPU, Qualcomm QDSP6 DSP System Memory – 1GB LPDDR3 RAM Storage – 4GB eMMC Flash storage Video – [email protected] playback;  up to 720p playback with H.264 (AVC) and H.265 (HEVC); up to 720p H.264 (AVC) capture Audio – Qualcomm WCD9326 Hi-Fi audio codec Wireless …

Intrinsyc Open-Q 855 Snapdragon 855 Development Board Launched for $1,149

Snapdragon 855 SBC

When we wrote about Qualcomm Snapdragon 855 Hardware Development Kit last month, and while it was not available at the time, we expected it to eventually be sold through Intrinsyc. And sure enough, the company is now taking orders for the very first Snapdragon 855 development board sold under the “Open-Q 855” name. Price tag: $1,149 for the board only. The expansion board and display pictured below are not included by default and sold separately We already had a pretty good idea of the technical details last month, but Intrinsyc has provided us with the missing bits of information for Snapdragon 855 HDK specifications: SoC –  Qualcomm Snapdragon 855 Octa-core processor with 1x Kryo 485 Gold Prime core at up to 2.7+ GHz, 3x Kryo 485 Gold cores at up to 2.4+ GHz, and 4x Kryo 485 Silver low-power cores at up to 1.7 GHz, Adreno 640 GPU, Hexagon 690 DSP System Memory – 6GB LPDDR4x RAM Storage – 128GB …

Intrinsyc Qualcomm Flight Pro Development Kit Targets High-end Drones and Robotics

Qualcomm Flight Pro Development Kit

Intrinsyc is known for manufacturing and selling mobile  development platforms (MDP) & hardware development kits (HDK) for Qualcomm Snapdragon processors, but this time the company is taking pre-orders for a slightly different Qualcomm development platform: Qualcomm Flight Pro development kit / reference design that targets the development of high-end drones and robotics projects.   Qualcomm Flight Pro board specifications: SoC – Qualcomm Snapdragon 820 (APQ8096) with quad core Kryo processor @ up to 2.15GHz, Adreno 530 GPU, and Hexagon 680 DSP System Memory – 4GB LPDDR4 RAM Storage – 32GB UFS Flash storage, microSD card slot Wireless Connectivity – WiFi 5 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.2 via pre-certified QCA6174A module  + 2x Wi-Fi/BT antennas Location Technology Integrated GNSS solution based on WGR7640 (not recommended for flight applications) Support for U-blox MAX-M8Q-0-00 external GNSS module with high performance antenna and shielding Sensors – Dual IMU (2x Invensense MPU9250): Gyroscope, Accelerometer, Compass + Barometric pressure sensor (Bosch BMP280) Cameras …

Intrinsyc Open-Q 605 SBC is Powered by Qualcomm QCS605 IoT Processor

Qualcomm QCS605 Development Board

Qualcomm QCS603 / QCS605 “Internet of Things” processors were announced last spring as the first “Qualcomm Vision Intelligence Platforms” from the company and designed for artificial intelligence and computer vision applications. Both SoCs are octa-core processor with two performance Kryo 300 Gold cores, and six efficiency Kryo 300 Silver cores, but QCS605’s big cores are clocked at a higher 2.5 GHz frequency, and the processor comes with better 802.11ac Wave2 WiFi, support for up to 32MB camera, and 4K video capture. However so far, there was no development platform publicly available, and this has just changed with Intrinsyc announcing Open-Q 605 single board computer (SBC) and development kit featuring Qualcomm QCS605 vision intelligence platform. Open-Q™ 605 SBC Specifications SoC – Qualcomm QCS605 octa-core processor with 2x high-performance Kryo 300 Gold cores up to 2.5 GHz, 6x low-power Kryo 300 Silver cores up to 1.7 GHz, Hexagon 685 DSP with Hexagon vector extensions (HVX), Adreno 615 GPU Neural Processing – Qualcomm AI …

Intrinsyc Open-Q 670 HDK Development Kit Features Snapdragon 670 Processor

Qualcomm introduced the Snapdragon 670 this August with improved camera capabilities and improved performance, including a near doubling of the performance of the AI Engine over the one in Snapdragon 660. Intrinsyc is normally the first company to launch mobile development platform for Qualcomm processor, and this time is no exception, as the company has just introduced Open-Q 670 HDK Development Kit with Snapdragon 670 Mobile Platform. Open-Q 670 HDK specifications: SoC – Qualcomm Snapdragon SDA670 Octa-core 64-bit Kryo 360 processor with 2x high-performance Gold cores @ 2.016 GHz, 6x low-power Silver cores @  1.708 GHz, Qualcomm Adreno 615 GPU @ 430 MHz, and Qualcomm Hexagon 685 DSP dedicated for Computer Vision and Video Post Processing System Memory – 6GB LPDDR4x RAM Storage – 64GB eMMC 5.1 Flash Storage (non-PoP memory) + uSD card socket Display MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel accessory (5.65″ FHD+ 2160×1080 resolution) HDMI Video output via DSI …

Snapdragon Wear 2500 Launched for the 4G LTE Kid Watch Market

Snapdragon Wear 2500

Qualcomm has made several announcements at Mobile World Congress Shanghai 2018. We’ve already covered Snapdragon 632, 639, and 629 processors for mid- and high-tier smartphones, but the company has also finally announced a new SoC for wearables succeeding Snapdragon Wear 2100. Meet Snapdragon Wear 2500, specifically targeting 4G children watches. Qualcomm is usually not the best company when it comes to releasing technical details about their processors, but here what Snapdragon Wear 2500 specifications should look like: Processor – 4x Arm Cortex A7 GPU – Adreno-class GPU Connectivity – Fifth generation 4G LTE modem with RF front-end (RFFE), location engine, “Bluetooth streaming architecture”, NXP NFC solution Camera I/F – 5MP Ultra-low power sensor hub working with InvenSense sensors Power  – Wearable PMIC reducing Rock Bottom Sleep Current (RBSC) by percent, charger, fuel gauge Compact package Snapdragon Wear 2500 is designed for low power with up to 14 percent longer battery life for both active and standby modes of operation compared …

Intrinsyc Introduces Open-X 8M SoM and Mini-ITX Development Kit with Optional LCD Display

Intrinsyc announced their own NXP i.MX 8M system-on-module, as well as a corresponding development kit back in February 2018 for Embedded World 2018. Somehow I missed it until today when the company tweeted about the kit unboxing video, so let’s have a look, starting with the module itself.Open-X 8M SoM specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ up to 1.5 GHz, Arm Cortex-M4 core with 256 KB tightly coupled memory (TCM), Vivante GC7000Lite GPU System Memory – 3GB LPDDR4 RAM Storage – 16GB eMMC Flash Video – 4Kp60 HEVC/H.265 main, and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder On-module Connectivity – WiFi  802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module 3x 100 pin board to board connectors exposing: Display Interfaces HDMI 2.0a up to 4096 x 2160 at 60 Hz 4-lane MIPI DSI interface up to 1920×1080 at 60 Hz Camera Interfaces …