Linux powered STMicro STM32MP1 Solder-down QFN-Style SoM Measures 27x27mm

STMicro STM32MP1 Cortex A7/M4 processor was launched last year with support for Linux and Android. Since then we’ve seen a few STM32MP1 SBC‘s, development kit and modules,  with some of the latter really compact with DHCOR STM32MP157 SoM found on Avenger96 board measuring just 29x29mm.

Direct Insight has now unveiled QFN-style solder-down QSMP systems-on-module based on STM32MP1 that measure just 27 x 27 x 2.3mm and manufactured in Germany by Ka-Ro Electronics.

STM32MP1 Solder-down QSMP SoM
Click to Enlarge

Direct Insight / Ka-Ro STM32MP1 QSMP modules specifications:

  • SoC
    • QSMP-1510 module – STMicro STM32MP151A single-core Cortex-A7 processor up to 650 Mhz, plus Arm Cortex-M4 real-time core up to 200 MHz
    • QSMP-1530 module – STMicro STM32MP153A dual-core Cortex -A7 processor up to 650 MHz, plus Arm Cortex-M4 real-time core up to 200 MHz
    • QSMP-1570 module – STM32MP157C dual-core Cortex -A7 processor up to 650 MHz, plus Arm Cortex-M4 real-time core up to 200 MHz and Vivante 3D GPU with OpenGL ES 2.0 support
  • System memory & Storage
    • QSMP-1510 – 256MB RAM and 128MB SLC NAND flash
    • QSMP-1530 – 256MB and 4GB eMMC flash
    • QSMP-1570 – 512MB RAM and 4GB eMMC flash
  • 100 pads around the module with 1mm pitch:
    • Display Interface – 24-bit RGB;  QSMP-1570 adds 2-lane MIPI-DSI
    • Gigabit Ethernet
    • USB 2.0
    • QSMP-1530/-1570 – 2x FD-CAN 2x FD-CAN
  • Security -Trustzone, SHA-256, MD5, HMAC, etc.. QSMP-1570 only: Secure Boot and HW cryptography for AES-256 and TDES
  • Supply Voltage – 3.3V
  • Dimensions – 27 x 27 x 2.3 mm
  • Temperature Range
    • SQMP-1510 (NAND): -40°C to 85°C
    • SQMP-1530-1570 (eMMC): -25°C to 85°C

QFN-style SoM

The base of the module functions as both a ground pad and a thermal conductor. The large solder pad underneath is also used to
hold the component at a defined height during soldering,
without the solder being compressed by the weight. The company claims the module is suitable for 2-layer baseboards. Details about soldering and baseboard layout guidelines can be found in the datasheet.

The QSMP module is said to come with a dedicated development system and a Linux BSP. The development kit includes a QSMP-1570 module with dual-core ST32M157C processor, 512MB RAM and 4GB eMMC, an RGB connector for a touch screen, as SD Card socket, as well as Gigabit Ethernet and USB host ports.

QSMP Solder-down SoM Development Kit
Click to Enlarge

You’ll also find a debug UART port, and all 100 module pins are brought to a 2.54 mm solder pads.

The module and development kit are available now, but pricing has not been made public, and instead, you’re being asked to ask for a quote on the product page. As a side note, you may see some reference to “STMicro ST32M1” and “ST32M151A, ST32M153A, ST32M157C” in the aforelinked page and some news sites, but there aren’t any new “ST32” processors, those are just typos…

Via EENews

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