Intrinsyc Qualcomm Flight Pro Development Kit Targets High-end Drones and Robotics

Qualcomm Flight Pro Development Kit

Intrinsyc is known for manufacturing and selling mobile  development platforms (MDP) & hardware development kits (HDK) for Qualcomm Snapdragon processors, but this time the company is taking pre-orders for a slightly different Qualcomm development platform: Qualcomm Flight Pro development kit / reference design that targets the development of high-end drones and robotics projects.   Qualcomm Flight Pro board specifications: SoC – Qualcomm Snapdragon 820 (APQ8096) with quad core Kryo processor @ up to 2.15GHz, Adreno 530 GPU, and Hexagon 680 DSP System Memory – 4GB LPDDR4 RAM Storage – 32GB UFS Flash storage, microSD card slot Wireless Connectivity – WiFi 5 802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.2 via pre-certified QCA6174A module  + 2x Wi-Fi/BT antennas Location Technology Integrated GNSS solution based on WGR7640 (not recommended for flight applications) Support for U-blox MAX-M8Q-0-00 external GNSS module with high performance antenna and shielding Sensors – Dual IMU (2x Invensense MPU9250): Gyroscope, Accelerometer, Compass + Barometric pressure sensor (Bosch BMP280) Cameras …

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Intrinsyc Open-Q 605 SBC is Powered by Qualcomm QCS605 IoT Processor

Qualcomm QCS605 Development Board

Qualcomm QCS603 / QCS605 “Internet of Things” processors were announced last spring as the first “Qualcomm Vision Intelligence Platforms” from the company and designed for artificial intelligence and computer vision applications. Both SoCs are octa-core processor with two performance Kryo 300 Gold cores, and six efficiency Kryo 300 Silver cores, but QCS605’s big cores are clocked at a higher 2.5 GHz frequency, and the processor comes with better 802.11ac Wave2 WiFi, support for up to 32MB camera, and 4K video capture. However so far, there was no development platform publicly available, and this has just changed with Intrinsyc announcing Open-Q 605 single board computer (SBC) and development kit featuring Qualcomm QCS605 vision intelligence platform. Open-Q™ 605 SBC Specifications SoC – Qualcomm QCS605 octa-core processor with 2x high-performance Kryo 300 Gold cores up to 2.5 GHz, 6x low-power Kryo 300 Silver cores up to 1.7 GHz, Hexagon 685 DSP with Hexagon vector extensions (HVX), Adreno 615 GPU Neural Processing – Qualcomm AI …

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Intrinsyc Open-Q 670 HDK Development Kit Features Snapdragon 670 Processor

Qualcomm introduced the Snapdragon 670 this August with improved camera capabilities and improved performance, including a near doubling of the performance of the AI Engine over the one in Snapdragon 660. Intrinsyc is normally the first company to launch mobile development platform for Qualcomm processor, and this time is no exception, as the company has just introduced Open-Q 670 HDK Development Kit with Snapdragon 670 Mobile Platform. Open-Q 670 HDK specifications: SoC – Qualcomm Snapdragon SDA670 Octa-core 64-bit Kryo 360 processor with 2x high-performance Gold cores @ 2.016 GHz, 6x low-power Silver cores @  1.708 GHz, Qualcomm Adreno 615 GPU @ 430 MHz, and Qualcomm Hexagon 685 DSP dedicated for Computer Vision and Video Post Processing System Memory – 6GB LPDDR4x RAM Storage – 64GB eMMC 5.1 Flash Storage (non-PoP memory) + uSD card socket Display MIPI DSI connector with 1x 4-lane DSI port + Touch for included LCD panel accessory (5.65″ FHD+ 2160×1080 resolution) HDMI Video output via DSI …

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Snapdragon Wear 2500 Launched for the 4G LTE Kid Watch Market

Snapdragon Wear 2500

Qualcomm has made several announcements at Mobile World Congress Shanghai 2018. We’ve already covered Snapdragon 632, 639, and 629 processors for mid- and high-tier smartphones, but the company has also finally announced a new SoC for wearables succeeding Snapdragon Wear 2100. Meet Snapdragon Wear 2500, specifically targeting 4G children watches. Qualcomm is usually not the best company when it comes to releasing technical details about their processors, but here what Snapdragon Wear 2500 specifications should look like: Processor – 4x Arm Cortex A7 GPU – Adreno-class GPU Connectivity – Fifth generation 4G LTE modem with RF front-end (RFFE), location engine, “Bluetooth streaming architecture”, NXP NFC solution Camera I/F – 5MP Ultra-low power sensor hub working with InvenSense sensors Power  – Wearable PMIC reducing Rock Bottom Sleep Current (RBSC) by percent, charger, fuel gauge Compact package Snapdragon Wear 2500 is designed for low power with up to 14 percent longer battery life for both active and standby modes of operation compared …

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Intrinsyc Introduces Open-X 8M SoM and Mini-ITX Development Kit with Optional LCD Display

Intrinsyc announced their own NXP i.MX 8M system-on-module, as well as a corresponding development kit back in February 2018 for Embedded World 2018. Somehow I missed it until today when the company tweeted about the kit unboxing video, so let’s have a look, starting with the module itself.Open-X 8M SoM specifications: SoC – NXP i.MX 8M quad-core Arm Cortex-A53 processor @ up to 1.5 GHz, Arm Cortex-M4 core with 256 KB tightly coupled memory (TCM), Vivante GC7000Lite GPU System Memory – 3GB LPDDR4 RAM Storage – 16GB eMMC Flash Video – 4Kp60 HEVC/H.265 main, and main 10 decoder, 4Kp60 VP9 decoder, 4Kp30 AVC/H.264 decoder, 1080p60 MPEG-2, MPEG-4p2, VC-1, VP8, RV9, AVS, MJPEG, H.263 decoder On-module Connectivity – WiFi  802.11a/b/g/n/ac 2.4/5.0 GHz 2×2 MU-MIMO + Bluetooth 4.1 pre-certified module 3x 100 pin board to board connectors exposing: Display Interfaces HDMI 2.0a up to 4096 x 2160 at 60 Hz 4-lane MIPI DSI interface up to 1920×1080 at 60 Hz Camera Interfaces …

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Intrinsyc Open-Q 845 HDK Development Kit for Snapdragon 845 Processor Available for $1079

Qualcomm Snapdragon 845 based devices such as Samsung Galaxy S9/S9+ smartphones and Windows 10 Always-Connected Mobile PCs should start shipping in the next few weeks, and as usual with every new premium Qualcomm Snapdragon Mobile Platform, we get an Open-Q development from Intrynsyc. Intrinsyc Open-Q 845 HDK is also equipped with 6GB LPDDR4x RAM, 128GB UFS2.1 Flash, a wireless module with 802.11ac/ad WiFi and Bluetooth 5.0, Gigabit Ethernet, USB interfaces, HDMI and DisplayPort video output, up to 3 cameras, and plenty more. Intrinsyc Open-Q 845 HDK specifications: SoC – Qualcomm Snapdragon SDA845 Octa-core 64-bit processor with 4x high-performance Kryo 385 cores up to 2.80 GHz, 4x low-power Kryo 385 cores up to 1.8 GHz, Qualcomm Adreno 630 GPU with support for OpenGL ES 3.2, OpenCL 2.0 Full, Vulkan, DX12, and Qualcomm Hexagon 685 DSP System Memory – 6GB LPDDR4x RAM Storage – 128GB UFS2.1 Flash, micro SD 3.0 UHS-1 slot Display Interfaces HDMI 1.4 via DSI -> HDMI bridge on …

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Intrinsyc Launches Open-Q 660 HDK Snapdragon 660 Development Kit

For many years now, Intrinsyc has been releasing Qualcomm mobile development platforms that that are used by companies wanting to design and manufacture smartphones or other products based on Snapdragon processors. Those are usually full featured, including a smartphone display, and well suited to such product development. Their latest development kit is the Open-Q 600 HDK (Hardware Development Kit) powered by Qualcomm Snapdragon 660 SoC, an upgrade to Snapdragon 653 with about 20 percent improvement in CPU performance, and 30 percent in GPU performance. The kit is also equipped with 6GB RAM, 64GB flash, a display, wireless modules, sensors, camera interfaces, expansion headers, and more. Intrinsyc Open-Q 600 specifications: SoC – Qualcomm Snapdragon 660 octa-core processor with Four Kryo 260 performance cores @ up to 2.2GHz, four Kryo 260 low power cores @ up to 1.8GHz Adreno 512 GPU @ up to 650 MHz supporting OpenGL ES 3.0/3.2, Vulkan, DX12 FL 12, OpenCL 2.0 full profile Hexagon 680 DSP with Hexagon …

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Qualcomm Snapdragon 212 Boards – Intrinsyc Open-Q 212 and Kaynes Technology SKATE-212

Qualcomm Snapdragon 212 (APQ8009) quad core Cortex A7 processor is used in entry-level smartphones, but it’s also one of the processors which the company expects to use in their Smart Speaker Platform leveraging Google Assistant, Amazon Alexa, and other A.I. voice services. Two company has designed single board computers that can be used for this purpose: Intrisync Open-Q 212 and Kaynes Technology SKATE-212. Intrisync Open-Q 212 SBC Development Board Contrary to some other Open-Q boards, but not all, Open-Q 212 is not comprised of a baseboard and a system-on-module, as everything is soldered on a single PCB. Open-Q 212 specifications: SoC – Qualcomm Snapdragon 212 (APQ8009) quad core ARM Cortex A7 processor @ 1.267GHz with Adreno 304 GPU, QDSP6 DSP System Memory – 1GB LPDDR3 Storage – 8GB eMMC (non-POP) flash and micro SD card socket Connectivity – Ethernet,  pre-scanned Wi-Fi 802.11n 2.4Ghz (WCN3610) with chip and U.FL antennas, Bluetooth 4.1 LE Display – Up to 720p LCD; up to 720p …

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