OSD62x SiP combines TI AM62x processor with LPDDR4, EEPROM, PMIC, and passives into a single package

Octavo Systems OSD62x is a system-in-package (SiP) combining the Texas Instruments AM62x processor with LPDDR4 RAM, EEPROM, power management, oscillators, and passive components, plus optional features such as an RTC and an 8-channel ADC.

At least that’s true for the OSD62x Max Integration SiP (22×22 mm BGA), but Octavo Systems also have a smaller 14x9mm package called the OSD62x Size Optimized with “just’ the AM62x processor, LPDDR4 memory, and passive components.

OSD62x system-in-package

OSD62x “Max Integration” specifications:

  • SoC – Texas Instruments AM62x (AM623/AM625)
    • CPU – Up to 4x Arm Cortex-A53 @ 1.4GHz
    • MCU – Arm Cortex-M4F
    • GPU – 3D graphics up to 2048×1080 @ 60 fps (AM625 only)
    • Storage I/F – 1x eMMC, 2x SDIO, 1x GPMC
    • Display I/F – 24-bit RGB MIPI DPI and OLDI/LVDS
    • Camera I/F – 1x MIPI CSI-2 with DPHY 1.2
    • Networking – 2x 10/100/1000M Gigabit Ethernet with TSN support
    • USB – 2x USB 2.0 interfaces
    • PRU-ICSS
    • Other peripherals
      • 9x UART, 5x SPI, 6x I2C, 3x McASP
      • 3x ePWM, 3x eQEP, 3x eCAP
      • 3x CAN-FD
  • System Memory – LPDDR4 in package
  • Storage – 4KB EEPROM
  • Oscillators and passive components
  • Power Management
    • TPS65219 Power Management IC
    • Single Power In – Generates all required power rails and sequencing
  • Package – 22 x 22mm BGA w/ 1mm Ball pitch
  • Optional Integrations
    • 8-Channel ADC
    • Real-Time Clock (RTC)
    • FPGA/CPLD
    • WiFi/BLE

OSD62x Size Optimized SiP

The OSD62x Size Optimized is just a smaller package without EEPROM, oscillators, PMIC, and the ability to add optional integrations:

  • SoC – Texas Instruments AM62x (AM623/AM625) as described above
  • System Memory – LPDDR4 in package
  • Passive components
  • Package – 14 x 9mm BGA w/ 0.5mm Ball pitch

Octavo Systems says the OSD62x can be used for HMI, industrial control, IoT gateway, AI at the edge, and other low-power high-performance applications. Besides being useful to space-constrained designs, the SiP may also speed up time-to-market since all the high-speed circuitry around the processor is already taken care of.

Software support will be the same as if you were directly using the Texas Instruments AM623 or AM625, meaning Linux and Android (AM625 with GPU only) operating systems. I could not find an evaluation board for the OSD62x, but that’s probably because the OSD62x devices are currently in development and will only be sampling in Q4 2023. Additional information may be found on the product page. The company has plenty of experience doing this type of system-in-package, and we first covered them in 2016 with the OSD3358 SiP featured in a BeagleBone Black lookalike, and over the years that also created SiPs with other TI processors, STM32MP1 MPU and AMD Zynq UltraScale+ MPSoC.

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