Intrinsyc Unveils Open-Q 845 µSOM and Snapdragon 845 Mini-ITX Development Kit

Intrinsyc introduced the first Qualcomm Snapdragon 845 hardware development platform last year with its Open-Q 845 HDK designed for OEMs and device makers.

But the company has now just announced a solution for embedded systems and Internet of Things (IoT) products with Open-Q 845 micro system-on-module (µSOM) powered by the Snapdragon 845 octa-core processor, as well as a complete development kit featuring the module and a Mini-ITX baseboard.

Open-Q845 µSOM

Open-Q 845 uSOM

Specifications:

  • SoC – Qualcomm Snapdragon SDA845 octa-core processor with 4x Kryo 385 Gold cores @ 2.649GHz + 4x Kryo 385 Silver low-power cores @ 1.766GHz cores, Hexagon  685 DSP, Adreno 630 GPU with OpenGL ES 3.2 + AEP (Android Extension Pack),  DX next, Vulkan 2, OpenCL 2.0 full profile
  • System Memory – 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
  • Storage – 32GB or 64GB UFS Flash Storage
  • Connectivity
    • Wi-Fi 5 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector
    • Bluetooth 5.x
  • Audio & Video Features
    • Qualcomm Spectra 280 ISP – 16 +16 + 2 MP sensor resolution
      32MP 30fps ZSL with dual ISP; 16 MP 30 ZSL with a single ISP
      Video
    • Encode – 4K60 for H.264/H.265, 4K30 for VP8; support for HDR 10-bit capture (HLG)
    • Decode – 4K60 H.264/H.265/VP9; Support for HDR 10-bit video playback (HLG, HDR10)
  • 3x 100-pin board-to-board connectors with
    • Display Interfaces
      • 2x 4-lane MIPI DSI D-PHY 1.2, up to 3840 × 2400 10-bit 60 fps
      • DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency
    • Camera Interfaces – 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI
    • Audio Interfaces
      • Support for external WCD9340 codec and WSA8810/WSA8815 speaker amps
      • 1x SLIMBus interface for external Qualcomm Codecs
      • 1x 4-lane MI2S interface + 2x 2-lane MI2S interfaces (muxed with SLIMBus) for other external audio devices
    • USB – 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB data concurrency, 1x USB 3.1
    • 1x PCIe Gen3 1-lane
    • 4-bit SD 3.0
    • UART, I2C, SPI, configurable GPIOs
    • Sensor Core Interfaces – SPI, I2C, GPIO connections to sensor core DSP
  • Power Supply
    • Qualcomm PM845 + PM8998 + PM8005 PMICs
    • Input voltage – 3.5V to 4.7V
  • Dimensions – 50mm x 25mm
  • Operating Temperature – -25°C to +70°C

micro SOM board-to-board connectors

The mobile development kit launched last year would only support Android 8 Oreo, but this would not cut it for the embedded space, so the module supports Android 9 Pie and a Linux OS based on Yocto Rocko both with Linux 4.9 kernel.

Target applications include VR/XR platforms with 6DoF and SLAM, robotics and drone products, premium camera platforms with cinema-grade video, on-device artificial intelligence & machine learning, advanced graphics and 3D gaming, multi-camera systems, and machine vision platforms.

Open-Q 845 µSOM Development Kit

Open-Q 845 µSOM Development KitIn order to allow their custom to start development as soon as possible and/or quickly evaluated the solution, Intrinsyc is also working on a development kit for the module that includes option display & camera, as well as a baseboard with the following key features:

  • SoM Support -Open-Q 845 µSOM described above
  • Storage – MicroSD card socket
  • Video Output
    • DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency
    • 2x 4 lane MIPI DSI connector for optional LCD / Touch panel accessory or custom display adapters
  • Camera Interfaces – 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI connectors to mate to optional camera accessories
  • Wireless – Dual Wi-Fi/BT PCB antennas on carrier board
  • Audio
    • Qualcomm WCD9340 Hi-Fi audio codec module
    • 3.5mm headset jack (stereo out + mic in)
    • Analog output header, Analog input header, digital I/O header (SLIMBus/I2S/PDM)
  • USB – 1x USB3.1 Type-C port, 1x USB 3.1 Type-A host port
  • Expansion
    • 1x PCIe Gen3 1-laneI
    • I/O expansion headers with UART, I2C, SPI, configurable GPIOs
  • Power Supply – 12V/3A or single-cell Li-Ion battery
  • Dimensions – 170 x 170mm (Mini-ITX form factor)

Both the Open-Q 845 μSOM and Open-Q 845 μSOM development kit are scheduled to launch in Q4 2019 at a yet-to-be-disclosed price.  You may find more details on the product pages for the module and devkit.

It’s worth noting that Open-Q 845 μSOM is not the first Snapdragon 845 system-on-module, as we’ve previously covered Inforce 6701 Snapdragon 845 SoM and TurboX-845 module found in Qualcomm Robotics RB3 Development Platform.

Via LinuxGizmos

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Mike
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Mike

Why do companies announce things before they can even figure out a price?

Dylan Skilling
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Dylan Skilling

Simples — to generate interest in the product and thus stimulate the desire of consumers to buy the product before the consumer knows how much it will cost, When the prices is finally revealed the consumer either thinks the price is pretty good or not so bad, and if it is rather expensive, they will still have such a strong desire to purchase (after waiting all that time) they will buy it anyway.

The problem is that if the product takes too long to become available for purchase, some other corporation may have started selling a similar or better product at a reasonable price.

Jon Smirl
Member

Because they are charging different prices depending on where the board is sold and who is buying it. And they don’t want to the people paying the high prices to find out about the low ones and then pay that price. Old joke from long ago was that the price is $300 plus whatever the salesman can get for his commission.