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Posted on by Jean-Luc Aufranc (CNXSoft) - 9 Comments on Advantech MIO-5356 – An industrial 3.5-inch SBC based on Intel Core Series 3 “Wildcat Lake” SoC

Advantech MIO-5356 – An industrial 3.5-inch SBC based on Intel Core Series 3 “Wildcat Lake” SoC

Advantech MIO 5356 SBC

Advantech MIO-5356 is the very first hardware platform based on the upcoming Intel Core Series 3 (Core 300) “Wildcat Lake” SoC we’ve seen. It’s a 3.5-inch SBC designed for industrial applications and powered by up to the Intel Core 7 350 hexa-core processor. The fanless board supports up to 64GB DDR5 memory, NVMe SSD storage, up to three independent displays via USB-C, HDMI, and LVDS interface, 2.5GbE and GbE networking with TSN and OOB management, and WiFi, Bluetooth, and Cellular connectivity via M.2 sockets. It also features audio connectors, six USB interfaces, RS232/RS485 and CAN Bus interfaces, and more. Advantech MIO-5356 specifications: Wildcat Lake SoC (one or the other) Intel Core 3 305 hexa-core CPU with 2x P cores @ 1.5 GHz / 4.4 GHz (Turbo) and 4x LPE cores, 16x EU Intel graphics @ 2.3 GHz; TDP: 15W Intel Core 5 320 hexa-core CPU with 2x P cores @ […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Industrial Wi-Fi 7 access point with redundant 12V – 48V DC inputs targets autonomous systems

Industrial Wi-Fi 7 access point with redundant 12V – 48V DC inputs targets autonomous systems

Industrial Wi-Fi 7 access point

Advantech EKI-6333BE-4GD is a tri-band Wi-Fi 7 industrial-grade access point designed for autonomous systems with support for redundant 12V – 48V DC inputs and a -40°C to 75°C operating temperature range. The access point delivers up to 5.8 Gbps throughput over Wi-Fi 7, features four 2.5GbE RJ45 ports, and the Taiwanese company also highlights compliance with IEC 62443 industrial cybersecurity standards and CE RED (Radio Equipment Directive) regulations, as well as support for WPA3 authentication and encrypted SNMP communication. Advantech EKI-6333BE-4GD specifications: SoC / Memory / Storage – TBD Wireless Compatible with IEEE 802.11 a/b/g/n/ac/ax/be standard WiFi 7 bands and maximum speeds 2.4 GHz up to 700 Mbps 5 GHz up to 2,900 Mbps 6 GHz up to 5,800 Mbps Operation modes – Access Point, Client, Repeater Highlighted features – Multi-Link Operation (MLO),  Wi-Fi Multimedia (WMM), Preamble Puncturing Security – WEP, WPA/WPA2/WPA3-Personal, WPA/WPA2/WPA3-Enterprise Up to 6x antennas; 2x2x2 MU-MIMO Ethernet  […]

Posted on by Debashis Das - No Comments on Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

Advantech MIO-5355 3.5-inch SBC features Qualcomm QCS6490 or QCS5430 SoC for industrial edge AI

MIO 5355 Qualcomm Dragonwing QCS6490 SBC

Advantech MIO-5355 is a 3.5-inch SBC based on Qualcomm QCS6490 or QCS5430 Edge AI processor. The board features up to 8GB of LPDDR5 memory, 128GB of UFS storage, and supports various operating systems, including Windows 11 IoT Enterprise, Ubuntu 24.04 LTS, and Yocto Linux. We have seen other QCS6490-based hardware in the past, such as the Radxa Dragon Q6A, the Quectel QSM560DR SBC, or the Rubik Pi 3, most of which come in compact form factors. The Advantech MIO-5355 takes a different approach, using a standard industrial 3.5-inch form factor (146 × 102 mm) and targeting industrial deployments with support for –20°C to 70°C operation and long-term availability. Advantech MIO-5355 specifications: SoC (one or the other) Qualcomm DragonWing QCS6490 CPU – Octa-core Kryo 670 with 1x Gold Plus core (Cortex-A78) @ 2.7 GHz, 3x Gold cores (Cortex-A78) @ 2.4 GHz, 4x Silver cores (Cortex-A55) @ up to 1.9 GHz GPU […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 1 Comment on Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC

Advantech SOM-6820 COM Express module is powered by Qualcomm Snapdragon X Elite Arm SoC

Advantech SOM 6820

Advantech SOM-6820 is a COM Express Type 6 Compact Computer-on-Module powered by a Qualcomm Snapdragon X Elite SoC with up to twelve 64-bit Arm Oryon cores, instead of an x86 processor from Intel or AMD, more commonly found on COM Express modules. The COM also features up to 64GB LPDDR5 memory, two MIPI CSI camera connectors, an RTL8153B USB 3.0 Gigabit Ethernet controller, and a TPM 2.0 security chip. All I/Os are exposed through two standard 220-pin B2B connectors, including DisplayPort and LVDS/eDP interfaces for up to four 4K displays, up to four SATA III for storage, twelve USB 3.0/2.0 interfaces, multiple PCIe Gen4/3 interfaces, and more. With up to 45 TOPS of AI performance, the SOM-6820 is especially well-suited to medical imaging and machine vision applications as well as mission-critical systems and humanoid robots. Advancec SOM-6820 specifications: Snapdragon X Elite SoC variants (one or the other) X1E-00-1DE 12-core up […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 5 Comments on Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs

Qualcomm launches Dragonwing IQ-X SoCs for industrial Windows PCs

Qualcomm Dragonwing IQ-X Windows industrial PC

The Qualcomm Dragonwing IQ-X family, comprised of the IQ-X7181 and IQ-X5181 SoCs, offers eight or twelve Oryon cores clocked at up to 3.4 GHz, an Adreno GPU, and up to 45 TOPS of AI performance for industrial PCs running Windows LTSC. Those are upgrades to the Dragonwing IQ9/IQ8/IQ6 SoCs introduced last year, offering faster cores, higher speed interfaces, and more. The IQ-X chips support up to 64GB LPDDR5x memory, UFS 4.0 and SD 3.0 storage, eDP and USB-C display interfaces, up to six cameras, PCIe Gen4 connectivity for optional Ethernet, WiFi 7, and 5G cellular connectivity, and feature eleven USB interfaces and 221 GPIOs. As industrial-grade parts, they are rated for -40°C to 105°C operation. Qualcomm DragonWing IQ-X7181 and IQ-X5181 specifications: CPU IQ-X5181 – Custom Qualcomm Oryon 8-core 64-bit Armv8 CPU clocked up to 3.4 GHz IQ-X7181 – Custom Qualcomm Oryon 12-core 64-bit Armv8 CPU clocked up to 3.4 GHz […]

Posted on by Jean-Luc Aufranc (CNXSoft) - No Comments on Advantech unveils NXP i.MX 95 SMARC 2.2 and OSM Size L system-on-modules

Advantech unveils NXP i.MX 95 SMARC 2.2 and OSM Size L system-on-modules

NXP i.MX 95 OSM system-on-module

Advantech has introduced two new NXP i.MX 95 system-on-modules: the AOM-5521, compliant with the SMARC 2.2 standard, and the solder-on AOM-2521 OSM Size L system-on-module. With up to six Arm Cortex-A55 cores running at up to 2.0 GHz, a dedicated 2 TOPS NPU, and up to 8GB LPDDR4/5 memory, the AOM-5521 and AOM-2521 modules target industrial automation, medical devices, intelligent vision systems, and other Edge AI and IoT applications. AOM-5521 SMARC 2.1 CPU module AOM-5521 specifications: SoC – NXP i.MX 95 CPU Up to 6x Arm Cortex-A55 application cores clocked at 2.0 GHz with 32K I-cache and D-cache, 64KB L2 cache, and 512KB L3 cache 1x Arm Cortex-M7 real-time core clocked at 800 MHz 1x Arm Cortex-M33 safety core clocked at 333 MHz GPU – Arm Mali-G310 V2 GPU for 2D/3D acceleration with support for OpenGL ES 3.2, Vulkan 1.2, OpenCL 3.0 VPU 4Kp30 H.265 and H.264 encode and decode […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 6 Comments on AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000 Series processors target industrial AI with 16 TOPS NPU

AMD Ryzen Embedded 8000

AMD has recently “announced” the Ryzen Embedded 8000 Series processors in a community post with the latest AMD embedded devices combining a 16 TOPS NPU based on the AMD XDNA architecture with CPU and GPU elements for a total of 39 TOPS designed for industrial artificial intelligence. The Ryzen Embedded 8000 CPUs will be found in machine vision, robotics, and industrial automation applications to enhance the quality control and inspection processes, enable real-time, route-planning decisions on-device for minimal latency, and predictive maintenance, and autonomous control of industrial processes. AMD Ryzen Embedded 8000 key features and shared specifications: CPU – Up to 8 “Zen 4” cores, 16 threads Cache L1 Instruction Cache – 32 KB, L1 Data Cache = 32 KB (per core) L2 Cache – Up to 8 MB (total) L3 Cache-  Up to 16 MB unified Graphics – RDNA 3 graphics with up to 6 WGPs (Work Group processors) […]

Posted on by Jean-Luc Aufranc (CNXSoft) - 7 Comments on AMD Ryzen Embedded 5000 Series CPUs show up in Micro-ATX motherboard

AMD Ryzen Embedded 5000 Series CPUs show up in Micro-ATX motherboard

AMD Ryzen Embedded 5000 Series motherboard

Advantech has announced the AIMB-522 industrial Micro-ATX motherboard with AMD Ryzen Embedded 5000 Series Zen3 processors for AI image processing in automation and surveillance applications. I had never heard about “Ryzen Embedded 5000 Series” processors, but that motherboard comes with a choice of new SKUs such as the 12-core Ryzen 5950E, the 10-core Ryzen 5900E, the 8-core Ryzen 5800E, and the 6-core Ryzen 5600E, as well as existing Ryzen 5000 desktop processors. AIMB-522 Micro-ATX motherboard specifications: Processor (one or the other) Ryzen 5950E 12-core processor @ up to 3.4 GHz with 64MB L3 cache; TDP: 105W Ryzen 5900E 10-core processor @ up to 3.7 GHz with 64MB L3 cache; TDP: 105W Ryzen 5800E 8-core processor @ up to 3.7 GHz with 32MB L3 cache; TDP: 100W Ryzen 5600E 6-core processor @ up to 3.6 GHz with 32MB L3 cache; TDP: 65W Ryzen 5950X 16-core processor @ up to 3.4 GHz […]