Renesas RZ/G2L and RZ/V2L SMARC 2.1 system-on-modules target HMI and Edge AI applications

ARIES Embedded has recently launched two SMARC-compliant MRZG2LS and MRZV2LS system-on-modules (SoM) powered by respectively a Renesas RZ/G2L dual-core Cortex-A55/M33 microprocessor with Arm Mali-G31 GPU and H.264 video codec (H.264) and a similar Renesas RZ/V2L MPU adding a built-in ‘DRP-AI’ AI accelerator for vision applications.

Those are the first SMARC modules from the company and they are well-suited for applications such as entry-class industrial human machine interfaces (HMIs), embedded vision, edge artificial intelligence (edge-AI), real-time control, industrial Ethernet connectivity, and embedded devices with video capabilities.


ARIES Embedded MRZG2LS and MRZV2LS key features and specifications:

  • SoC – Renesas RZ/G2L or GZ-V2L with
    • Application CPU – Single or dual Arm Cortex-A55 up to 1.2GHz
    • Real-time core -Arm Cortex-M33
    • GPU – Arm Mali-G31
    • VPU – H.264 codec
    • AI accelerator – DRP-AI on Renesas RZ/V2l only (MRZV2L SoM)
  • System Memory – 512MB to 4GB DDR4 RAM
  • Storage – SPI NOR flash, 4GB to 64GB eMMC NAND Flash
  • 314-pin MXM edge connector with
    • Display I/F – MIPI DSI
    • Camera I/F – MIPI CSI
    • Networking – Dual Gigabit Ethernet with PHY
    • USB – USB 2.0 Host/OTG
    • Serial – UART, 2x CAN
    • Analog – ADC
    • Other I/Os – I2C, SPI
  • Dimensions – Compliant with the SGET SMARC 2.1 standard
  • Temperature Range – Commercial: 0°C to +70°C; industrial: -40°C to +85°C

Renesas RZ/G2L SMARC 2.1 system on moduleARIES MRZG2LS block diagram

I can’t find public documentation specific to the modules, but there are plenty of resources and application notes for the Renesas RZ/G2L and RZ/V2L used in the design and the microprocessors are supported by a Verified Linux Package (VLP) featuring the Civil Infrastructure Platform (CIP) Linux distribution.

The company also offers two evaluation kits – the MRZG2LSEVK and MRZV2LSEVK – with a SMARC 2.1 carrier board exposing all the interfaces from the MRZG2LS (RZ/G2L) and MRZV2LS (RZ-V2L) system-on-modules respectively.

SMARC 2.1 Evaluation Kit for Renesas RZ/G2L and RZ/V2L

Ports and connectors on carrier board:

  • Storage – MicroSD card slot
  • Video
    • HDMI output using MIPI DSI to HDMI converter
    • MIPI CSI on connector
  • Networking – 2x Ethernet RJ45 ports
  • USB – USB 2.0 OTG on USB micro AB, USB 2.0 Host on USB Type-A
  • Expansion
    • 2x CAN Bus (DSub9)
    • 2.54mm pitch headers with UART, I2C, SPI
  • Debugging – Console via converter on USB micro AB
MRZG2LS EVK block diagram
Block diagram for the evaluation kits

ARIES embedded says the MRZG2LS and MRZV2LS SoMs will be available in the Q4 2023 but pricing has not been made public even for the devkits. Further details may be found on the product pages for the SoMs and evaluation kits, as well as the press release.

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