ADLINK LEC-RB5 – A Qualcomm QRB5165 SMARC module designed for drones and robots

ADLINK Technology LEC-RB5 is a SMARC compliant system-on-module powered by the Qualcomm QRB5165 octa-core Cortex-A77 class processor which we’ve already seen in Qualcomm Flight RB5 high-end drone reference design and Lantronix Open-Q 5165RB system-on-module designed for robotics applications.

The LEC-RB5 SMARC module ships with up to 8GB PoP LPDDR4 memory, 256GB UFS storage, provides on-device artificial intelligence capabilities (up to 15 TOPS), support for up to 6 cameras, and low power consumption. The main target applications are high-end robots and drones in the consumer, enterprise, defense, industrial, and logistics sectors.

LEC-RB5 SMARC SoM specifications:

  • SoC – Qualcomm QRB5165 octa-core Kryo 585 processor with a Kryo Gold Prime @ 2.84 GHz, 3x 3 Kryo Gold @ 2.42 GHz, 4x Kryo Silver @ 1.81 GHz, Adreno 650 GPU @ up to 587 MHz, Video decode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC, VC-1, WMV9, JPEG/MJPEG, VP8, VP9, video encode HW acceleration for H.265/HEVC, H.264, MPEG2, MVC
  • System Memory – 4 or 8 GB POP LPDDR4L-4266
  • Storage – 32, 64,128 or 256 GB UFS 2.1 or 3.0
  • Networking
    • 2x LAN7800 USB 3.0 to GbE chips
    • Wireless module with 802.11b/g/n/ac WiFi 5 2X2 MU-MIMO, Bluetooth 5.0
  • USB – On-module USB hub
  • Camera – 4x CSI interfaces on module
  • 314-pin MXM 3.0 connector
    • Storage – 4-bit SDIO compatible with SD/SDIO standard up to version 3.0
    • Display I/F – HDMI 2.0b up to 4Kp60, 4-lane MIPI up to “1Kp60” with 24-bit RGB
    • Camera I/F – 2x CSI interfaces
    • Audio – I2S or SWD audio codec located on carrier
    • Networking – 2x Gigabit Ethernet
    • USB – 2x USB 3.0, 4x USB 2.0
    • Serial
      • 3x UART interfaces (2x CTS/RTS, 1x TX/RX/CTS/RTS)
      • 1x CAN2.0B only or mixed CAN2.0B and CAN FD mode, data bit rate up to 8 Mbps
    • 2x SPI, 3x I2C, 14x GPIO with interrupt, 1x GPIO with PWM
    • PCIe – 2x PCIe x2 Gen3
  • Security
    • Qualcomm Secure Processing Unit
    • TPM 2.0 module
  • Debugging
    • 30-pin multipurpose flat cable connector for use with optional DB-30 debug module with JTAG, BMC access
    • UART, power testpoints, diagnostic LEDs, Power, Reset, Boot configuration
  • Misc – SEMA Board Controller: Voltage/Current monitoring, Power Sequencing, Logistics and Forensic Information, I²C Bus Control, GPIO Control, Watchdog Timer
  • Supply Voltage – 5V DC +/- 5%
  • Power consumption – <12W
  • Dimensions – 82 x 50mm (SGET SMARC Specifications 2.1)
  • Temperature Range
    • Standard: 0°C to +60°C
    • Rugged: -20°C to +85°C (optional)
  • Humidity
    • Operating: 5-90% RH
    • Operating with conformal coating or storage: 5-95% RH
  • Shock and Vibration – IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202 F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
  • HALT – Thermal Stress, Vibration Stress, Thermal Shock and Combined Test
LEC-RB5 block diagram

ADLINK offers support for Ubuntu and Yocto Linux, as well as the “LEC-RB5 DevKit” with 4GB LPDDR4 memory, 64GB UFS storage, and an AC/DC power adapter. I think it’s the first time I see a SMARC module with built-in MIPI CSI connectors soldered on the device, instead of being available via the MXM edge connector. The LEC-RB5 is quite larger than the Lantronix Open-Q 5165RB (50 x 29 mm) module but for applications relying on four cameras, the complete system may not be much larger or heavier since the carrier board does not need to handle the camera part.

ADLINK LEC-RB5 SMARC module with Qualcomm QRB5165 is most likely not available just yet, as everything is shown as being “Preliminary”. Visit the product page for further details.

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