Intrinsyc Unveils Open-Q 845 µSOM and Snapdragon 845 Mini-ITX Development Kit

Intrinsyc introduced the first Qualcomm Snapdragon 845 hardware development platform last year with its Open-Q 845 HDK designed for OEMs and device makers.

But the company has now just announced a solution for embedded systems and Internet of Things (IoT) products with Open-Q 845 micro system-on-module (µSOM) powered by the Snapdragon 845 octa-core processor, as well as a complete development kit featuring the module and a Mini-ITX baseboard.

Open-Q845 µSOM


  • SoC – Qualcomm Snapdragon SDA845 octa-core processor with 4x Kryo 385 Gold cores @ 2.649GHz + 4x Kryo 385 Silver low-power cores @ 1.766GHz cores, Hexagon  685 DSP, Adreno 630 GPU with OpenGL ES 3.2 + AEP (Android Extension Pack),  DX next, Vulkan 2, OpenCL 2.0 full profile
  • System Memory – 4GB or 6GB dual-channel high-speed LPDDR4X SDRAM at 1866MHz
  • Storage – 32GB or 64GB UFS Flash Storage
  • Connectivity
    • Wi-Fi 5 802.11a/b/g/n/ac 2.4/5Ghz 2×2 MU-MIMO (WCN3990) with 5 GHz external PA & U.FL antenna connector
    • Bluetooth 5.x
  • Audio & Video Features
    • Qualcomm Spectra 280 ISP – 16 +16 + 2 MP sensor resolution
      32MP 30fps ZSL with dual ISP; 16 MP 30 ZSL with a single ISP
    • Encode – 4K60 for H.264/H.265, 4K30 for VP8; support for HDR 10-bit capture (HLG)
    • Decode – 4K60 H.264/H.265/VP9; Support for HDR 10-bit video playback (HLG, HDR10)
  • 3x 100-pin board-to-board connectors with
    • Display Interfaces
      • 2x 4-lane MIPI DSI D-PHY 1.2, up to 3840 × 2400 10-bit 60 fps
      • DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency
    • Camera Interfaces – 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI
    • Audio Interfaces
      • Support for external WCD9340 codec and WSA8810/WSA8815 speaker amps
      • 1x SLIMBus interface for external Qualcomm Codecs
      • 1x 4-lane MI2S interface + 2x 2-lane MI2S interfaces (muxed with SLIMBus) for other external audio devices
    • USB – 1x USB3.1 with support for Type-C + DisplayPort v1.4 with USB data concurrency, 1x USB 3.1
    • 1x PCIe Gen3 1-lane
    • 4-bit SD 3.0
    • UART, I2C, SPI, configurable GPIOs
    • Sensor Core Interfaces – SPI, I2C, GPIO connections to sensor core DSP
  • Power Supply
    • Qualcomm PM845 + PM8998 + PM8005 PMICs
    • Input voltage – 3.5V to 4.7V
  • Dimensions – 50mm x 25mm
  • Operating Temperature – -25°C to +70°C

The mobile development kit launched last year would only support Android 8 Oreo, but this would not cut it for the embedded space, so the module supports Android 9 Pie and a Linux OS based on Yocto Rocko both with Linux 4.9 kernel.

Target applications include VR/XR platforms with 6DoF and SLAM, robotics and drone products, premium camera platforms with cinema-grade video, on-device artificial intelligence & machine learning, advanced graphics and 3D gaming, multi-camera systems, and machine vision platforms.

Open-Q 845 µSOM Development Kit

Open-Q 845 µSOM Development KitIn order to allow their custom to start development as soon as possible and/or quickly evaluated the solution, Intrinsyc is also working on a development kit for the module that includes option display & camera, as well as a baseboard with the following key features:

  • SoM Support -Open-Q 845 µSOM described above
  • Storage – MicroSD card socket
  • Video Output
    • DisplayPort v1.4 on USB Type-C, up to 4K60 with USB data concurrency
    • 2x 4 lane MIPI DSI connector for optional LCD / Touch panel accessory or custom display adapters
  • Camera Interfaces – 3x 4-lane MIPI CSI + 1x 2-lane MIPI CSI connectors to mate to optional camera accessories
  • Wireless – Dual Wi-Fi/BT PCB antennas on carrier board
  • Audio
    • Qualcomm WCD9340 Hi-Fi audio codec module
    • 3.5mm headset jack (stereo out + mic in)
    • Analog output header, Analog input header, digital I/O header (SLIMBus/I2S/PDM)
  • USB – 1x USB3.1 Type-C port, 1x USB 3.1 Type-A host port
  • Expansion
    • 1x PCIe Gen3 1-laneI
    • I/O expansion headers with UART, I2C, SPI, configurable GPIOs
  • Power Supply – 12V/3A or single-cell Li-Ion battery
  • Dimensions – 170 x 170mm (Mini-ITX form factor)

Both the Open-Q 845 μSOM and Open-Q 845 μSOM development kit are scheduled to launch in Q4 2019 at a yet-to-be-disclosed price.  You may find more details on the product pages for the module and devkit.

It’s worth noting that Open-Q 845 μSOM is not the first Snapdragon 845 system-on-module, as we’ve previously covered Inforce 6701 Snapdragon 845 SoM and TurboX-845 module found in Qualcomm Robotics RB3 Development Platform.

Via LinuxGizmos

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