Inforce Introduces Snapdragon 660 & 845 Modules with On-Device AI

Inforce Computing has just launched two new pin-compatible system-on-modules, namely Inforce 6502 and Inforce 6701, powered by Qualcomm Snapdragon 660 & Snapdragon 845 SoC respectively. In their newsletter, the company claims those are their first modules with on-device AI capabilities with the Snapdragon 660 enabling “advanced visual computing, enhanced graphics and on-device machine learning capabilities”, while the more powerful Snapdragon 845 is better suited for “immersive multimedia experiences including optimized AI performance for a more responsive, power-efficient user- experience and capture of cinema-grade videos in [email protected] resolution.

Inforce 6502 Snapdragon 660 SoM

Inforce 6502

Specifications:

  • SoC – Qualcomm Snapdragon 660 with 8-core Kryo 260 processor, Adreno 512 GPU, Qualcomm Hexagon 680 DSP with Hexagon Vector eXtensions (HVX) for Caffe2 and Tensorflow
  • System Memory & Storage – 3GB LPDDR4, Dual-Channel + 32GB eMMC flash in single eMCP package
  • Connectivity
    • Bluetooth 5.0 + Wi-Fi 5 802.11ac 2×2 with MU-MIMO and Dual Band Simultaneous (DBS) via WCN3990 + 2x MHF4 connectors
    • GPS/ GLONASS location via SDR660G + 1x MHF4 connector
  • Multimedia – 4k30 encode/decode system
  • 2x 100-pin board-to-board connectors with:
    • Storage – SDIO V3.0 for SD card/microSD card on carrier board
    • Display I/F
      • DP Alternate Mode on USB-C for 4K-DCI @ 24fps display
      • 2x 4-lane MIPI-DSI lines with FullHD+ display capability
    • Camera I/F – 2x 4-lane MIPI-CSI camera interfaces with support for UltraHD video streaming and capture
    • Audio – 3x Mic In, 2x Line Out
    • USB – 1x USB 3.1 Gen2 type-C, and 1x USB 2.0 interfaces
    • 4x BLSPs for I2C/UART/SPI/GPIO
  • Supply Voltage – 3.3V
  • Dimensions – 50 x 28mm
  • Temperature Range – Commercial: 0°C to 70°C; extended: –25°C to 85°C

Inforce Computing SoM Board-to-Board Connectors

The company provides an Android 8+ BSP pre-loaded with Hexagon, SNPE (Snapdragon Neural Processing Engine) and OpenCV SDKs for the module, and is currently working on a Debian Linux BSP.

The optional SKU supporting extended operating temperature range also comes with EMI shielding for better RF noise protection, and for heat spreading and dissipation to improve performance.

Snapdragon 660 SoM Block Diagram
Blog Diagram – Click to Enlarge

Inforce 6701 Snapdragon 845 SoM

Inforce 6701 SoM

Specifications:

  • SoC – Qualcomm Snapdragon 845 with 8-core Kryo 385 processor @ up to 2.8 GHz / 1.8 GHz (Performance/efficiency clusters), Adreno 630 GPU, Qualcomm Hexagon 685 DSP with Hexagon Vector eXtensions (HVX), Spectra 280 camera ISP, and Qualcomm’s 3rd Gen AI Engine.
  • System Memory – 4GB LPDDR4, dual-channel
  • Storage – 64GB UFS flash
  • Connectivity
    • Bluetooth 5.0 + WiFi 5 802.11ac 2×2 with MU-MIMO and Dual Band Simultaneous (DBS) via WCN3990 + 2x MHF4 connectors
    • GPS/ GLONASS location via SDR845G + 1x MHF4 connector
  • Multimedia – Concurrent 10-bit 4k60 encode+decode system; WCD9340 audio codec
  • 2x or 3x 100-pin board-to-board connectors with
    • Storage – 2x SDIO V3.0 for SD card/microSD card on carrier board
    • Display I/F
      • DP Alternate Mode on USB-C for 4K-DCI @ 24fps display
      • 2x 4-lane MIPI-DSI interfaces
    • Camera I/F – 3x 4-lane MIPI-CSI camera interfaces with support for HEVC capture at 4K60
    • Audio – Analog and digital microphone inputs, multiple Line Out interfaces
    • USB – 2x USB 3.1 interfaces include once type-C
    • 2x PCIe via the third optional board-to-board connector
    • 4x BLSPs for I2C/UART/SPI/GPIO
  • Supply Voltage – 3.3V DC
  • Dimensions – 50 x 28mm
  • Temperature Range – Commercial: 0°C to 70°C; extended: –25°C to 85°C

Inforce 6701 SoM Connectors

Inforce provides an Android 9 BSP pre-loaded with Hexagon, SNPE, and OpenCV SDKs for the module, and they are also working on a Debian Linux BSP.

Again, the SKU supporting extended temperature range also comes with EMI shielding that also serves as a heat spreader.

Snapdragon 845 SoM Block Diagram
Block Diagram – Click to Enlarge

Reference Design & Development Kits

The company also provides reference design kits based on Inforce 6502 or 6701 system-on-module combined with ACC-1C20 carrier board.

ACC-1C20 Carrier Board
Click to Enlarge

The main features of the carrier board are as follows:

  • Support for Inforce 6502 or 6701 modules
  • Storage – MicroSD card socket
  • Video Output – MIPI DSI connector(s), DisplayPort via USB-C
  • Audio – 1x 3.5mm combo jack, audio header with multiple Mic In, Line Out, and digital mics
  • Camera I/F – 3x MIPI CSI connectors
  • USB – 1x USB 3.1/2.0 Type-A port, 1x USB 3.1 USB Type-C port
  • Expansion
    • I/O expansion header with BLSPs, GPIOs, PMIC rails
    • 2x PCIe header (for 6701 only)
  • Power Supply – DC jack, battery header
  • Dimensions – TBD

Plug-n-Play camera module accessories are also available for the board, as well as another IOC6601 mini ITX carrier board with all I/O exposed.

Inforce 6502 is available for $208 in single quantity, while Inforce 6701 starts at $285 without the PCIe board-to-board connector and $300 with. Respective development kits go for $500 and $600 respectively, and most items can be purchased online, except for extended temperature modules and modules with PCIe. You’ll find more details and purchase links on the product pages here and there.

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Jean-Luc Aufranc (CNXSoft)Diego Recent comment authors
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Looks interesting, however my SD660 “board” from Xiaomi is cheaper than this and includes many peripherals like i.e. a touch screen and CMOS sensors 😉