CNX Software – Embedded Systems News

Silicon Labs Introduces Bluetooth 5.2 BGM220S SiP and BGM220P PCB Module

Silicon Labs has recently announced two hardware modules based on the company’s BG22 secure Bluetooth 5.2 SoC, namely BGM220S System-in-Package (SiP) measuring just 6x6mm, and BGM220P, a slightly larger PCB variant optimized for wireless performance along with a better link budget for greater range.

Both modules can be integrated into products with up to 10-year battery life from a single coin cell. All BGM220S/P variants can support Bluetooth Direction Finding and some of the parts can also handle Bluetooth Mesh Low Power protocol.

Silicon Labs BGM220S/P key features:

There are currently two BGM220P PCB modules and three BGM220S SiPs that mostly differ in terms of flash capacity, support for Bluetooth Mesh, and output power range.

Silicon Labs explains the SiP modules are ideal for device makers needing the smallest form factor pre-certified Bluetooth Low Energy with little to no RF design or engineering required, while PCB modules offer many of the same benefits as SiP modules, but at a lower cost.

The company also offers a $99 BGM220 Bluetooth Module Wireless Starter Kit (SLWSTK6103A) to get started with the new parts.

The new BGM220P/S modules currently available for purchase, including on Mouser with sample price starting at $5.25, while the starter kit can be purchased directly from Silabs. Further information may be found on the product page.

Jean-Luc started CNX Software in 2010 as a part-time endeavor, before quitting his job as a software engineering manager, and starting to write daily news, and reviews full time later in 2011.

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